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检索条件"机构=ASIC&System State Key Lab"
809 条 记 录,以下是201-210 订阅
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The Research of Interconnection Network on CoarseGrained Reconfigurable Cipher Logic Array  2
The Research of Interconnection Network on CoarseGrained Rec...
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2017 IEEE 第2届先进信息技术,电子与自动化控制国际会议(IAEAC 2017)
作者: Yuanming Li Yinjian Yan Wei Li Min Liu Department of Microelectronics Institution of Information Science and Technology State Key Lab of ASIC and System Fudan University
Coarse-grained reconfigurable array( CGRA) has an advantage in the implementation of symmetric cryptog raphic algorithms with high performance and flexibility. S pecially, interconnection network is u
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Study on effect of different complexing agents and inhibitors on Co corrosion in H2O2 based alkaline solution by EQCM
Study on effect of different complexing agents and inhibitor...
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2017 International Conference on Planarization/CMP Technology, ICPT 2017
作者: He, Peng Yang, Guang Qu, Xin-Ping State key lab of ASIC and System School of Microelectronics Fudan University Shanghai200433 China
In this work, the dissolution and corrosion of cobalt (Co) films were investigated using solutions of aqueous mixtures of oxidant H2O2, and different inhibitors (1, 2, 4-triazole (TAZ), nicotinic acid (NA) and benzotr... 详细信息
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Effect of guanidine sulfate on the CMP of Ru in H2O2 based slurry
Effect of guanidine sulfate on the CMP of Ru in H2O2 based s...
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2017 International Conference on Planarization/CMP Technology, ICPT 2017
作者: Yang, Guang He, Peng Qu, Xin-Ping State key lab of ASIC and System School of Microelectronics Fudan University Shanghai200433 China
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ICPD: an SOI-based photodetector with high responsivity and tunable response spectrum
ICPD: an SOI-based photodetector with high responsivity and ...
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International Conference on Solid-state and Integrated Circuit Technology
作者: J. Wan W.Z. Bao J.N. Deng Z.X. Guo X.Y. Cao B.R. Lu Y.F. Chen A. Zaslavsky S. Cristoloveanu M. Bawedin State key lab of ASIC and System Fudan University China Brown University Providence USA IMEP-LAHC INP-Grenoble/Minatec CS50257 Grenoble France
A novel photodetector based on a silicon-on-insulator (SOI) substrate is demonstrated experimentally in this work. The device uses the interface coupling effect in an SOI transistor structure to amplify the photocurre...
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Study on Electrical Artifact Cancellation Approaches for Neural Signal Recording system
Study on Electrical Artifact Cancellation Approaches for Neu...
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IEEE International Conference on Solid-state and Integrated Circuit Technology
作者: Xiao-Fu Pei Xian-Liang Chen Jun-Yu Wang State Key Lab of ASIC & System Fudan University Shanghai China
Electrical artifact cancellation is essential to the linearity improvement of neural signal detection systems. This paper aims to find the optimized method of electrical artifact cancellation for neural recording syst... 详细信息
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An SRAM-free HEVC Deblocking Filter VLSI Architecture for 8K Application
An SRAM-free HEVC Deblocking Filter VLSI Architecture for 8K...
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IEEE International Conference on Solid-state and Integrated Circuit Technology
作者: Genwei Tang Xiaoyang Zeng Yibo Fan State Key Lab of ASIC & System Fudan University Shanghai China
Deblocking filter (DBF) is an efficient tool to reduce the bit rate in the latest video coding standard, High Efficiency Video Coding (HEVC). This work presents an SRAM-free deblocking filter VLSI architecture with hi... 详细信息
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CNN Oriented Fast CU Partition Decision and PU Mode Decision for HEVC Intra Encoding
CNN Oriented Fast CU Partition Decision and PU Mode Decision...
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IEEE International Conference on Solid-state and Integrated Circuit Technology
作者: Ke CHEN Xiaoyang ZENG Yibo FAN State Key Lab of ASIC and System Fudan University Shanghai China
In the process of intra prediction of the High Efficiency Video Coding(HEVC), the calculation requirement is hugely increased. In order to solve this problem, we propose two algorithms, including a novel fast CU parti... 详细信息
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Electron Beam Lithography: CO2-Based Dual-Tone Resists for Electron Beam Lithography (Adv. Funct. Mater. 13/2021)
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Advanced Functional Materials 2021年 第13期31卷
作者: Xin-Yu Lu Hao Luo Kai Wang Yao-Yao Zhang Xiao-Feng Zhu Dongxue Li Bingze Ma Shisheng Xiong Paul F. Nealey Qiang Li Guang-Peng Wu MOE Laboratory of Macromolecular Synthesis and Functionalization Adsorption and Separation Materials and Technologies of Zhejiang Province Department of Polymer Science and Engineering Zhejiang University Hangzhou 310027 China State Key Laboratory of Modern Optical Instrumentation College of Optical Science and Engineering Zhejiang University Hangzhou 310027 China Pritzker School of Molecular Engineering University of Chicago Chicago IL 60637 USA Materials Science Division Argonne National Laboratory 9700 S Cass Avenue Argonne IL 60439 USA School of Information Science and Technology Fudan University Shanghai 200433 China State Key Lab of ASIC and System School of Microelectronics Fudan University Shanghai 200433 China
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Memory Devices: Symmetric Ultrafast Writing and Erasing Speeds in Quasi‐Nonvolatile Memory via van der Waals Heterostructures (Adv. Mater. 11/2019)
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Advanced Materials 2019年 第11期31卷
作者: Jingyu Li Lan Liu Xiaozhang Chen Chunsen Liu Jianlu Wang Weida Hu David Wei Zhang Peng Zhou ASIC & System State Key Lab School of Microelectronics Fudan University Shanghai 200433 China State Key Laboratory of Infrared Physics Shanghai Institute of Technical Physics Chinese Academy of Sciences Shanghai 200083 China
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Sub-10 nm silicon FinFET devices on SOI substrate made by block copolymer lithography
Sub-10 nm silicon FinFET devices on SOI substrate made by bl...
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International Conference on Solid-state and Integrated Circuit Technology
作者: Dong-Xue Li Chien-Liang Chien Xinnian Wei Yanwei Huang Xin-Ping Qu Tzu-Hsuan Chang Shisheng Xiong School of Microelectronics State Key Lab of ASIC and System Fudan University Shanghai China Department of Electrical Engineering National Taiwan University Taipei School of Information Science and Technology Fudan University Shanghai China
Block copolymer (BCP) lithography as a low-cost and simple process emerges to become an important patterning technique in microelectronic manufacturing. In this work, self-assembly of a triblock copolymer was used to ... 详细信息
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