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检索条件"机构=3D Printing Research and Engineering Technology Center"
498 条 记 录,以下是101-110 订阅
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USV Path Planning Under Marine Environment Simulation Using dWA and Safe Reinforcement Learning  19
USV Path Planning Under Marine Environment Simulation Using ...
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19th IEEE International Conference on Automation Science and engineering, CASE 2023
作者: Qu, Tianci Xiong, Gang Ali, Hub dong, Xisong Han, Yunjun Shen, Zhen Institute of Automation Chinese Academy of Sciences The State Key Laboratory of Multimodal Artificial Intelligence Systems Beijing100190 China School of Artificial Intelligence University of Chinese Academy of Sciences Beijing100049 China Institute of Automation Chinese Academy of Sciences Beijing Engineering Research Center of Intelligent Systems and Technology Beijing100190 China Chinese Academy of Sciences Guangdong Engineering Research Center of 3D Printing and Intelligent Manufacturing Cloud Computing Center Dongguan523808 China Qingdao Academy of Intelligent Industries Qingdao266109 China
It is a challenge for USV navigation due to uncertainties and disturbances in the complex marine environment, which may lead to tilting or collision. However, current path planning methods for USVs lack dynamic enviro... 详细信息
来源: 评论
Exceptional Strength of Mycelium-Bound Composite: A Sustainable Brick Alternative for Construction
Exceptional Strength of Mycelium-Bound Composite: A Sustaina...
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Symposium on Natural Fibers and Biocomposites: A Sustainable Solution, 2025, held as part of the TMS Annual Meeting and Exhibition, TMS 2025
作者: Sharma, deepak Le Ferrand, Hortense School of Mechanical and Aerospace Engineering Nanyang Technological University 50 Nanyang Avenue Singapore639798 Singapore School of Materials Science and Engineering Nanyang Technological University 50 Nanyang Avenue Singapore639798 Singapore Singapore Center for 3D Printing Nanyang Technology University 65 Nanyang Drive Singapore639798 Singapore Future Cities Laboratory Singapore ETH Centre 1 Create Way Create Tower #06-01 Singapore138602 Singapore
Mycelium-boundMycelium-bound compositescompositesComposite (MBCs) are grown by fungi onto waste lignocellulosic substrate and hence hold significant potential as sustainable materials. However, their wide range of ado... 详细信息
来源: 评论
Microfluidic intestinal organoid-on-a-chip uncovers therapeutic targets by recapitulating oxygen dynamics of intestinal IR injury
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Bioactive Materials 2023年 第12期30卷 1-14页
作者: Jinjian Huang Ziyan Xu Jiao Jiao Zongan Li Sicheng Li Ye Liu Ze Li Guiwen Qu Jie Wu Yun Zhao Kang Chen Jieshou Li Yichang Pan Xiuwen Wu Jianan Ren Research Institute of General Surgery Jinling HospitalSchool of MedicineSoutheast UniversityNanjing210009China School of Medicine Nanjing UniversityNanjing210093China Department of Rehabilitation The First Affiliated Hospital of Nanjing Medical UniversityNanjing210029China Jiangsu Key Laboratory of 3D Printing Equipment and Manufacturing NARI School of Electrical and Automation EngineeringNanjing Normal UniversityNanjing210042China General Clinical Research Center Nanjing Benq HospitalNanjing Medical UniversityNanjing210019China State Key Laboratory of Materials-Oriented Chemical Engineering College of Chemical EngineeringNanjing Tech UniversityNanjing211816China
Increasing evidence demonstrates that mammals have different reactions to hypoxia with varied oxygen dynamic *** takes~24 h for tri-gas incubator to achieve steady cell hypoxia,which fails to recapitulate ultrafast ox... 详细信息
来源: 评论
Adaptive Layer Thickness and Lifting Force Control for Bottom Lighting LCd Based Additive Manufacturing
Adaptive Layer Thickness and Lifting Force Control for Botto...
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Annual Conference of Industrial Electronics Society
作者: Hong-Yi Xue Ming-Jong Tsai Han-Wei Wu Graduate Institute of Automation and Control National Taiwan University of Science and Technology High Speed 3D Printing Research Center National Taiwan University of Science and Technology Taipei Taiwan
To improve the printing efficiency of LCd Based Additive Manufacturing System, this study integrates adaptive layer thicknesses processing technique and adaptive lifting speed and position control during the printing ...
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Parallel Systems Framework: A Safe and Efficient Testbed for Unmanned Ships  4
Parallel Systems Framework: A Safe and Efficient Testbed for...
