Direct wafer bonding is considered as one of the most promising approaches for 3D IC applications [1]. It refers to a process by which two mirror-polished wafers are put into contact and held together at room temperat...
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Direct wafer bonding is considered as one of the most promising approaches for 3D IC applications [1]. It refers to a process by which two mirror-polished wafers are put into contact and held together at room temperature by adhesive forces, without any additional materials [2]. Direct wafer bonding can be achieved in clean room at room temperature with ambient air, without any pressure and without any adhesive materials, and the process can be feasible at industrial scale as demonstrated in the silicon-on-insulator mass production [3]. High bond strength and void-free bonding interface are required in order to provide reliable and high-performance devices. Whatever the material nature, wafer surfaces have to be contamination free (particle and organic) and smooth enough to adhere to each other [4]. Before bonding, wafers are submitted to CMP process that results in the presence of slurry particles and organic contamination at copper surface. For this reason, the performances of post-CMP cleaning process and solutions, and their ability to remove the contamination without generating defects are mandatory. Based on a wide knowledge of CMP and cleaning solutions design, a new generation of post-CMP cleaning chemistries has been developed in recent years to meet the very stringent requirements of Cu-Cu direct bonding surfaces. This paper reports the results of a comparative study between two generations of copper post-CMP cleaning solutions. The main differences in electrochemical behavior, surface morphology and subsequent direct bonding performances of copper wafers cleaned with these solutions are detailed. Keywords: Direct bonding, cleaning solutions, EIS, surface morphology.
Presents a collection of slides covering the following topics: smart metering security;risk management approach;command and control security risk;technology security risk;information security risk;and risk assessment.
ISBN:
(纸本)9781849192538
Presents a collection of slides covering the following topics: smart metering security;risk management approach;command and control security risk;technology security risk;information security risk;and risk assessment.
The authors studied the strain of carbon specimens and sodium adsorption in electrolysis of sodium chloride and fluoride, barium, strontium and calcium chlorides. Barium reacts readily with carbon and graphite materia...
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ISBN:
(纸本)0895204886
The authors studied the strain of carbon specimens and sodium adsorption in electrolysis of sodium chloride and fluoride, barium, strontium and calcium chlorides. Barium reacts readily with carbon and graphite materials, but strontium and calcium do not. The magnitude of adsorption of sodium is proportional to the specific area of carbon. The lower the ionization potential, the more intense the interaction.
In order to promote the efficiency and the supervisory of the heat supply systems in the north of China, a new intelligent central heating supervision and control system for heat supply station was proposed and design...
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ISBN:
(纸本)1424400600
In order to promote the efficiency and the supervisory of the heat supply systems in the north of China, a new intelligent central heating supervision and control system for heat supply station was proposed and designed. The proposed system consists of the intellectualized distributed data acquisition system based on the CAN (Control Area Network) bus with multi-channel and multi-function, the high accuracy embedded controller with HMI (Humane Machine Interface) which supported by the high resolution LCD (Liquid Crystal Display) and the ability of wireless communication via GPRS. The feedforward-feedback (fuzzy PID) control was taken as the control scheme of the proposed system. Also, the hardware of the whole system and the software of the control slave node are described in detail. The practical application shows that the system can enhance the advantage of the central heat supply system and has a very high practicality value.
For distributed real-time systems, adequate profiling tools are exceedingly rare. The sheer variety and low-level nature of these systems impede the adoption of standard, general-purpose tools for performance analysis...
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ISBN:
(纸本)076952561X
For distributed real-time systems, adequate profiling tools are exceedingly rare. The sheer variety and low-level nature of these systems impede the adoption of standard, general-purpose tools for performance analysis and visualization. Although much research has been devoted to profiling parallel clusters and supercomputers, the literature virtually ignores the real-time domain. Correspondingly, a handful of commercial tools is available for profiling realtime software, but they invariably make a single-node assumption and are unable to cope with distributed environments. We examine the state of performance analysis and discuss why profilers are conspicuously absent in the field of distributed real-time systems. We then explore how developers of these systems could benefit from graphical profiling tools with automatic instrumentation and data collection. Toward that end, we demonstrate the prototype of a performance visualization tool called "Bacara," the second addition to our suite of tools for Visual Analysis of Distributed Real-time systems, or VADR (va'dar).
This research aimed to study surface modification of oil palm empty fruit bunch (OPEFB) and use it as reinforced fibres in PLA. Surface modification of OPEFB fibres was applied to enhance the interphase adhesion betwe...
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ISBN:
(纸本)9781632660756
This research aimed to study surface modification of oil palm empty fruit bunch (OPEFB) and use it as reinforced fibres in PLA. Surface modification of OPEFB fibres was applied to enhance the interphase adhesion between the fibres and PLA matrix. The OPEFB fibres were pre-treated by mercerization process. Compositions and thermal stability of the fibres were studied using FTIR and TGA techniques, respectively. The pre-treatment resulted in the removal of non-cellulosic components. Moreover, an acetylation of OPEFB cellulose fibres by acetic anhydride was conducted under a solvent-free condition at room temperature. The acetylation reaction was catalyzed by iodine. The degree of substitution observed by solid state 13C CP/MAS NMR depended upon reaction time and molar ratio of OPEFB cellulose and acetic anhydride. Crystalline structure and morphology of the acetylated fibres were investigated using WAXD and SEM, respectively. The maleic anhydride-treated PLA has been prepared and used as a compatibilizer in OPEFB and PLA composite. The mechanical properties of the PLA filled with the modified fibres increased, compared to the PLA filled with the untreated fibres.
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