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Deep Learning-Based Positioning Error Fault Diagnosis of Wire Bonding Equipment and an Empirical Study for IC Packaging

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IEEE Transactions on Semiconductor Manufacturing 2023年第4期36卷 619-628页

作者： Kao, Sheng-Xiang Chien, Chen-Fu International Intercollegiate Ph.D. Program National Tsing Hua University Hsinchu30013 Taiwan Intelligent Manufacturing and Circular Economy Research Center National Tsing Hua University Artificial Intelligence for Intelligent Manufacturing Systems Research Center National Science and Technology Council Department of Industrial Engineering and Engineering Management Hsinchu300044 Taiwan

Little research has been done for artificial intelligence applications of semiconductor backend. This study aims to develop a deep learning based fault diagnosis framework as prognostics and health management (PHM) solutions with a comprehensive analytics process. A linear encoder sensor is employed to measure position, while data preparation is conducted to convert position information into a signal. Then, signal processing is used to extract the features, in which high pass filter is applied to normalize the signal and emphasize the features. High-dimensional features including time domain statistical features, time-frequency domain features obtained by continuous wavelet transform (CWT), and frequency domain features converted by fast Fourier transform (FFT) are extracted to prepare the dataset. An ensemble neural network model that integrates deep neural network (DNN) and convolutional neural network (CNN) is employed to recognize the pattern and diagnose the positioning errors. The accuracy and false alarm rate are considered to support maintenance decisions. An empirical study was conducted in a world leading IC assembly and testing company for validation. The results have shown that the proposed approach can effectively detect inappropriate installation of the bond head in wire bonding equipment for predictive maintenance and cost reduction. © 1988-2012 IEEE.

关键词： Failure analysis

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Application of Recurrence Plots and VGG Deep Learning Model to the Study of Condition Monitoring of Robotic Grinding

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International Journal of Precision Engineering and Manufacturing 2023年第9期24卷 1675-1683页

作者： Chung, Kuan-Jung Dai, Cheng-Han Chiang, Tung-Chun Xie, June-Jia Lin, Ming-Tzer Department of Mechatronics Engineering National Changhua University of Education Changhua500 Taiwan Graduate Institute of Precision Engineering National Chung Hsing University Taichung402 Taiwan Doctoral Program in Industrial and Smart Technology Academy of Circular Economy National Chung Hsing University Nantou540 Taiwan

This study adopted AI to identify the normal and abnormal vibration signals generated during robotic grinding. This study classified four fundamental factors affecting grinding into three levels to obtain a widely used result and designed an L9(3 4) orthogonal array for the grinding experiment. During experimentation, part of the grinding wheels was added weight to produce abnormal vibration signals, which an accelerometer would measure. The study transformed the collected vibration signals into recurrence plots and conducted model training with VGG16 CNN architecture. Finally, this study tested a model with 89.6% training accuracy. The results showed the model could identify whether the recurrence plots stand for normal or abnormal vibrations, with an accuracy of 85%. This means it could predict normal and abnormal grinding conditions and help avoid problems caused by abnormal vibrations. © 2023, The Author(s), under exclusive licence to Korean Society for Precision Engineering.

关键词： Grinding (machining)

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The effect of the addition of alumina on the viscosity, surface tension, and foaming efficiency of 2.5(CaO/SiO2)-xAl2O3-yFeO-MgO melts

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Ceramics International 2023年第13期49卷 21994-22003页

作者： Chang, Yu-En Lin, Chi-Ming Shen, Jyun-Ming Luo, Shao-Feng Yu, Kai-Wen Wu, Weite Department of Materials Science and Engineering National Chung Hsing University 145 Xingda Rd South Dist Taichung City40227 Taiwan WEI CHIH STEEL INDUSTRIAL CO. LTD No.123 Nanbu Guantian Dist. Tainan City720006 Taiwan Academy of Circular Economy Industrial and Intelligent Technology Program National Chung Hsing University No. 15 Guangming Rd. Nantou County 540 Taiwan

