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检索条件"机构=Advanced Lithography Process Technology Department Device Process Development Center"
37 条 记 录,以下是1-10 订阅
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Extreme Ultraviolet Scatterometry for Characterizing Nanometer Scale Features in a Damascene Sample
Extreme Ultraviolet Scatterometry for Characterizing Nanomet...
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2024 Frontiers in Optics, FiO 2024
作者: Klein, C. Jenkins, N. Shao, Y. Li, Y. Park, S. Kim, W. Kapteyn, H. Murnane, M. Department of Physics JILA STROBE NSF Science & Technology Center University of Colorado NIST BoulderCO United States Core Technology R&D Team Mechatronics Research Samsung Electronics Co. Ltd. Hwasung Korea Republic of Advanced Process Development Team 4 Semiconductor R&D Center Samsung Electronics Co. Ltd. Hwasung Korea Republic of Kapteyn-Murnane Laboratories Inc. 4775 Walnut Street #102 BoulderCO80301 United States
We characterize nanoscale out-of-plane features on an industrially relevant semiconductor sample using a coherent extreme ultraviolet high harmonic generation source at 29nm. The advantages of using 13.5nm light are a... 详细信息
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The staggered-layer induced elasticity strengthening mechanism in flexible Bi2Te3
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Matter 2025年
作者: Huang, Xiege Wu, Luoqi Hu, Mingyuan Feng, Xiaobin Zhai, Pengcheng Li, Wenjuan Duan, Bo He, Jiaqing Li, Guodong Zhang, Qingjie Goddard, William A. Hubei Key Laboratory of Theory and Application of Advanced Materials Mechanics School of Physics and Mechanics Wuhan University of Technology Wuhan430070 China Guangdong Provincial Key Laboratory of Advanced Thermoelectric Materials and Device Physics Shenzhen Key Laboratory of Thermoelectric Materials and Department of Physics Southern University of Science and Technology Shenzhen518055 China State Key Laboratory of Advanced Technology for Materials Synthesis and Processing Wuhan University of Technology Wuhan430070 China Materials and Process Simulation Center California Institute of Technology PasadenaCA91125 United States
Wearable flexible devices require the development of thermoelectric (TE) materials with high strength, excellent elastic bendability, and superior ductility. Here we report a staggered-layer strategy that overcomes th... 详细信息
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Optimized EUV Scatterometry Measurements with Tunable High Harmonic Generation and the Fisher Information Matrix
Optimized EUV Scatterometry Measurements with Tunable High H...
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Metrology, Inspection, and process Control XXXIX 2025
作者: Klein, Clay Jenkins, Nicholas Shao, Yunzhe Li, Yunhao Park, Seungbeom Kim, Wookrae Kapteyn, Henry Murnane, Margaret Department of Physics JILA & STROBE NSF Science & Technology Center University of Colorado NIST BoulderCO United States Core Technology R&D Team Samsung Electronics Co. Ltd. Hwasung Korea Republic of Advanced Process Development Team 4 Semiconductor R&D Center Samsung Electronics Co. Ltd. Hwasung Korea Republic of Kapteyn-Murnane Laboratories Inc. 4775 Walnut Street #102 BoulderCO80301 United States
We present the use of high harmonic generation (HHG) to achieve sub-nanometer sensitivity to out-of-plane geometric features on an industrially relevant damascene sample with extreme ultraviolet (EUV) scatterometry. W... 详细信息
来源: 评论
Enhanced etch characteristics of EUV PR masked SiON through the ion beam grid pulsing technique
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Scientific Reports 2025年 第1期15卷 1-11页
作者: Kwon, Hae In Jang, Yun Jong Kim, Kyoung Chan Gil, Hong Seong Kim, Ju Young Ryu, Seong Hyun Pyun, Do Seong Kim, Dae Whan Park, Woo Chang Lee, Ji Yeon Park, Jin Woo Park, Sang Wuk Yeom, Geun Young School of Advanced Materials Science and Engineering Sungkyunkwan University Suwon 16419 South Korea Department of Photovoltaic System Engineering Sungkyunkwan University Suwon 16419 South Korea School of Chemical Engineering Sungkyunkwan University Suwon 16419 South Korea Department of Semiconductor Display Engineering Sungkyunkwan University Suwon 16419 South Korea Advanced Process Development Semiconductor R & D Center Samsung Electronics Co. Ltd. Hwaseong 18448 South Korea SKKU Advanced Institute of Nano Technology (SAINT) Sungkyunkwan University Suwon 16419 South Korea
EUV lithography technology, applied in nano-patterning processes, enables the creation of fine patterns below 10 nm. However, issues still remain due to the reduced etch selectivity and increased line edge roughn... 详细信息
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Nonlinear Behavior of Surface Charge Density and Zeta Potential in Microchannel Electrokinetic Flow
SSRN
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SSRN 2023年
作者: Chen, Daming Arancibia-Miranda, Nicolas Escudey, Mauricio Fu, Jiao Lu, Qin Amon, Cristina H. Galatro, Daniela Guzmán, Amador M. Facultad de Ingeniería Departamento de Ingeniería Mecánica Universidad de Santiago de Chile Av. B. O’Higgins 3363 Santiago9170020 Chile Center for the Development of Nanoscience and Nanotechnology CEDENNA Santiago9170124 Chile Facultad de Química y Biología Universidad de Santiago de Chile Av. B. O’Higgins Santiago3363 Chile Xi'an key laboratory of advanced control and intelligent process Xi'an University of Posts and Telecommunications Xi'An710121 China Solar and Thermal Energy Conversion and Storage Device and System Laboratory STECTEC Santiago Chile Escuela de Ingenieria Industrial Facultad de Ingenieria y Ciencias Universidad Diego Portales Ejercito 441 Santiago Chile Department of Mechanical and Industrial Engineering Faculty of Applied Science and Engineering University of Toronto 5 King’s College Road TorontoON Canada Department of Chemical Engineering and Applied Chemistry Faculty of Applied Science and Engineering University of Toronto 200 College Street TorontoON Canada
