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检索条件"机构=Advanced Computer Engineering Lab"
1353 条 记 录,以下是221-230 订阅
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Nano-wire bridge waveguide-assisted silicon polarizing beam splitter  13
Nano-wire bridge waveguide-assisted silicon polarizing beam ...
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Holography, Diffractive Optics, and Applications XIII 2023
作者: Liu, H.P. Feng, J.J. Chen, J. Zhou, W.J. Bi, Q.Y. Zeng, H.P. School of Optical-Electrical and Computer Engineering University of Shanghai for Science and Technology Shanghai200093 China Key Lab of Advanced Optical Manufacturing Technologies of Jiangsu Province Soochow University Suzhou215006 China Chongqing Key Laboratory of Precision Optics Chongqing Institute of East China Normal University Chongqing401120 China State Key Laboratory of Precision Spectroscopy East China Normal University Shanghai200241 China
A low-loss and wideband silicon polarizing beam splitter is demonstrated with the assistance of a nano-bridge waveguide. Transverse magnetic light can be coupled to the cross port through the nano-bridge waveguide, wh... 详细信息
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Fusing Local and Global Mobility Patterns for Trajectory Recovery  28th
Fusing Local and Global Mobility Patterns for Trajectory R...
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28th International Conference on Database Systems for advanced Applications, DASFAA 2023
作者: Deng, Liwei Zhao, Yan Sun, Hao Yang, Changjie Xie, Jiandong Zheng, Kai University of Electronic Science and Technology of China Chengdu China School of Computer Science and Engineering University of Electronic Science and Technology of China Chengdu China Shenzhen Institute for Advanced Study University of Electronic Science and Technology of China Chengdu China Aalborg University Aalborg Denmark Peking University Beijing China Cloud Database Innovation Lab of Cloud BU Huawei Technologies Co. Ltd. Chengdu China
The prevalence of various mobile devices translates into a proliferation of trajectory data that enables a broad range of applications such as POI recommendation, tour recommendation, urban transportation planning, an... 详细信息
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Explore the Future Earth with Wander 2.0: AI Chatbot Driven By Knowledge-base Story Generation and Text-to-image Model
Explore the Future Earth with Wander 2.0: AI Chatbot Driven ...
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Extended Abstracts of the 2023 CHI Conference on Human Factors in Computing Systems, CHI EA 2023
作者: Sun, Yuqian Xu, Ying Cheng, Chenhang Li, Yihua Lee, Chang Hee Asadipour, Ali Computer Science Research Centre Royal College of Art London United Kingdom Department of Industrial Design School of Art and Design Wuhan University of Technology Wuhan China Shanghai China Department of Product Design College of Fashion and Design Donghua University Shanghai China Affective Systems and Cognition Lab Industrial Design Department College of Engineering Korea Advanced Institute of Science and Technology Daejeon Korea Republic of
People always envision the future of earth through science fiction (Sci-fi), so can we create a unique experience of "visiting the future earth"through the lens of artificial intelligence (AI)? We introduce ... 详细信息
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Enabling Real World Scale Structural Superlubricity All-Atom Simulation on the Next-Generation Sunway Supercomputer  23
Enabling Real World Scale Structural Superlubricity All-Atom...
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2023 International Conference for High Performance Computing, Networking, Storage and Analysis, SC 2023
作者: Duan, Xiaohui Wang, Jin Gao, Ping Ma, Ming Gan, Lin Liu, Xin Fu, Haohuan Xue, Wei Chen, Dexun Yang, Guangwen Liu, Weiguo School of Software Shandong University China International School for Advanced Studies Trieste Italy Tsinghua University Department of Computer Science and Technology Beijing China Department of Engineering Mechanics Center for Nano and Micro Mechanics Tsinghua University Beijing China National Supercomputing Center in Wuxi Wuxi China Ministry of Education Key Lab for Earth System Modeling Department of Earth System Science Tsinghua University Beijing China
Molecular dynamics (MD) simulation can provide an affordable way for inspecting microscopic phenomena, which is a powerful complement to real-world experiments. But the spatial scale of MD simulations is usually magni... 详细信息
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WEAKLY SUPERVISED LEARNING FOR CELL RECOGNITION IN IMMUNOHISTOCHEMICAL CYTOPLASM STAINING IMAGES
arXiv
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arXiv 2022年
作者: Zhang, Shichuan Zhu, Chenglu Li, Honglin Cai, Jiatong Yang, Lin Artificial Intelligence and Biomedical Image Analysis Lab School of Engineering Westlake University China Institute of Advanced Technology Westlake Institute for Advanced Study China College of Computer Science & Technology Zhejiang University China
Cell classification and counting in immunohistochemical cytoplasm staining images play a pivotal role in cancer diagnosis. Weakly supervised learning is a potential method to deal with labor-intensive labeling. Howeve... 详细信息
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ChrSNet: Chromosome Straightening using Self-attention Guided Networks
arXiv
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arXiv 2022年
作者: Zheng, Sunyi Li, Jingxiong Shui, Zhongyi Zhu, Chenglu Zhang, Yunlong Chen, Pingyi Yang, Lin Artificial Intelligence and Biomedical Image Analysis Lab School of Engineering Westlake University China Institute of Advanced Technology Westlake Institute for Advanced Study China College of Computer Science and Technology Zhejiang University China
Karyotyping is an important procedure to assess the possible existence of chromosomal abnormalities. However, because of the non-rigid nature, chromosomes are usually heavily curved in microscopic images and such defo... 详细信息
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Analysis of Metallization Effects of Pressure-Assisted Cu Nanoparticle Sintering on DBC by Experiment and Nanoscale Simulation
Analysis of Metallization Effects of Pressure-Assisted Cu Na...