Viscosity and surface tension strongly influence the efficiency of slag foam in metallurgical processes. An excellent foaming slag preserves heat and lowers the cost of smelting in an electric furnace. In this study, we investigated the viscosity, surface tension, and foaming efficiency of a 2.5CaO/SiO2-xAl2O3-yFeO-MgO slag. We also investigated the different valence oxygen ions by X-ray photoelectron spectroscopy (XPS). The results showed that with a gradual increase in the content of Al2O3, the viscosity initially increased and then decreased, and the changes in surface tension followed a similar pattern. The change in viscosity was caused by the increase in the degree of polymerization of the slag, which was determined by the competitive relationship between polymerization and the reduction in the stability of the overall network structure. Adding a small amount of Al2O3 to the slag slightly increased the number of Al–O–Al structures, whereas adding a large amount of the Al2O3 led to the formation of low-strength Al–O–Si structures, which reduced the stability of the network structure, thus reducing the viscosity. Because the surface tension is related to the concentration of non-bridging oxygens (NBOs), when the NBO content increased, the instability of the surface structure caused an increase in energy, thus increasing the surface tension. In addition, the CaO–SiO2–5MgO-xAl2O3-yFeO five-element oxide in this study had the lowest surface tension at the same NBO concentration, which positively contributed to slag foaming. Finally, When the Al2O3 content in the system increased from 5.1 to 15.7 wt%, the foaming efficiency increased from 24.2 to 69.2 (minute‧centimeters), an increase of 286%. © 2023 Elsevier Ltd and Techna Group S.r.l.

关键词： Silica

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The AT-hook protein AHL29 promotes Bacillus subtilis colonization by suppressing SWEET2-mediated sugar retrieval in Arabidopsis roots

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Plant Cell and Environment 2024年第4期47卷 1084-1098页

作者： Wu, Yun-Chien Yu, Chien-Wen Chiu, Jo-Yu Chiang, Yu-Hsuan Mitsuda, Nobutaka Yen, Xu-Chen Huang, Tzu-Pi Chang, Tzu-Fang Yen, Cen-Jie Guo, Woei-Jiun Department of Biotechnology and Bioindustry Sciences National Cheng Kung University Tainan Taiwan Bioproduction Research Institute National Institute of Advanced Industrial Science and Technology (AIST) Tsukuba Ibaraki Japan Department of Plant Pathology National Chung Hsing University Taichung Taiwan Innovation and Development Center of Sustainable Agriculture National Chung Hsing University Taichung Taiwan Master and Doctoral Degree Program in Plant Health Care Academy of Circular Economy National Chung Hsing University Nantou Taiwan

Beneficial Bacillus subtilis (BS) symbiosis could combat root pathogenesis, but it relies on root-secreted sugars. Understanding the molecular control of sugar flux during colonization would benefit biocontrol applications. The SWEET (Sugar Will Eventually Be Exported Transporter) uniporter regulates microbe-induced sugar secretion from roots;thus, its homologs may modulate sugar distribution upon BS colonization. Quantitative polymerase chain reaction revealed that gene transcripts of SWEET2, but not SWEET16 and 17, were significantly induced in seedling roots after 12 h of BS inoculation. Particularly, SWEET2-β-glucuronidase fusion proteins accumulated in the apical mature zone where BS abundantly colonized. Yet, enhanced BS colonization in sweet2 mutant roots suggested a specific role for SWEET2 to constrain BS propagation, probably by limiting hexose secretion. By employing yeast one-hybrid screening and ectopic expression in Arabidopsis protoplasts, the transcription factor AHL29 was identified to function as a repressor of SWEET2 expression through the AT-hook motif. Repression occurred despite immunity signals. Additionally, enhanced SWEET2 expression and reduced colonies were specifically detected in roots of BS-colonized ahl29 mutant. Taken together, we propose that BS colonization may activate repression of AHL29 on SWEET2 transcription that would be enhanced by immunity signals, thereby maintaining adequate sugar secretion for a beneficial Bacillus association. © 2023 John Wiley & Sons Ltd.

