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作者： Jang, Jin Man Lee, Hyeongjae Lee, Wonsik Kim, Yong-In Ko, Se-Hyun Kim, Jong Ha Lee, Jai-Sung Choi, Joon-Phil Advanced Fusion Process R and D Group Korea Institute of Industrial Technology Incheon 406-840 Korea Republic of Adnaced Development Team PIM KOREA Gyeongsan Gyeongbuk 712-831 Korea Republic of Department of Metallurgy and Materials Science Hanyang University-ERICA Ansan Gyeonggi 426-791 Korea Republic of

Methods to evaluate powder injection molding feedstock without performing the complete processing were developed to reduce the developmentto- commercialization cycle time for feedstock. The mixing homogeneity of the powder and binder, rheological properties, mechanical property and shape retainability during debinding were characterized to evaluate the feedstock. The validity of using these parameters was investigated through comparison with various feedstocks. Based on these results, the evaluation methods developed in this work have potential to aid in the selection of proper feedstock without undergoing the subsequent processing. © 2014 The Japan Society of Applied Physics.

关键词： Feedstocks

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A novel PSWT-DTW approach for analyzing pseudo-periodic signals

A novel PSWT-DTW approach for analyzing pseudo-periodic sign...

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IEEE Point-of-Care Healthcare Technologies (PHT)

作者： Aniruddha Joshi Sharat Chandran V.K. Jayaraman B.D. Kulkarni Department of Computer Science and Engineering Indian Institute of Technology Bombay Mumbai India Scientific and Engineering Computing Group Centre for Development of Advanced Computing Pune India Chemical Engineering and Process Development Division National chemical Laboratory Pune India

Pseudo-periodic signals are rampant in biomedical applications but are difficult to analyze. One approach is to compute time domain parameters of each individual cycle in the pseudo-periodic signal. The classic approach requires repeated computation in each cycle, which tends to be either error prone, computationally burdensome, or requires manual effort. We provide a novel combination of the pitch synchronous wavelet transform which when combined with dynamic time warping results in effective quantification of cycles in the pseudo-periodic signal. We demonstrate our application of this method in studying the arterial pulse. The results show that our approach is feasible and effective, and confirms further scope in other applications.

关键词： Market research Discrete wavelet transforms Time domain analysis Manuals Physiology

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Grain Engineering Approaches for High-Performance Polysilicon Thin-Film Transistor Fabrication

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MRS Online Proceedings Library 2011年第1期508卷 55-65页

作者： G. K. Giust T. W. Sigmon Memory Technology & Integration LSI Logic Santa Clara USA Advanced Process and Development Group Lawrence Livermore National Laboratory Livermore USA

Using an approach we call “grain engineering,” we discuss several techniques to control grain growth during excimer laser annealing, to create low-defect density polysilicon films. By adjusting of laser parameters, for example, we obtain polysilicon films with grain sizes of more than 9 µm, without substrate heating. These high-quality films are used in the fabrication of low-temperature unhydrogenated polysilicon thin-film transistors (TFT’s) yielding mobilities of > 260 cm2/Vs and on/off current ratios > 107. We investigate the laser recrystallization of “prepatterned” films as another technique of grain engineering. We find the performance of TFT’s fabricated in active areas that are prepatterned before laser recrystallization is dramatically improved compared to those TFT’s fabricated from the laser recrystallization of blanket polysilicon films. A novel “recessed” structure is also examined as a new grain engineering tool. By depositing a blanket silicon film on a patterned oxide layer on a heat sink, the heat flow through the continuous silicon film may be controlled during laser recrystallization to simultaneously produce adjacent regions of remarkably different grain microstructure.

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Design intent utilization for lithography compliance check and layout refinement to improve manufacturability

Design intent utilization for lithography compliance check a...

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IEEE International Symposium on Semiconductor Manufacturing

作者： Sachiko Kobayashi Atsuhiko Ikeuchi Kazunari Kimura Toshiya Kotani Satoshi Tanaka Suigen Kyoh Shimon Maeda Soichi Inoue Advanced Lithography Process Technology Department Device Process Development Center Corporate Research & Development Center Toshiba Corporation Japan Design Methodology Development Group Design Technology Development Department Analog & Imaging Ic Division Toshiba Corporation Semiconductor Company Japan

A collection of slides from the authors conference presentation about the design intent utilization for lithography compliance check and layout refinement to improve manufacturability is presented.

关键词： Lithography Timing Data mining Loss measurement Wires Design methodology

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Robust porous SiOCH (k=2.5) for 28nm and beyond technology node

Robust porous SiOCH (k=2.5) for 28nm and beyond technology n...

