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检索条件"机构=Advanced Functional Technology R&D Department"
1039 条 记 录,以下是951-960 订阅
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Characterization of strip induced damage in ultra low-k dielectric
Characterization of strip induced damage in ultra low-k diel...
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IEEE International Symposium on Semiconductor Manufacturing
作者: J.S. Tsai Y.N. Su r.Y. Huang J.M. Chiou J.H. Shieh H.Y. Chu J.J. Lee C.Y. Ting S.M. Jang M.S. Liang Advanced Module Technology Division R&D Taiwan Semiconductor Manufacturing Company Limited Hsinchu Taiwan Yield Enhancement Service Department Taiwan Semiconductor Manufacturing Company Limited Hsinchu Taiwan Process Failure Analysis Department Taiwan Semiconductor Manufacturing Company Limited Hsinchu Taiwan
STEM-EdS analysis on the sidewall surface of ultra low-k dielectric (ULK), a CVd SiOC type low-k dielectric (k /spl ap/ 2.5), has been performed to study the damage behavior of low-k material during strip. Carbon depl... 详细信息
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Fabrication of 3d trench PZT capacitors for 256Mbit FrAM device application
Fabrication of 3D trench PZT capacitors for 256Mbit FRAM dev...
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International Electron devices Meeting (IEdM)
作者: June-Mo Koo Bum-Seok Seo Sukpil Kim Sangmin Shin Jung-Hyun Lee Hionsuck Baik Jang-Ho Lee Jun Ho Lee Byoung-Jae Bae Ji-Eun Lim dong-Chul Yoo Soon-Oh Park Hee-Suk Kim Hee Han Sunggi Baik Jae-Young Choi Yong Jun Park Youngsoo Park Nano Devices Laboratory Samsung Advanced Institute of Technology Yongin si South Korea Nano Fabrication Center Samsung Advanced Institute of Technology Yongin si South Korea AE Center Samsung Advanced Institute of Technology Yongin si South Korea Process Development Team Semiconductor R&D Division Samsung Electronics Company Limited Yongin si South Korea Department of Materials Science and Engineering Pohang University of Science and Technology Pohang South Korea Pohang Accelerator Laboratory Pohang University of Science and Technology Pohang South Korea
We fabricated trench PbZr x Ti 1-x O 3 (PZT) capacitors that can be used in 256Mbit 1T-1C FrAM devices. The capacitor has 0.25mum diameter and 0.4mum depth. Three layers, Ir(20nm)/PZT(60nm)/Ir(20nm), were deposited i... 详细信息
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Characterization of a-SiCN:H Passivation Layer deposited by Hot Wire Chemical Vapor deposition using Hexamethyldisilazane
Characterization of a-SiCN:H Passivation Layer Deposited by ...
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第十五届国际光伏科学与工程大会
作者: Michio Otsubo Takehiko Sato Shinsuke Miyajima Amornrat Limmanee Tatsuro Watahiki Akira Yamada Makoto Konagai Department of Physical Electronics Tokyo Institute of Technology Tokyo 152-8552 Japan Material & Process Technology Department Advanced Technology R&D Center Mitsubishi Electric Corporation Kanagawa 229-1195 Japan Department of Physical Electronics Tokyo Institute of Technology Tokyo 152-8552 Japan Department of Physical Electronics Tokyo Institute of Technology Tokyo 152-8552 Japan Department of Physical Electronics Tokyo Institute of Technology Tokyo 152-8552 Japan Quantum Nanoelectronics Research Center Tokyo Institute of Technology Tokyo 152-8552 Japan Department of Physical Electronics Tokyo Institute of Technology Tokyo 152-8552 Japan
As a novel passivation film for silicon solar cells, hydrogenated amorphous silicon carbon nitride films were prepared by hot wire chemical vapor deposition using hexamethyldisilazane (HMdS). HMdS has significant adva... 详细信息
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Capacitance-Voltage Study of a-SiCN:H/Si Interfaces Fabricated by Hotwire Chemical Vapor deposition Using Hexamethyldisilazane
Capacitance-Voltage Study of a-SiCN:H/Si Interfaces Fabricat...
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第十五届国际光伏科学与工程大会
作者: Amornrat Limmanee Michio Otsubo Takehiko Sato Shinsuke Miyajima Tatsuro Watahiki Adash Sandhu Akira Yamada Makoto Konaga Department of Physical Electronics Tokyo Institute of Technology Tokyo 152-8552 Japan Department of Physical Electronics Tokyo Institute of Technology Tokyo 152-8552 Japan Material & Process Technology Department Advanced Technology R&D Center Mitsubishi Electric Corporation Kanagawa229-1195 Japan Department of Physical Electronics Tokyo Institute of Technology Tokyo 152-8552 Japan Department of Physical Electronics Tokyo Institute of Technology Tokyo 152-8552 Japan Quantum Nanoelectronics Research Center Tokyo Institute of Technology Tokyo 152-8552 Japan Quantum Nanoelectronics Research Center Tokyo Institute of Technology Tokyo 152-8552 Japan Department of Physical Electronics Tokyo Institute of Technology Tokyo 152-8552 Japan
In our previous work, we have found that hydrogenerated amorphous silicon carbon nitride films (a-SiCN:H) deposited by hotwire chemical vapor deposition (HWCVd) using hexamethyldisiIazane (HMdS) can be applied as an a... 详细信息
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Ultraviolet laser photoemission spectroscopy of FeSi: Observation of a gap opening in density of states
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Physical review B 2005年 第23期72卷 233202-233202页
作者: K. Ishizaka T. Kiss T. Shimojima T. Yokoya T. Togashi S. Watanabe C. Q. Zhang C. T. Chen Y. Onose Y. Tokura S. Shin Institute for Solid State Physics University of Tokyo Kashiwa Chiba 277-8581 Japan The Institute of Physical and Chemical Research (RIKEN) Wako Saitama 351-0198 Japan The Graduate School of Natural Science and Technology Okayama University Okayama 700-8530 Japan The Institute of Physical and Chemical Research (RIKEN) Sayo-gun Hyogo 679-5143 Japan Beijing Center for Crystal R&D Chinese Academy of Science Zhongguancun Beijing 100080 China Spin Superstructure Project ERATO Japan Science and Technology Agency (JST) Tsukuba 305-8562 Japan Department of Applied Physics University of Tokyo Tokyo 113-8656 Japan Correlated Electron Research Center (CERC) National Institute of Advanced Industrial Science and Technology (AIST) Tsukuba 305-8562 Japan
The temperature (T) dependent gap formation in the density of states (dOS) of FeSi has been investigated by angle-integrated laser photoemission spectroscopy (PES). With decreasing T, the evolution of a small gap (∼6...