关键词： AT-hook motif rhizobacteria sugar transporter SWEET symbiosis

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Effect of sputtering power and thickness ratios on the materials properties of Cu-W and Cu-Cr bilayer thin films using high power impulse magnetron and DC magnetron sputtering

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Journal of Vacuum Science and technology A: Vacuum, Surfaces and Films 2024年第5期42卷

作者： Nguyen, Tra Anh Khoa Huang, Yu Dang, Nhat Minh Lin, Chi-Han Chen, Wei-Chieh Wang, Zhao-Ying Lin, Ming-Tzer Graduate Institute of Precision Engineering National Chung Hsing University Taichung402 Taiwan Faculty of Mechanical Engineering Ho Chi Minh City University of Technology and Education Ho Chi Minh71307 Viet Nam ASML Technology Taiwan Ltd HsinChu300 Taiwan Industrial and Smart Technology Program Academy of Circular Economy National Chung Hsing University Nantou540 Taiwan

This study investigates the influence of Cu thickness ratios on the structural, morphological, and mechanical properties of sputtered Cu-W and Cu-Cr bilayer thin films. Employing high power impulse magnetron sputtering (HiPIMS), five distinct thickness ratios of 1:3, 3:5, 1:1, 5:3, and 3:1 were analyzed and compared to bilayer films developed using direct current magnetron sputtering (DCMS). The microstructural and surface characteristics of these films were evaluated using x-ray diffraction (XRD), atomic force microscopy, and scanning electron microscopy. Electrical properties were measured using a four-point probe, while mechanical properties were assessed through nanoindentation. Results reveal that increasing Cu thickness in Cu-W and Cu-Cr bilayers inversely affects hardness, grain size, and roughness, highlighting the influence of thickness ratios on film properties. Films with a higher Cu thickness ratio in both Cu-W and Cu-Cr bilayer systems deposited by HiPIMS exhibited lower hardness, smaller grain size, and reduced average roughness. Cross-sectional analysis and XRD confirmed the impact of thickness ratio on crystal phase and microstructure, indicating smoother columnar structures. Specifically, the HiPIMS-deposited Cu-Cr 3-1 film exhibited the lowest resistivity, at 4.77 μΩ cm, and hardness, measuring 8.26 GPa. Moreover, the 1:1 ratio films of Cu-W and Cu-Cr demonstrated hardness values of 13.81 and 11.37 GPa, respectively, which were 1.39 times higher than the films grown by DCMS. Additionally, variations in the bilayer thickness ratio significantly affected the electrical properties of the films. The enhanced properties of HiPIMS films are attributed to the higher peak power density of the target, leading to increased ion energy and deposition of dense grain structures. © 2024 Author(s).

关键词： Thin films

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Upcycling electroplating sludge into nanoflower-structured Cu-MOFs for efficient Fenton-like degradation of organic dyes

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Journal of Water Process Engineering 2025年 75卷

作者： Lin, Jia-Yin Yu, Si-Han Shih, Jun-Ren Hsieh, Tsai-Hsuan Wang, Chih-Ying Huang, Jen-Yu Tsao, Nai-Wen Master and Doctoral Program in Semiconductor and Green Technology Academy of Circular Economy National Chung Hsing University Nantou 540 Taiwan Master and Doctoral Program in Industrial and Smart Technology Academy of Circular Economy National Chung Hsing University Nantou 540 Taiwan Master and Doctoral Program in Specialty Crops and Metabolomics Academy of Circular Economy National Chung Hsing University Nantou 540 Taiwan

