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检索条件"机构=†Materials Science and Engineering Program"
5656 条 记 录,以下是311-320 订阅
排序:
Design of Mixed-Dimensional QDs/MoS2/TiO2 Heterostructured Resistive Random-Access Memory with Interfacial Analog Switching Characteristics for Potential Neuromorphic Computing
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ACS Applied Electronic materials 2024年 第3期6卷 1581-1589页
作者: Tang, Shin-Yi Shih, Yu-Chuan Shen, Ying-Chun Cyu, Ruei-Hong Chen, Chieh-Ting Yang, Tzu-Yi Chaudhary, Mayur Peng, Yu-Ren Kuo, Yao-Ren Miao, Wen-Chien Yu, Yi-Jen Lee, Ling Kuo, Hao-Chung Chueh, Yu-Lun Department of Materials Science and Engineering National Tsing Hua University Hsinchu30013 Taiwan College of Semiconductor Research National Tsing Hua University Hsinchu30013 Taiwan Semiconductor Research Center Hon Hai Research Institute Taipei11492 Taiwan Ph. D. Program in Prospective Functional Materials Industry National Tsing Hua University Hsinchu30013 Taiwan Department of Electrophysics College of Science National Yang Ming Chiao Tung University Hsinchu30010 Taiwan Instrument Center National Tsing Hua University Hsinchu30013 Taiwan Department of Photonics Institute of Electro-Optical Engineering National Yang-Ming Chiao Tung University Hsinchu30010 Taiwan Department of Physics National Sun Yat-Sen University Kaohsiung80424 Taiwan Department of Materials Science and Engineering Korea University Seoul02841 Korea Republic of
Resistive random-access memory (RRAM) is one of the most promising candidates for next-generation nanoscale nonvolatile memory devices and neuromorphic computing applications. In this study, we developed a novel mixed... 详细信息
来源: 评论
Technology Roadmap for Flexible Sensors
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ACS NANO 2023年 第6期17卷 5211-5295页
作者: Luo, Yifei Abidian, Mohammad Reza Ahn, Jong-Hyun Akinwande, Deji Andrews, Anne M. Antonietti, Markus Bao, Zhenan Berggren, Magnus Berkey, Christopher A. Bettinger, Christopher John Chen, Jun Chen, Peng Cheng, Wenlong Cheng, Xu Choi, Seon-Jin Chortos, Alex Dagdeviren, Canan Dauskardt, Reinhold H. Di, Chong-an Dickey, Michael D. Duan, Xiangfeng Facchetti, Antonio Fan, Zhiyong Fang, Yin Feng, Jianyou Feng, Xue Gao, Huajian Gao, Wei Gong, Xiwen Guo, Chuan Fei Guo, Xiaojun Hartel, Martin C. He, Zihan Ho, John S. Hu, Youfan Huang, Qiyao Huang, Yu Huo, Fengwei Hussain, Muhammad M. Javey, Ali Jeong, Unyong Jiang, Chen Jiang, Xingyu Kang, Jiheong Karnaushenko, Daniil Khademhosseini, Ali Kim, Dae-Hyeong Kim, Il-Doo Kireev, Dmitry Kong, Lingxuan Lee, Chengkuo Lee, Nae-Eung Lee, Pooi See Lee, Tae-Woo Li, Fengyu Li, Jinxing Liang, Cuiyuan Lim, Chwee Teck Lin, Yuanjing Lipomi, Darren J. Liu, Jia Liu, Kai Liu, Nan Liu, Ren Liu, Yuxin Liu, Yuxuan Liu, Zhiyuan Liu, Zhuangjian Loh, Xian Jun Lu, Nanshu Lv, Zhisheng Magdassi, Shlomo Malliaras, George G. Matsuhisa, Naoji Nathan, Arokia Niu, Simiao Pan, Jieming Pang, Changhyun Pei, Qibing Peng, Huisheng Qi, Dianpeng Ren, Huaying Rogers, John A. Rowe, Aaron Schmidt, Oliver G. Sekitani, Tsuyoshi Seo, Dae-Gyo Shen, Guozhen Sheng, Xing Shi, Qiongfeng Someya, Takao Song, Yanlin Stavrinidou, Eleni Su, Meng Sun, Xuemei Takei, Kuniharu Tao, Xiao-Ming Tee, Benjamin C. K. Thean, Aaron Voon-Yew Trung, Tran Quang Wan, Changjin Wang, Huiliang Wang, Joseph Wang, Ming Wang, Sihong Wang, Ting Wang, Zhong Lin Weiss, Paul S. Wen, Hanqi Xu, Sheng Xu, Tailin Yan, Hongping Yan, Xuzhou Yang, Hui Yang, Le Yang, Shuaijian Yin, Lan Yu, Cunjiang Yu, Guihua Yu, Jing Yu, Shu-Hong Yu, Xinge Zamburg, Evgeny Zhang, Haixia Zhang, Xiangyu Zhang, Xiaosheng Zhang, Xueji Zhang, Yihui Zhang, Yu Zhao, Siyuan Zhao, Xuanhe Zheng, Yuanjin Zheng, Yu-Qing Zheng, Zijian Zhou, Tao Zhu, Bowen Zhu, Ming Zhu, Rong Zhu, Yangzhi Zhu, Yong Zou, Guijin Chen, Xiaodong 08-03 Innovis Singapore 138634 Republic of Singapore Innovative Centre for Flexible Devices (iFLEX) School of Materials Science and Engineering Nanyang Technological University Singapore 639798 Singapore Department of Biomedical Engineering University of Houston Houston Texas 77024 United States School of Electrical and Electronic Engineering Yonsei University Seoul 03722 Republic of Korea Department of Electrical and Computer Engineering The University of Texas at Austin Austin Texas 78712 United States Microelectronics Research Center The University of Texas at Austin Austin Texas 78758 United States Department of Chemistry and Biochemistry California NanoSystems Institute and Department of Psychiatry and Biobehavioral Sciences Semel Institute for Neuroscience and Human Behavior and Hatos Center for