A RF low noise amplifier,integrated in a single bluetooth transceiver chip and fabricated in 0.35μm digital CMOS technology,is *** the consideration of ESD protection and package,design methodology is discussed from ...
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A RF low noise amplifier,integrated in a single bluetooth transceiver chip and fabricated in 0.35μm digital CMOS technology,is *** the consideration of ESD protection and package,design methodology is discussed from the aspects of noise optimization,impedance match,and forward *** 2.05GHz,the measured S 11 is -6.4dB, S 21 is 11dB with 3dB-BW of 300MHz,and NF is about *** indicates that comprehensive consideration of parasitics,package model,and reasonable process is necessary for RF circuit design.
A differential equation that is generally effective for squeeze film air damping of perforated plate and non perforated plate as well as in MEMS devices is *** perforated plate,the thickness and the dimensions of th...
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A differential equation that is generally effective for squeeze film air damping of perforated plate and non perforated plate as well as in MEMS devices is *** perforated plate,the thickness and the dimensions of the plate are not *** boundary conditions,pressure distribution and the damping force on the plate can be found by solving the differential *** expressions for damping pressure and damping force of a long strip holeplate are presented with a finite thickness and a finite *** the extreme conditions of very thin plate and very thin hole,the results are reduced to the corresponding results of the conventional Reynolds' ***, the effectiveness of the generalized differential equation is ***,the generalized Reynolds' equation will be a useful tool of design for damping structures in MEMS.
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