The growing demand for sustainable strategies to address industrial pollution has spurred interest in converting hazardous solid wastes into functional materials. In this study, electroplating sludge (ES)—rich in copper and minor nickel—was successfully upcycled into two nanoflower-structured metal-organic frameworks (MOFs), ES-MOF-BDC and ES-MOF-BTC, via a solvothermal method using 1,4-benzenedicarboxylic acid (BDC) and benzene-1,3,5-tricarboxylic acid (BTC) as organic linkers. The resulting MOFs exhibited high crystallinity, mesoporous structures, and uniformly distributed Cu active sites. The hierarchical morphology effectively suppressed metal aggregation and enhanced the availability of catalytic sites. Among the two, ES-MOF-BTC demonstrated superior Fenton-like catalytic performance, achieving 95.76 % removal of Congo Red (CR) and complete degradation of methylene blue (MB) and Eriochrome Black T (EBT) within 60 min using only 1 mg of catalyst and 10 μL of H₂O₂. Kinetic analysis confirmed pseudo-first-order behavior, with a high turnover frequency (TOF = 0.0256 min−1) and low activation energy (24.25 kJ/mol). Scavenger experiments and EPR analysis confirmed hydroxyl radicals (•OH) as the dominant reactive species. The catalyst maintained over 85 % activity after ten reuse cycles and remained effective across various natural water matrices and under saline conditions. This work highlights a green and scalable strategy for transforming electroplating sludge into high-performance MOF catalysts, offering both environmental remediation potential and circular economy value in wastewater treatment applications. © 2025 Elsevier Ltd

关键词： circular economy Congo Red degradation Copper-based MOF Electroplating sludge Fenton-like catalysis

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Materials’ properties of low temperature deposited Cu/W and Cu/Cr multilayer thin films using high power impulse magnetron sputtering

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Journal of Vacuum Science and technology A: Vacuum, Surfaces and Films 2024年第3期42卷

作者： Huang, Yu Nguyen, Tra Anh Khoa Dang, Nhat Minh Wang, Hao-Yu Lin, Ming-Tzer Graduate Institute of Precision Engineering National Chung Hsing University Taichung402 Taiwan REMElab Faculty of Mechanical Engineering Ho Chi Minh City University of Technology and Education Ho Chi Minh70000 Viet Nam Taiwan ASML Technology Taiwan Ltd. Hsinchu City300 Taiwan Industrial and Smart Technology Program Academy of Circular Economy National Chung Hsing University Nantou540 Taiwan

In this study, copper/tungsten (Cu/W) and copper/chromium (Cu/Cr) multilayers were created by stacking bilayer films in a 3:1 ratio, with layer thicknesses ranging from 400 to 800 nm, deposited on Si (100) substrates using high power impulse magnetron sputtering (HiPIMS). The microstructural and surface properties of these films were examined through x-ray diffraction, atomic force microscopy, and scanning electron microscopy. Electrical properties were assessed using a four-point probe, while mechanical properties were measured via nanoindentation. Both multilayer systems showed a decrease in the hardness accompanied by an increase in the elastic modulus with each stacking bilayer. The Cu/W system experienced a gradual hardness reduction (down to 19%), compared to the Cu/Cr system, which exhibited a similar decrease (14.5%). The Cu/W and Cu/Cr multilayer film samples consistently demonstrate a softer nature compared to their bilayer counterparts due to the influence of the underlying Cu soft layers. A distinctive surface smoothness in these multilayer systems correlates with the elastic modulus in a manner unlike that with hardness. These multilayer films also demonstrated altered electrical resistivity, enhancing our understanding and capabilities in fabricating films with an increased number of layers. © 2024 Author(s).