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IEEE International Conference on Interconnect technology

作者： Janghee Lee Sang Hoon Ahn Insun Jung Kyu-Hee Han Gyeonghee Kim Sang-Don Nam Woo Sung Jeon Byeong Hee Kim Gil Heyun Choi Siyoung Choi Ho-Kyu Kang Chilhee Chung Process Development Team Semiconductor Research and Development Center Samsung Electronics Company Limited Hwasung Gyeonggi South Korea AE Center Analytical Engineering Group Samsung Advanced Institute of Technology Yongin si Gyeonggi South Korea

Robust p-SiOCH was deposited in a PECVD reactor using Si precursor with Si-C-C-Si bond structure. It achieved its elastic modulus of 8.4GPa at k=2.55, comparable to the reference silica-based p-SiOCH that has been widely evaluated among the major chipmakers. However, its post-integration k increase was ~0.1 on a 100nm-pitched single damascene line and negligible on a 90nm-pitched trench first metal hardmask dual damascene line. Its superb performance in plasma damage resistance without the sacrifice in its mechanical strength can be attributed to the presence of bridged carbon(s) between Si atoms in addition to the methyl functional group. According to 29 Si and 13 C nuclear magnetic resonance (NMR) spectra, bridged carbon and carbon in the methyl group exist approximately in 1:1 ratio in the robust p-SiOCH.

关键词： Robustness Carbon Plasmas Nuclear magnetic resonance Silicon Atomic measurements Resistance

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Robust porous SiOCH (k=2.5) for 28nm and beyond technology node

Robust porous SiOCH (k=2.5) for 28nm and beyond technology n...

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IEEE International Interconnect technology Conference and Materials for advanced Metallization

作者： Lee, Janghee Ahn, Sang Hoon Jung, Insun Han, Kyu-Hee Kim, Gyeonghee Nam, Sang-Don Jeon, Woo Sung Kim, Byeong Hee Choi, Gil Heyun Choi, Siyoung Kang, Ho-Kyu Chung, Chilhee Process Development Team Semiconductor RandD Center Samsung Electronics Co. Ltd. San#16 Banwol-Dong Hwasung City Gyeonggi-Do 445-701 Korea Republic of Analytical Engineering Group AE Center Samsung Advanced Institute of Technology Nongseo-Dong Kiheung Ku Yongin-City Gyeonggi-Do 446-712 Korea Republic of

ISBN: (纸本)9781457705038

Robust p-SiOCH was deposited in a PECVD reactor using Si precursor with Si-C-C-Si bond structure. It achieved its elastic modulus of 8.4GPa at k=2.55, comparable to the reference silica-based p-SiOCH that has been widely evaluated among the major chipmakers. However, its post-integration k increase was ∼ 0.1 on a 100nm-pitched single damascene line and negligible on a 90nm-pitched trench first metal hardmask dual damascene line. Its superb performance in plasma damage resistance without the sacrifice in its mechanical strength can be attributed to the presence of bridged carbon(s) between Si atoms in addition to the methyl functional group. According to 29Si and 13C nuclear magnetic resonance (NMR) spectra, bridged carbon and carbon in the methyl group exist approximately in 11 ratio in the robust p-SiOCH. © 2011 IEEE.

关键词： Carbon

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Damage detection of composite structures by life-cycle strain mapping using FBG sensors

Damage detection of composite structures by life-cycle strai...

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SAMPE Tech 2011 Conference and Exhibition: Developing Scalable Materials and processes for Our Future

作者： Takahashi, Ichiya Sekine, Kazushi Kume, Masami Takeya, Hajime Iwahori, Yutaka Shu, Minakuchi Takeda, Nobuo Enomoto, Kiyoshi Advanced Technology R and D Center Mitsubishi Electric Corporation 8-1-1 Tsukaguchi-Hommachi Amagasaki Hyogo 661-8661 Japan Advanced Composite Group Aerospace Research and Development Japan Aerospace Exploration Agency 6-13-1 Osawa Mitaka Tokyo 181-0015 Japan Graduate School of Frontier Sciences University of Tokyo 5-1-5 Kashiwanoha Kashiwa Chiba 277-8561 Japan Materials Process Technology Center 3-5-8 Shibakoen Minato-ku Tokyo 105-0011 Japan

ISBN: (纸本)9781934551103

We propose structural health monitoring (SHM) technology based on the strain mapping of composite airframe structures through their life cycles including the stages of molding, machining, assembling, operation and maintenance. Our SHM system detects damages and deformation harmful to the structures by strain mapping using fiber Bragg grating (FBG) sensors. FBG sensors are suitable for life-cycle strain monitoring because reflection spectra of FBG sensors correspond to the strain applied to FBGs, which enables us to measure the strain change since the sensors were installed in structures. In this report, we conducted strain monitoring test of skin-stringer panel specimens with debondings which had different sizes and were inserted in different locations of specimens. It was confirmed that strain distribution varied with debonding size and inserted locations. In addition, we conducted strain monitoring test of open-hole CFRP panel under cyclic loading. We observed damages around the open holes of the specimen with pulse thermography. As a result, strain changed according to the initiation and propagation of delaminations. These two results demonstrate that FBG sensors can detect stringer debondings and delaminations at bolt holes which arise in composite airframe structures due to operational load in flight.

