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IEEE/SEMI Conference and Workshop on advanced Semiconductor Manufacturing

作者： Yuan-Chieh Chiu Shu-Sheng Yu Fang-Hao Hsu Hong-Ji Lee Nan-Tzu Lian Tahone Yang Kuang-Chao Chen Chih-Yuan Lu Technology Development Center Advanced Module Process Development Division Macronix International Company Limited Hsinchu Taiwan

The TiN was conventionally used as barrier layers for both tungsten plug and AlCu metal lines. This paper reveals a novel back end of line (BEOL) self-aligned double patterning (SADP) technology, which applied TiN as a spacer material. The relative processes are introduced and discussed in detail. The new SADP approach was further applied for Cu damascene structure constructions in the advanced non-volatile memory (NVM).

关键词： Tin Silicon compounds Materials Plasmas Lithography Flash memory

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Synthesis of vinyl ester and it blending with upr to prepare electrically insulating composite with improved mechanical properties

Synthesis of vinyl ester and it blending with upr to prepare...

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International Conference on Properties and Applications of Properties and Applications of Dielectric Materials

作者： Subhendu Bhattacharya Sandip Patil Lokesh Chaudhari Sarojini Swain Ram Avatar Sharma Vinay Chaudhary CG Global Research and Development Centre Advanced Materials and Process Technology Centre Mumbai India

Vinyl ester was prepared from diglycidyl ether of bisphenol A and methacrylic acid with Styrene as *** vinyl ester resin is used as crosslinking agent for unsaturated polyester resin (Prepared from maleic anhydride, propylene glycol, pthalic anhydride as 1:2:1 ratio) with Styrene as diluent using free radical initiator (MEKP) and accelerator the blending with UPR & vinyl ester is carried out. The mechanical & electrical properties of cured UPR-VE blending were evaluated. The mechanical properties of UPR-VE composite in different vinyl ester concentration (2.5-20%) were evaluated. Increasing the vinyl ester concentration up to certain extent there is pronounced improvement in mechanical properties was observed. The electrical properties such as dielectric strength, dry arc resistance, CTI, Surface and volume resistivity also increase. The chemical resistance of cured resin was evaluated through water (for 7 day), solvent such as acetone, toluene & naoh measured.

关键词： Resins Chemicals Resistance Glass Mechanical factors Dielectric breakdown Resistance heating

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4$\,\times\,$10 Gb/s High-Speed Link Over Thin GI 50/125 Plastic Optical Fibers and Compact Optical Sub-Assembly

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IEEE Photonics technology Letters 2012年第19期24卷 1670-1672页

作者： Norbert Schlepple Michihiko Nishigaki Hiroshi Uemura Kei Obara Hideto Furuyama Yoshiaki Sugizaki Hideki Shibata Yasuhiro Koike Advanced BEOL Technology Department Device Process Development Center Corporate Research and Development Center Toshiba Corporation Yokohama Japan Faculty of Science and Technology Keio University Kanagawa Japan

We introduce an extremely thin 50/125 perfluorinated graded-index plastic optical fiber (POF) and its application in a 4×10 Gb/s optical link including our optical sub-assembly (OSA). We outline the main characteristics of the POF before the introduction of the fibers to our already established OSA is explained. Particularly low attenuation with error-free transmission down to a bending radius of 1 mm is presented in comparison to a quartz optical fiber. Furthermore eye diagrams of all four channels after 5 m over POF at 10 Gb/s are presented. Bit error rate for all channels is less than 10 -12 and remains constant when another channel is being driven simultaneously.

关键词： Optical fibers Optical attenuators Optical fiber devices Optical fiber cables Optical receivers

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Quantitative Analysis of the Removal Ratio of Fine Particles in Water by Gas Bubbling

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Journal of Iron and Steel Research International 2011年第S2期18卷 331-334页

作者： Masafumi Miyazaki Hideaki Yamamura Satoru Mineta Takehiko Toh Environment & Process Technology Center Technical Development Bureau Nippon Steel Corp. Japan Advanced Technology Research Lab. Technical Development Bureau Nippon Steel Corp. Japan

Removal of non-metallic inclusions in molten steel is important from the viewpoint of improvement of quality, property and yield of the products. As a removal method of inclusions from molten metal, gas bubble flotation adhering inclusions is well known. Gas bubbling is particularly effective for the removal of fine inclusions. Water model experiment is reported the quantitative analysis of the removal ratio of dispersed particles removed from water by gas bubbles.