关键词： Multilayer films

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Sustainable Bio-Adsorbent Generated from Coffee Waste for Dual Application in Heavy Metal and Dye Removal

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Processes 2025年第5期13卷 1364-1364页

作者： Jia-Yin Lin Pei-Tzu Chang Jun-Ren Shi Fu-Chen Liu Chih-Ying Wang Nai-Wen Tsao Master and Doctoral Program in Industrial and Smart Technology Academy of Circular Economy National Chung Hsing University Nantou 540 Taiwan Master and Doctoral Program in Semiconductor and Green Technology Academy of Circular Economy National Chung Hsing University Nantou 540 Taiwan Department of Environmental Engineering and Science Chia Nan University of Pharmacy and Science Tainan 717 Taiwan Master and Doctoral Program in Specialty Crops and Metabolomics Academy of Circular Economy National Chung Hsing University Nantou 540 Taiwan

Heavy metal and dye contamination from industrial wastewater present substantial dangers to both ecological systems and human well-being. This study explores the upcycling of Coffee Powder Trimmings (CPT), a biomass waste rich in oxygen-containing functional groups, for water remediation. CPT was first used to adsorb Cu2+ and Fe3+ ions, then pyrolyzed at 750 °C to form metal oxide biochar composites (Cu/CB and Fe/CB). Characterization confirmed the formation of CuO and Fe3O4 particles and the retention of key adsorption functionalities. The materials were evaluated for methylene blue (MB) removal across pH levels, various water bodies, and multiple reuse cycles. CPT effectively removed >95% of Cu2+ and Fe3+ via chelation, while Fe/CB achieved up to 97.8% MB removal due to synergistic π–π, hydrogen bonding, and coordination interactions. Both biochars retained high performance after five cycles, with Fe/CB maintaining 86.88% efficiency. These results highlight CPT-derived biochar as a sustainable, low-cost adsorbent for dual removal of heavy metals and dyes.

关键词： Coffee Powder Trimmings heavy metal dye removal

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FIB-DIC ring-core measurement of the residual stress on HiPIMS W/Cu and Cr/Cu multilayer thin films

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Surface and Coatings technology 2024年 483卷

作者： Zeng, Zhen-Yi Nguyen, Tra Anh Khoa Dang, Nhat Minh Wu, Xiu-Wei Chen, Terry Yuan-Feng Lin, Ming-Tzer Graduate Institute of Precision Engineering National Chung Hsing University Taichung402 Taiwan REMElab Faculty of Mechanical Engineering Ho Chi Minh City University of Technology and Education Ho Chi Minh70000 Viet Nam Taiwan Semiconductor Manufacturing Co. Ltd. HsinChu300 Taiwan Department of Mechanical Engineering National Cheng Kung University Tainan70101 Taiwan Industrial and Smart Technology Program Academy of Circular Economy National Chung Hsing University Nantou 540 Taiwan

Residual stress in multilayer coatings is a complex phenomenon influenced by layer number and thickness, layer and substrate materials, deposition technique, process parameters, and working pressure. It is crucial to realize these stresses because they have a significant impact on the performance and reliability of multilayer structures in their applications. The measurement of the residual stress on multilayer thin films locally and globally is crucial. This study employed ring-core milling residual stress measurement on the High-Power Impulse Magnetron Sputtering (HiPIMS) fabricated Tungsten/Copper (W/Cu) Chromium/Copper (Cr/Cu) multilayer thin films. The displacement transformation strain was analyzed using Focused Ion Beam (FIB) ring-core milling combined with Digital Image Correlation (DIC), and the strain stress transformation calibration coefficients were analyzed through Finite Element Method (FEM) to investigate the residual stress of the thin films layer by layer. The study results indicated that the hard thin films (W, Cr) were the main source of residual stress in the multilayer thin film structure, while the soft thin film (Cu) had a lower residual stress. Having Cu as the intermediate layer was found to be effective for controlling the residual stress of thin films. The hard thin films encapsulated by the soft thin films had smaller stress values than those with hard films on the surface. In addition, the study observes the stress gradient and distribution at different depths and locations on the sample to reveal process parameters to balance between the soft and hard thin films and could help to predict the location of the damage on the multilayer thin films caused by higher stress. © 2024 Elsevier B.V.

关键词： Multilayers

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