关键词： Debonding

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0.25μm, 20V High Performance Complementary Bipolar Transistor with Dual EPI and Oxide-Filled Deep Trench Isolation for High Frequency DC-DC Converters

0.25μm, 20V High Performance Complementary Bipolar Transist...

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IEEE International Symposium on Power Semiconductor Devices and ICs

作者： T. Kwon S. Haynie A. Sadovnikov P. Allard J. Strout A. Strachan Advanced Process Technology Development Group National Semiconductor Santa Clara CA USA

ISBN: (纸本)9781424484256

Power supply designers must increase the switching frequency of converters to meet industry demands for small sizes. In order to handle high switching frequency, a closed-loop DC-DC converter needs a high-speed error amplifier with low Rdson. Qg LDMOS power switches. In this paper, 0.25μm, 20V high performance complementary bipolar transistors were developed for the high-speed error amplifier design. Dual epi was used to suppress parasitic bipolar behavior that leads to a latch-up. Also, an oxide-filled deep trench isolation was used to minimize parasitic capacitance. As a result, robust 5GHz NPN and 3GHz PNP transistors were integrated with a low Rdson. Qg LDMOS.

关键词： trench isolation DC converter DC to DC converters Parasitic capacitance error amplifier Converters Transistor Device Component DC-DC power convertors LDMOS HIGH-PERFORMANCE Latch Device Component ambipolar Switching frequency Complementary

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Life cycle strain mapping of composite airframe structures for health monitoring by using FBG sensors

Life cycle strain mapping of composite airframe structures f...

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作者： Takahashi, Ichiya Sekine, Kazushi Takeya, Hajime Iwahori, Yutaka Minakuchi, Shu Takeda, Nobuo Koshioka, Yasuhiro Advanced Technology R and D Center Mitsubishi Electric Corporation 8-1-1 Tsukaguchi-Hommachi Amagasaki Hyogo 661-8661 Japan Advanced Composite Group Aerospace Research and Development Directorate Japan Aerospace Exploration Agency 6-13-1 Osawa Mitaka Tokyo 181-0015 Japan Graduate School of Frontier Sciences University of Tokyo 5-1-5 Kashiwanoha Kashiwa Chiba 277-8561 Japan Materials Process Technology Center 3-5-8 Shibakoen Minato-ku Tokyo 105-0011 Japan

ISBN: (纸本)9781934551080

The purpose of this research is to develop structural health monitoring technology based on the strain mapping of composite airframe structures through their life cycles. We conducted the evaluation tests for damage detection in CFRP pressure bulkheads using FBG sensors and verified the damage detection ability and accuracy of FBG sensors on various modes of damages and deformation. As a result, damages and deformation can be detected as the changes in strain distribution measured by FBG sensors. Moreover, these changes agree well with numerical simulation. These results demonstrate that the strain mapping by FBG sensors can be used for damage detection of the CFRP pressure bulkhead.

关键词： Damage detection

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Robust spin-on glass gap-fill process technology for sub-30nm interlayer dielectrics

Robust spin-on glass gap-fill process technology for sub-30n...

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IEEE International Conference on Interconnect technology

作者： Kyung-Mun Byun Deok-Young Jung Jun-Won Lee Seungheon Lee Hyongsoo Kim Mun-Jun Kim Eunkee Hong Mansug Gang Seok-Woo Nam Joo-Tae Moon Chilhee Chung Jung-Hoo Lee Hyo-Sug Lee Process Development Team Semiconductor Research and Development Center USA Manufacturing Technology Team Infra Technology Service Center Semiconductor Business Samsung Electronics Company Limited Hwasung Gyeonggi South Korea Material Application Group Materials Research Center Samsung Advanced Institute of Technology Samsung Electronics Company Limited Yongin si Gyeonggi South Korea

ISBN: (纸本)9781424476763;9781424476770

A highly robust gap-fill process technology of spin-on glass (SOG) was developed for the interlayer dielectric (ILD) in sub-30 nm devices. We revealed that the filling behavior of SOG within gaps during spin-coating is mainly dependent on the capillary effect. The highly wettable surface treatment prior to SOG coating was found to enhance the gap-fill performance remarkably. This technique plays a key role in maximizing capillary effect by raising surface wettability. The filling capability was also improved by optimization of baking temperature to minimize the viscosity of SOG. It was finally found that the defects of contact bridges due to poor filling of SOG were reduced to be almost free by those unique process refinements.

关键词： Robustness Glass Filling Bridges Coatings Dielectric devices Dielectric materials Semiconductor materials Surface treatment Plasma temperature

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