关键词： inclusion gas bubble water model experiment removal constant collision attachment

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Design intent utilization for lithography compliance check and layout refinement to improve manufacturability

Design intent utilization for lithography compliance check a...

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2011 e-Manufacturing and Design Collaboration Symposium, eMDC 2011 and International Symposium on Semiconductor Manufacturing, ISSM 2011

作者： Kobayashi, Sachiko Ikeuchi, Atsuhiko Kimura, Kazunari Kotani, Toshiya Tanaka, Satoshi Kyoh, Suigen Maeda, Shimon Inoue, Soichi Advanced Lithography Process Technology Department Device Process Development Center Toshiba Corporation Japan Design Technology Development Dept. Analog and Imaging Ic Div. Toshiba Corporation Semiconductor Company Japan

ISBN: (纸本)9781457716478

• Design rule shrinkage causes a problem with critical circuit performance vulnerable to process variability. • Design-aware manufacturing flow to clarify the design intent and control CD spec. in manufacturing is proposed. • This flow implemented an extraction and automatic fixing in electrically critical spot based on design intent of EM and crosstalk. • Combination of design intent and automatic hot spot fixer is available for desired circuit pattern without burden. • This flow is expected to drastically reduce the lead time and cost in both design and manufacturing. © 2011 TSIA.

关键词： Manufacture

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Extremely small 40 GBPS optical interconnection sub-assembly using GI 50/125 thin plastic optical fibers

Extremely small 40 GBPS optical interconnection sub-assembly...

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20th International Conference on Plastic Optical Fibers, POF 2011

作者： Nishigaki, M. Schlepple, N. Obara, K. Uemura, H. Furuyama, H. Sugizaki, Y. Shibata, H. Advanced BEOL Technology Department Device Process Development Center Corporate Research and Development Center/Toshiba Corporation 8 Shinsugita-Cho Isogo-Ku Yokohama 235-8522 Japan

An extremely small optical interconnection sub-assembly, which carries large-capacity signal transmissions of 40 Gbps and fits in the connector plug of an active optical cable, has been developed. The optical sub-assembly (OSA) fabricated by easy steps and solely passive alignment is composed of an ultracompact optoelectronic (OE) ferrule and four thin graded-index plastic optical fibers. The active optical cable using the OSA is a promising application for digital consumer electronics such as 4k2k high definition video.

关键词： Plastic optical fibers

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P-60: OLED Failure Analysis and Pinpoint Shot Repair of Fault using an Optical Coaxial System of High Sensitive CCD and a Laser

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SID Symposium Digest of Technical Papers 2012年第1期37卷

作者： Mitsutoshi Akatsu Naganori Tsutsui Nobuhito Miura Yoshihiro Miyazaki Process & Test Equipment International Test & Engineering Services Co. Ltd. Japan Advanced Technology Development International Test & Engineering Services Co. Ltd. Japan

A new concept of defect isolation and pinpoint laser repair to the isolated defect in OLED devices has been studied. High sensitive CCD has been combined with laser system (YAG: 532nm) on coaxial optics. An OLED has been submitted for defect isolation and laser repairing. The detected tiny size fault of some μm has been repaired by laser precision shot. As the result of this study, it is cleared that this method has effective to recover the OLED device function as I-V characteristic and to improve OLED reliability lifetime.

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All-out fight against yield losses by design-manufacturing collaboration in nano-lithography era 11

All-out fight against yield losses by design-manufacturing c...

