Through Silicon Via (TSV) is now becoming one of the most critical and enabling technologies for 3-D *** interconnection of several chips offered by TSV will result in improved performance and functionality, miniaturi...
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ISBN:
(纸本)9781479932849
Through Silicon Via (TSV) is now becoming one of the most critical and enabling technologies for 3-D *** interconnection of several chips offered by TSV will result in improved performance and functionality, miniaturization in size and weight and reduced power consumption. Cu as TSV filling material is well used in the traditional damascene process. In this work, Cu seed deposition in high aspect ratio features using traditional PVD tool is developed and seamless TSV Cu filling is achieved. The TSV via dishing in Cu CMP soft landing step is also discussed. Finally, the TSV via resistance is extracted from the special designed test structure without additional bonding wafer or backside patterning.
This paper proposes a novel demosaicing algorithm based on improved gradients with color correlation. Compared to conventional method, especially on region with dense lines and textures, the proposed method may reduce...
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This paper proposes a novel demosaicing algorithm based on improved gradients with color correlation. Compared to conventional method, especially on region with dense lines and textures, the proposed method may reduce the probability on the edge direction judgment, which may lead to obvious artifacts. The improved adaptive gradients calculation uses color correlation information. The proposed method can effectively suppress the artifacts and increase average PSNR on R, G and B channels by 0.59db, 0.69db and 0.56db respectively.
In this work, we describe the design and study of a novel electrochemical microsensor integrated with electrowetting-on-dielectric (EWOD) microfluidic chip for automatic, rapid and microscale detection. The microsenso...
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In this paper, Yet Another Many-Objective Clustering (YAMO-Pack) is proposed for academic field programmable gate array architecture model. The YAMO-Pack introduces the impact of attraction between Basic Logic Element...
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A 60GHz RoF system with precoded 16QAM-OFDM signals is experimentally demonstrated. The results prove that precoding can reduce the PAPR of OFDM signals by at least 2.5dB and improve receiver sensitivity by at least 2...
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We demonstrate that interleaved segmentation technique provides a trade-off between PAPR and computational complexity in 60GHz RoF system with 5Gb/s 16QAM-OFDM downlink. Moreover, the receiver sensitivity is effective...
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As an extension of binary low-density parity-check (LDPC) codes, non-binary LDPC (NB-LDPC) codes show significantly better performance when the code length is moderate or small. Recently, enhanced iterative hard relia...
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ISBN:
(纸本)9781479934331
As an extension of binary low-density parity-check (LDPC) codes, non-binary LDPC (NB-LDPC) codes show significantly better performance when the code length is moderate or small. Recently, enhanced iterative hard reliability based (EIHRB) decoding algorithm is proposed to reduce the computation complexity. However, the EIHRB algorithm suffers a lot from significant performance degradation when the column weight is small. In this paper, a symbol reliability based (SRB) decoding algorithm, which also performs well when the column weight is low, is proposed for NB-LDPC decoding to improve the decoding performance. With the same maximum iteration number, around 0.38 dB extra coding gain is achieved. Furthermore, the corresponding efficient decoder architecture is proposed. Comparison results have shown that the proposed SRB algorithm can not only achieve good coding gain, but the cost for hardware implementation is reasonable.
This paper presents an efficient min-sum-based decoder for high-rate low-density parity-check (LDPC) codes, where the first minimum and second minimum values are stored in registers. In order to meet a strict cost req...
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ISBN:
(纸本)9781479934331
This paper presents an efficient min-sum-based decoder for high-rate low-density parity-check (LDPC) codes, where the first minimum and second minimum values are stored in registers. In order to meet a strict cost requirement imposed by NAND flash applications, we provide different upper limits for the first and second minimum values. Furthermore, we use non-uniform quantization for the second minimum value so as to reduce storage complexity. In order to enhance the error-rate performance, the normalization factor is determined based on the difference between the first two minimum values. Using the proposed techniques, a reduction in gate count of 13.36% can be achieved without suffering any degradation in error-rate performance. The implementation results for a rate-0.896 length-18624 layered decoder show that this decoder can achieve a throughput of 765.24 Mb/s at a clock frequency of 166 MHz with a gate count of 620K.
Considering the problem that the well-known bit-reversal algorithm is only fit for radix-2 Fast Fourier Transform (FFT) data reordering, a novel approach based on recursive indexing is proposed for radix-r FFT data re...
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ISBN:
(纸本)9781849196536
Considering the problem that the well-known bit-reversal algorithm is only fit for radix-2 Fast Fourier Transform (FFT) data reordering, a novel approach based on recursive indexing is proposed for radix-r FFT data reordering. The proposed scheme discards a look-up table required by bit-reversal algorithm. The corresponding hardware structure only costs a RAM whose depth is equal to the size of FFT, and saves a same order of extra additions involved in a quite recent scheme based on vector calculation.
A 2-Mb resistive random access memory (ReRAM) is demonstrated in 0.13-um CMOS logic process. The paper describes the cell, chip architecture, and circuit techniques to ReRAM design;The 2-Mb ReRAM chip features three c...
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