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4th IEEE International Conference on digital Twins and Parallel Intelligence, dTPI 2024
作者: Fu, Long Shen, Zhen dong, Xisong Han, Yunjun Yang, Shuguang Xiong, Gang Wang, Fei-Yue University of Chinese Academy of Sciences School of Artificial Intelligence Beijing100049 China Chinese Academy of Sciences State Key Laboratory of Multimodal Artificial Intelligence Systems Beijing Engineering Research Center of Intelligent Systems and Technology Institute of Automation Beijing100190 China Chinese Academy of Sciences Guangdong Engineering Center of 3D Printing and Intelligent Manufacturing Cloud Computing Center Dongguan523808 China Shandong Jiaotong University Schoool of Rail Transportation Jinan250399 China Chinese Academy of Sciences State Key Laboratory for Management and Control for Complex Systems Institute of Automation Beijing100190 China
In this study, unmanned ships test platform based on the parallel systems framework is proposed to improve the test efficiency and accuracy of unmanned ships in complex ocean environment. The parallel intelligence the... 详细信息
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Correlation of parameters and microstructure of 3d printing bulk medical titanium-based metallic glass
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Materials Today: Proceedings 2022年 70卷 574-577页
作者: Liu, d.H. Peng, P.C. Kuo, C.N. Department of Materials and Optoelectronic Science National Sun Yat-Sen University Kaohsiung Taiwan Department of Bioinformatics and Medical Engineering Asia University Taichung 41354 Taiwan Graduate institute of biomedical sciences China Medical University Taichung 40402 Taiwan 3D Printing Medical Research Center China Medical University Hospital Taichung 40447 Taiwan
Metallic glass has developed over the past few decades. To fabricate the metallic glass, high cooling rates (105 K/s) is needed to form the disorder atomic structure [1]. Because metallic glass has no grain boundary, ... 详细信息
来源: 评论
Application of Virtual Reality technology for fall protection in the AEC industry  1
Application of Virtual Reality technology for fall protectio...
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1st IEEE International Conference on Cognitive Aspects of Virtual Reality, CVR 2022
作者: Bakai, Nandor Etlinger, Jozsef Simon, dora Erika Norbert Racz, Viktor Rak, Oliver Balazs Zagoracz, Mark Hillebrand, Peter University of Pécs Bim Skills Lab Research Group Department of Engineering Studies Faculty of Engineering and Information Technology PécsH-7624 Hungary University of Pécs Bim Skills Lab Research Group 3D Printing and Visualisation Centre PécsH-7624 Hungary
The scope of this paper is to present the first results of an ongoing research and application development project investigating the potential applications of Virtual Reality in the field of fall protection focusing o... 详细信息
来源: 评论
deformation Behavior and Microstructure Characterization of A357 Aluminum Alloy Welding Wires Used for Wire Arc Additive Manufacturing
SSRN
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SSRN 2023年
作者: Zheng, Tao Wang, Gaosong Shi, Hanchao Chen, Bingqing Ren, Xinyu Xiong, Huaping 3D Printing Research and Engineering Technology Center Beijing Institute of Aeronautical Materials Beijing100095 China Key Laboratory of Electromagnetic Processing of Materials Ministry of Education Northeastern University Shenyang110819 China
Microstructure and mechanical responses of A357 aluminum alloy welding wires after different degrees of strain were studied. It is found that the grains are elongated and refined along the drawing direction, accompany... 详细信息
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demonstration of Glass-based 3d Package Architectures with Embedded dies for High Performance Computing
Demonstration of Glass-based 3D Package Architectures with E...
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Electronic Components and technology Conference (ECTC)
作者: Siddharth Ravichandran Vanessa Smet Madhavan Swaminathan Rao Tummala 3D Systems Packaging Research Center School of Electrical and Computer Engineering Georgia Institute of Technology Atlanta USA 3D Systems Packaging Research Center School of Mechanical Engineering Georgia Institute of Technology Atlanta USA 3D Systems Packaging Research Center School of Material Science and Engineering Georgia Institute of Technology Atlanta USA
This paper presents a technology demonstration of two novel 3d glass-based architectures for high performance computing applications. Current 3d technologies are limited by Through Silicon Vias (TSVs), and the propose...
来源: 评论
Plasmonic metafibers electro-optic modulators
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Light(Science & Applications) 2023年 第9期12卷 1893-1901页
作者: Lei Zhang Xinyu Sun Hongyan Yu Niping deng Feng Qiu Jiyong Wang Min Qiu College of Information Science and Electronic Engineering Zhejiang UniversityHangzhou 310027China Key Laboratory of 3D Micro/Nano Fabrication and Characterization of Zhejiang Province School of EngineeringWestlake University18 Shilongshan RoadHangzhou 310024 ZhejiangChina Institute of Advanced Technology Westlake Institute for Advanced Study18 Shilongshan RoadHangzhou 310024 ZhejiangChina College of Optical Science and Engineering Zhejiang UniversityHangzhou 310027China Hangzhou Institute for Advanced Study University of Chinese Academy of SciencesHangzhou 310024China Ministry of Education Engineering Research Center of Smart Microsensors and Microsystems School of Electronics and InformationHangzhou Dianzi UniversityHangzhou 310018China
digitalizing optical signals through electric driving signals,electro-optic modulators(EOMs)are one of the cardinal elements in modern optical *** of current EOM devices are targeting on-chip integrations,which routin... 详细信息
来源: 评论