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Nuclear data Evaluations for JENdL High‐Energy File
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AIP Conference Proceedings 2005年 第1期769卷 326-331页
作者: Y. Watanabe T. Fukahori K. Kosako N. Shigyo T. Murata N. Yamano T. Hino K. Maki H. Nakashima N. Odano S. Chiba *Department of Advanced Energy Engineering Science Kyushu University Kasuga Fukuoka 816‐8580 Japan †Japan Atomic Energy Research Institute Tokai‐mura Naka‐gun Ibaraki 319‐1195 Japan **Institute of Technology Shimizu Corporation Koto‐ku Tokyo 135‐8530 Japan ‡Department of Applied Quantum Physics and Nuclear Engineering Kyushu University Fukuoka 812‐8581 Japan §AITEL Corporation Kawasaki‐ku Kawasaki 210‐0862 Japan ¶Research Laboratory for Nuclear Reactors Tokyo Institute Technology Meguro‐ku Tokyo 152‐8550 Japan ‖Power & Industrial Systems R&D Laboratory Hitachi Ltd. Hitachi Ibaraki 319‐1221 Japan ††Comprehensive Research Organization for Science and Society Tsuchiura Ibaraki 300‐0810 Japan ‡‡National Maritime Research Institute Mitaka Tokyo 181‐0004 Japan
An overview is presented of recent nuclear data evaluations performed for the JENdL high‐energy (JENdL‐HE) file, in which neutron and proton cross sections for energies up to 3 GeV are included for the whole 132 nuc...
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On-chip network based embedded core testing
On-chip network based embedded core testing
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IEEE International SOC Conference
作者: Jong-Sun Kim Min-Su Hwang Seungsu roh Ja-Young Lee Kangmin Lee Se-Joong Lee Hoi-Jun Yoo Department of R&D System Integration and Intellectual Property Authoring Center Department of EECS Korea Advanced Institute of Science and Technology Daejeon South Korea
In this paper, network-based embedded core testing (NET) architecture is proposed. The test of individual embedded cores and their interconnection are possible in a system-on-chip (SoC) environment by using configurab... 详细信息
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A seamless handoff scheme for UMTS-WLAN interworking
A seamless handoff scheme for UMTS-WLAN interworking
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IEEE Conference and Exhibition on Global Telecommunications (GLOBECOM)
作者: Hyun-Ho Choi O. Song dong-Ho Cho Department of Electrical Engineering and Computer Science Korea Advanced Institute of Science and Technology South Korea Telecommunication R&D Center Samsung Electronics Company Limited South Korea
In this paper, we present a practical UMTS-WLAN interworking architecture based on 3GPP standards, and propose a seamless handoff scheme that guarantees low delay and low packet loss during UMTS-WLAN handoff. For low ... 详细信息
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Modeling and control of thermal microsystems  7th
Modeling and control of thermal microsystems
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7th International Symposium on advanced Control of Chemical Processes, AdCHEM 2003
作者: Lee, Yong Joon Sung, Su Whan Yoon, dae Sung Lim, Geunbae Park, Sunwon Department of Chemical and Biomolecular Engineering Center for Ultramicrochemical Process Systems Korea Advanced Institute of Science and Technology 373-1 Gusung-dong Yusung-gu Daejon305-701 Korea Republic of Corporate R&D LG Chem. Ltd. Research Park 104-1. Moonji-dong Yusung-gu Daejon305-380 Korea Republic of Biochip Project Team and MEMS Lab Samsung Advanced Institute of Technology San 14 Nongseo-Ri Kiheung-Eup Yongin-City Kyunggi-Do449-712 Korea Republic of
A thermal microsystem is developed which consists of a microreactor integrated with a platinum sensor/heater, and automation equipment/software such as data acquisition system, control program and graphic user interfa... 详细信息
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Modeling and Control of Thermal Microsystems
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IFAC Proceedings Volumes 2004年 第1期37卷 105-111页
作者: Yong Joon Lee Su Whan Sung dae Sung Yoon Geunbae Lim Sunwon Park Department of Chemical & Biomolecular Engineering and Center for Ultramicrochemical Process Systems Korea Advanced institute of Science and Technology 373-1 Gusung-dong Yusung-gu Daejon 305-701 KOREA Corporate R&D LG Chem. Ltd. Research Park 104-1 Moonji-dong Yusung-gu Daejon 305-380 KOREA Biochip Project Team and MEMS Lab. Samsung Advanced Institute of Technology San 14 Nongseo-Ri Kiheung-Eup Yongin-City Kyunggi-Do. 449-712. KOREA
A thermal microsystem is developed which consists of a microreactor integrated with a platinum sensor/heater, and automation equipment/software such as data acquisition system, control program and graphic user interfa... 详细信息
来源: 评论