Neuropharmacology University of California Los Angeles Los Angeles California 90095 United States Colloid Chemistry Department Max Planck Institute of Colloids and Interfaces 14476 Potsdam Germany Department of Chemical Engineering Stanford University Stanford California 94305 United States Laboratory of Organic Electronics Department of Science and Technology Campus Norrköping Linköping University 83 Linköping Sweden Wallenberg Initiative Materials Science for Sustainability (WISE) and Wallenberg Wood Science Center (WWSC) SE-100 44 Stockholm Sweden Department of Materials Science and Engineering Stanford University Stanford California 94301 United States Department of Biomedical Engineering and Department of Materials Science and Engineering Carnegie Mellon University Pittsburgh Pennsylvania 15213 United States Department of Bioengineering University of California Los Angeles Los Angeles California 90095 United States School of Chemistry Chemical Engineering and Biotechnology Nanyang Technological University Singapore 637457 Singapore Nanobionics Group Department of Chemical and Biological Engineering Monash University Clayton Australia 3800 Monash
Humans rely increasingly on sensors to address grand challenges and to improve quality of life in the era of digitalization and big data. For ubiquitous sensing, flexible sensors are developed to overcome the limitati... 详细信息
来源: 评论
Two-Layer High-Throughput:Effective Mass Calculations Including Warping
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engineering 2022年 第3期8卷 74-80页
作者: Andrew Supka Nicholas A.Mecholsky Marco Buongiorno Nardelli Stefano Curtarolo Marco Fornari Department of Physics&Science of Advanced Materials Program Central Michigan UniversityMount PleasantMI 48859USA Department of Physics&Vitreous State Laboratory The Catholic University of AmericaWashingtonDC 20064USA Department of Physics&Department of Chemistry University of North TexasDentonTX 76203USA Center for Autonomous Materials Design Duke UniversityDurhamNC 27708USA Department of Mechanical Engineering and Materials Science Duke UniversityDurhamNC 27708USA
In this paper,we perform two-layer high-throughput *** the first layer,which involves changing the crystal structure and/or chemical composition,we analyze selected Ⅲ-Ⅴ semiconductors,filled and unfilled skutterudit... 详细信息
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Wave propagation in meta-sandwich beams  16
Wave propagation in meta-sandwich beams
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Health Monitoring of Structural and Biological Systems XVI 2022
作者: Joubaneh, Eshagh Farzaneh Ma, Jihong Department of Mechanical Engineering University of Vermont BurlingtonVT05405 United States Materials Science Program University of Vermont BurlingtonVT05405 United States
Acoustoelastic metamaterials are widely used as composite cores in sandwich beams. However, discussions on the application of metamaterials in face sheets have been sporadic. In this work, we parametrically explore th... 详细信息
来源: 评论
Diffractive Imaging of Transient Electronic Coherences in Molecules with Electron Vortices
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Physical Review Letters 2025年 第7期134卷 073001-073001页
作者: Haowei Wu Haiwang Yong Department of Chemistry and Biochemistry University of California San Diego La Jolla California 92093 USA Program in Materials Science and Engineering University of California San Diego La Jolla California 92093 USA
Direct imaging of transient electronic coherences in molecules has been challenging, with the potential to control electron motions and influence reaction outcomes. We propose a novel time-resolved vortex electron dif... 详细信息
来源: 评论
Creep-recovery deformation of 304 stainless-steel springs under low forces
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Mechanics of materials 2024年 193卷
作者: Tsai, Ming-Yen Chang, Shou-Yi Zhang, Yulin Yang, Fuqian Lee, Sanboh Department of Materials Science and Engineering National Tsing Hua University Hsinchu300 Taiwan Chongqing Institute of Green and Intelligent Technology Chinese Academy of Sciences Chongqing400714 China Materials Program Department of Chemical and Materials Engineering University of Kentucky LexingtonKY40506 United States
The deformation behavior of materials at high temperatures determines the structural stability of mechanical structures under high-temperature service conditions. In this work, we prepare helical springs from 304 stai... 详细信息
来源: 评论
Insights into the Structural and Thermodynamic Instability of Ni-Rich NMC Cathode