In this work, a combined numerical and experimental investigation of the surface charge density and zeta potential behavior is investigated for borosilicate immersed in KCl and NaCl electrolytes and for imogolite imme... 详细信息
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MOF-based high-entropy-alloy evaporator featuring enhanced interband transitions for efficient solar steam and green electricity generation
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Chemical Engineering Journal 2025年 517卷
作者: Dai, Chenyang Zhang, Jia-Han He, Cheng-Yu Dai, Rongrong Pan, Likun Yamauchi, Yusuke Zhang, Jing Li, Zhengtong Xu, Xingtao Marine Science and Technology College Zhejiang Ocean University Zhoushan316022 China Electronic-Photonic Smart Sensing Device R&D Team Inner Mongolia Key Laboratory of Intelligent Communication and Sensing and Signal Processing School of Electronic Information Engineering Inner Mongolia University Hohhot010021 China Research Center of Resource Chemistry and Energy Materials State Key Laboratory of Solid Lubrication Lanzhou Institute of Chemical Physics Chinese Academy of Sciences Lanzhou China Shanghai Key Laboratory of Magnetic Resonance School of Physics and Electronic Science East China Normal University Shanghai200026 China Department of Materials Process Engineering of Engineering Nagoya University Nagoya464-8603 Japan The University of Queensland BrisbaneQLD4072 Australia Department of Chemical and Biomolecular Engineering Yonsei University 50 Yonsei-ro Seodaemun-gu Seoul03722 Korea Republic of Ningbo Key Laboratory of Green Petrochemical Carbon Emission Reduction Technology and Equipment Zhejiang Institute of Tianjin University Zhejiang Ningbo315201 China State Key Laboratory of Hydrology-Water Resources and Hydraulic Engineering Yangtze Institute for Conservation and Development Hohai University Nanjing210098 China
Photothermal materials exhibiting broadband optical absorption and high energy efficiency are highly sought after in the field of solar-driven evaporation. Herein, we present a novel photothermal material derived from... 详细信息
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Single-stripe tunable laser with chirped sampled gratings fabricated by nanoimprint lithography
Single-stripe tunable laser with chirped sampled gratings fa...
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作者: Yoshinaga, Hiroyuki Yanagisawa, Masaki Kaneko, Toshimitsu Akiyama, Kan Tajima, Mikio Shoji, Daisei Fujii, Takuya Shoji, Hajime Transmission Devices R and D Laboratories Sumitomo Electric Industries Ltd Yokohama 244-8588 Japan Lightwave Device Process Development Department Sumitomo Electric Device Innovations Inc Yokohama 244-0845 Japan Analysis Technology Research Center Sumitomo Electric Industries Ltd Yokohama 244-8588 Japan
The fabrication of diffraction gratings of a chirped sampled gratings distributed reflector (CSG-DR) laser by nanoimprint lithography (NIL) has been demonstrated. The diffraction gratings with highly uniform linewidth... 详细信息
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4$\,\times\,$10 Gb/s High-Speed Link Over Thin GI 50/125 Plastic Optical Fibers and Compact Optical Sub-Assembly
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IEEE Photonics technology Letters 2012年 第19期24卷 1670-1672页
作者: Norbert Schlepple Michihiko Nishigaki Hiroshi Uemura Kei Obara Hideto Furuyama Yoshiaki Sugizaki Hideki Shibata Yasuhiro Koike Advanced BEOL Technology Department Device Process Development Center Corporate Research and Development Center Toshiba Corporation Yokohama Japan Faculty of Science and Technology Keio University Kanagawa Japan
We introduce an extremely thin 50/125 perfluorinated graded-index plastic optical fiber (POF) and its application in a 4×10 Gb/s optical link including our optical sub-assembly (OSA). We outline the main characte... 详细信息
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Design intent utilization for lithography compliance check and layout refinement to improve manufacturability
Design intent utilization for lithography compliance check a...
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2011 e-Manufacturing and Design Collaboration Symposium, eMDC 2011 and International Symposium on Semiconductor Manufacturing, ISSM 2011
作者: Kobayashi, Sachiko Ikeuchi, Atsuhiko Kimura, Kazunari Kotani, Toshiya Tanaka, Satoshi Kyoh, Suigen Maeda, Shimon Inoue, Soichi Advanced Lithography Process Technology Department Device Process Development Center Toshiba Corporation Japan Design Technology Development Dept. Analog and Imaging Ic Div. Toshiba Corporation Semiconductor Company Japan
• Design rule shrinkage causes a problem with critical circuit performance vulnerable to process variability. • Design-aware manufacturing flow to clarify the design intent and control CD spec. in manufacturing is pro... 详细信息
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All-out fight against yield losses by design-manufacturing collaboration in nano-lithography era  11
All-out fight against yield losses by design-manufacturing c...
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Asia and South Pacific Design Automation Conference
作者: Soichi Inoue Sachiko Kobayashi Advanced Lithography Process Technology Department Device Process Development Center Corporate Research and Development Center Toshiba Corporation Japan
The concept of design-manufacturing collaboration for nano-lithography era has been clarified. The novel design-manufacturing system that the manufacturing tolerance reflecting design intention properly can be allocat... 详细信息
来源: 评论