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Asia and South Pacific Design Automation Conference

作者： Soichi Inoue Sachiko Kobayashi Advanced Lithography Process Technology Department Device Process Development Center Corporate Research and Development Center Toshiba Corporation Japan

ISBN: (纸本)9781424475162

The concept of design-manufacturing collaboration for nano-lithography era has been clarified. The novel design-manufacturing system that the manufacturing tolerance reflecting design intention properly can be allocated to the layout has been proposed. According to the system, one can assign the “weak portion” explicitly on the layout, and can control the process for reducing the burden of manufacturing and further getting higher yield. More specifically, the extraction of electrically critical portion and conversion to the manufacturing tolerance has been demonstrated. The tolerance has applied to reduce computational burden of mask data preparation. Besides, the yield model-based layout scoring system has been also suggested to be significant remarkably. One can check the layout and modify not to loose the yield. Creation of yield function, layout scoring, and layout modification based upon the yield model have been demonstrated.

关键词： Layout Optimization Crosstalk Logic gates Lithography Collaboration

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Separation of NBTI component from channel hot carrier degradation in pMOSFETs focusing on recovery phenomenon

Separation of NBTI component from channel hot carrier degrad...

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2011 IEEE International Conference on Integrated Circuit Design and technology, ICICDT 2011

作者： Mitani, Y. Fukatsu, S. Hagishima, D. Matsuzawa, K. Advanced LSI Technology Laboratory Corporate R and D Center Toshiba Corporation Yokohama 235-8522 Japan Device Process Development Center Toshiba Corporation Toshiba Semiconductor Company Japan

ISBN: (纸本)9781424490202

Channel hot-carrier (CHC) degradation becomes more critical as the channel length is reduced. In general, CHC degradation is evaluated using DC stress applying both gate and drain bias. However, in the case of p-channel MOSFETs, negative bias temperature instabilities (NBTI) also degrades threshold voltage (VTH) and saturation drain current (Isat) under DC stress applying gate bias. Therefore, CHC degradation might include the NBTI component, which would lead to over-estimate the CHC degradation. Therefore, a separation of the BTI component from CHC degradation is necessary to predict device lifetime more accurately. In this study, a simple separation method of NBTI and CHC component from CHC test data is proposed, focusing on the recovery phenomenon, which is a distinctive behavior of NBTI. © 2011 IEEE.

关键词： Negative bias temperature instability

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Design intent application to tolerance-based manufacturing system

Design intent application to tolerance-based manufacturing s...

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作者： Kobayashi, Sachiko Tanaka, Satoshi Kyoh, Suigen Maeda, Shimon Kajiwara, Masanari Inoue, Soichi Nakamae, Koji Toshiba Corporation Advanced Lithography Process Technology Department Device Process Development Center 8 Shinsugita-cho Isogo-ku Yokohama City Kanagawa-Pref 235-8522 Japan Osaka University Graduate School of Information Science and Technology 2-1 Yamada-oka Suita-shi Osaka Japan

Continuous shrinkage of the design rule in large-scale integrated circuit devices brings about greater difficulty in the manufacturing process. The keys to meeting small process margin are adequate extraction of critical dimension tolerance for each object, considering design intent in terms of electrical behavior, and assigning the tolerance for each process step. However, once the design data are converted to layout data and signed off, most of the design intent is abandoned and unrecognized in the process phase. Thus, uniform and redundant tolerance is used, and therefore, excess tolerance is assigned for some layouts. To solve the problem described above, a tolerance-based manufacturing system utilizing flexible layout-dependent speculation derived from design intent has been discussed. Using a 40-nm node test chip, electrically critical spots, such as timing, cross-talk noise, electromigration, with small margins are extracted, assigned to the physical layout, and utilized in the manufacturing process. The flow is applicable for optical proximity effect correction (OPC) turnaround time reduction, optimization of OPClithography compliance check (LCC) specification, and failure-analysis acceleration. Consequently, a design-intent-aware manufacturing system is promising for realizing proper process specifications and computational cost reduction, in addition to yield enhancement. © 2011 Society of Photo-Optical Instrumentation Engineers (SPIE).

关键词： Specifications

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