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ACS Sustainable Chemistry and engineering 2023年 第18期11卷 6978-6987页
作者: Tran, Ngoc Thanh Thuy Lin, Che-An Lin, Shih-Kang Research Center National Cheng Kung University Tainan701 Taiwan Department of Materials Science and Engineering National Cheng Kung University Tainan701 Taiwan Program on Smart and Sustainable Manufacturing Academy of Innovative Semiconductor and Sustainable Manufacturing National Cheng Kung University Tainan70101 Taiwan
The Ni-rich LiNi1-x-yMnxCoyO2 (NMC) layered oxides have been promising materials to replace the LiCoO2 commercial cathode due to their high operation voltages, low cost, and enhanced capacity. However, structural inst... 详细信息
来源: 评论
Correlation between the Morphology of Carbon Nanofibers and the Transport Characteristics of Li-Ions in a Lib Anode Under Fast Charging Conditions
SSRN
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SSRN 2023年
作者: Cho, Hang In Lee, Sung Hoon Park, Chong Rae WCU Hybrid Materials Program Department of Materials Science and Engineering Research Institute of Advanced Materials Seoul National University Seoul08826 Korea Republic of
Energy storage materials for electric vehicles and energy storage systems must be able to supply high capacity quickly, which requires efficient Li-ion transport within the anode active material. The transport of Li i... 详细信息
来源: 评论
Optimising degradation and mechanical performance of additively manufactured biodegradable Fe–Mn scaffolds using design strategies based on triply periodic minimal surfaces
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Smart materials in Medicine 2024年 第1期5卷 127-139页
作者: Dargusch, Matthew S. Soro, Nicolas Demir, Ali Gokhan Venezuela, Jeffrey Sun, Qiang Wang, Yuan Abdal-hay, Abdalla Alali, Aya Q. Ivanovski, Saso Previtali, Barbara Kent, Damon School of Mechanical and Mining Engineering The University of Queensland Advanced Engineering Building Bld 49 Staff House Rd St LuciaQLD4072 Australia Department of Mechanical Engineering Politecnico di Milano Via La Masa 1 Milan20156 Italy School of Dentistry The University of Queensland Herston Campus 4072 Australia Department of Engineering Materials and Mechanical Design Faculty of Engineering South Valley University Qena83523 Egypt Faculty of Industry and Energy Technology Mechatronics Technology Program New Cairo Technological University New Cairo - Fifth Settlement Cairo11835 Egypt School of Science Technology and Engineering University of the Sunshine Coast Maroochydore BCQLD4558 Australia
Additively manufactured lattices based on triply periodic minimal surfaces (TPMS) have attracted significant research interest from the medical industry due to their good mechanical and biomorphic properties. However,... 详细信息
来源: 评论
The growing memristor industry
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Nature 2025年 第8059期640卷 613-622页
作者: Lanza, Mario Pazos, Sebastian Aguirre, Fernando Sebastian, Abu Le Gallo, Manuel Alam, Syed M. Ikegawa, Sumio Yang, J. Joshua Vianello, Elisa Chang, Meng-Fan Molas, Gabriel Naveh, Ishai Ielmini, Daniele Liu, Ming Roldan, Juan B. Department of Materials Science and Engineering National University of Singapore Singapore Singapore Institute for Functional Intelligent Materials National University of Singapore Singapore Singapore Centre for Advanced 2D Materials (CA2DM) National University of Singapore Singapore Singapore Materials Science and Engineering Program Physical Science and Engineering Division King Abdullah University of Science and Technology (KAUST) Thuwal Saudi Arabia Intrinsic Semiconductor Technologies London United Kingdom IBM Research – Zurich Rüschlikon Switzerland Everspin Technologies Chandler AZ United States Department of Electrical and Computer Engineering University of Southern California Los Angeles CA United States CEA-Leti Université Grenoble Alpes Grenoble France Department of Electrical Engineering National Tsing Hua University Hsinchu Taiwan Weebit Nano Hod Hasharon Israel Dipartimento di Elettronica Informazione e Bioingegneria (DEIB) Politecnico di Milano and *** Milano Italy Key Laboratory of Microelectronic Devices and Integrated Technology Institute of Microelectronics Chinese Academy of Sciences Beijing China Departamento de Electrónica y Tecnología de Computadores Universidad de Granada Facultad de Ciencias Granada Spain
The semiconductor industry is experiencing an accelerated transformation to overcome the scaling limits of the transistor and to adapt to new requirements in terms of data storage and computation, especially driven by...
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