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International Conference on (ICEPT) Electronic Packaging Technology
作者: Shizhen Li Jing Jiang Xu Liu Shaogang Wang Zhonghua Zhang Huaiyu Ye Joint Lab for Advanced Semiconductor Packaging Technologies Joint Lab for Advanced Packaging and Testing Technology of Integrated Circuits School of Microelectronics Southern University of Science and Technology Shenzhen China Academy for Engineering&Technology Fudan University Shanghai China Electrical Engineering Mathematics and Computer Science Delft University of Technology Delft The Netherlands School of Medical Informatics Daqing Campus Harbin Medical University Daqing China
Substrate metallization is a crucial factor affecting the mechanical properties of sintered nanoparticles in microelectronics applications, as it is essential for ensuring good adhesion between the substrate and the s...
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Robust Wireless Power Transfer by Self-Oscillating Controlled Inverter and Circular Pads
Robust Wireless Power Transfer by Self-Oscillating Controlle...
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Electrical Machines and Drives (ICEMD), International Conference on
作者: Alireza Eikani Mohammad Amirkhani Hossein Jafari Sadegh Vaez-Zadeh Mojtaba Mirsalim Davood Arab Khaburi Advanced Motion Systems Research Lab School of Electrical and Computer Engineering College of Engineering University of Tehran Tehran Iran Department of Electrical Engineering Electrical Machines and Transformers Research Laboratory (EMTRL) Amirkabir University of Technology (Tehran Polytechnic) Tehran Iran Department of Electrical Engineering Iran University of Science and Technology Tehran Iran
Inductive wireless power transfer (WPT) faces significant challenges in achieving high efficiency and stable output power for charging mobile devices like EVs. Using circular pads (CP) as the transmitter (Tx) and rece...
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Environment-Aware Dynamic Graph Learning for Out-of-Distribution Generalization
arXiv
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arXiv 2023年
作者: Yuan, Haonan Sun, Qingyun Fu, Xingcheng Zhang, Ziwei Ji, Cheng Peng, Hao Li, Jianxin Beijing Advanced Innovation Center for Big Data and Brain Computing Beihang University China School of Computer Science and Engineering Beihang University China Key Lab of Education Blockchain and Intelligent Technology Guangxi Normal University China Department of Computer Science and Technology Tsinghua University China
Dynamic graph neural networks (DGNNs) are increasingly pervasive in exploiting spatio-temporal patterns on dynamic graphs. However, existing works fail to generalize under distribution shifts, which are common in real... 详细信息
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Sensitivity Study of Wafer-Level Packaging Lifetime Prediction Using Different Creep Constitutive Equations
Sensitivity Study of Wafer-Level Packaging Lifetime Predicti...
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Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-Systems EuroSimE
作者: C. E. Lee Cadmus Yuan K. N. Chiang Department of Power Mechanical Engineering National Tsing Hua University Hsinchu Taiwan R.O.C Department of Mechanical and Computer-aided Engineering Feng Chia University Taichung Taiwan R.O.C Advanced Microsystem Packaging and Nano-Mechanics Research Lab Taiwan R.O.C
Reliability is essential in electronic packaging development. Since low-cycle fatigue is a common WLP (Wafer-Level Packaging) solder joint failure mechanism, industries often apply the accelerated thermal cycle test t...
来源: 评论