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检索条件"机构=Advanced Process and Technology Development"
362 条 记 录,以下是271-280 订阅
排序:
Monitoring and optimizing PID loop performance
Monitoring and optimizing PID loop performance
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4th Annual Emerging Technologies Conference, ISA EXPO 2004
作者: Burch, Randy Advanced Process Control Software Development Aspen Technology. Inc. Houston TX 77077
Implementation of a Distributed Control System (DCS) provides for significant regulatory control benefits through improved control capabilities, increased system reliability, and in reducing overall maintenance costs.... 详细信息
来源: 评论
The current mirror thermal characterization method and its implementation in a power SOI BJT process
The current mirror thermal characterization method and its i...
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Bipolar/BiCMOS Circuits and technology Meeting
作者: Jonggook Kim Yun Liu J.A. De Santis D. Brisbin Advanced Process Technology Development National Semiconductor Corporation
A new current mirror method is described that can be used to evaluate thermal issues in silicon-on-insulator (SOI) bipolar junction transistors (BJTs). This method is compared to conventional transistor level techniqu... 详细信息
来源: 评论
Novel ultra tough organic low-k dielectrics  2
Novel ultra tough organic low-k dielectrics
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2nd International Meeting for Future of Electron Devices, Kansai, IMFEDK 2004
作者: Aoi, Nobuo Fukuda, Takuya Yanazawa, Hiroshi Association of Super-Advanced Electronics Technologies Japan Process Technology Development Center Semiconductor Company Matsushita Electric Industrial Co. Ltd. Japan
We have proposed an ultra tough low-k film with a low density and highly cross-linked structure realized by a co-polymerization of a 3-dimensional rigid monomer and a 2-dimensional rigid monomer with self-organized na... 详细信息
来源: 评论
Multi-site performance monitoring in batch pharmaceutical production  7th
Multi-site performance monitoring in batch pharmaceutical pr...
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7th International Symposium on advanced Control of Chemical processes, ADCHEM 2003
作者: Wong, C.W.L. Escott, R.E.A. Morris, A.J. Martin, E.B. Centre for Process Analytics and Control Technology School of Chemical Engineering and Advanced Materials University of Newcastle Newcastle upon TyneNE1 7RU United Kingdom GlaxoSmithKline Chemical Development Tonbridge United Kingdom
A challenge facing the pharmaceutical and chemical industries is how to understand and identify differences in process behaviour where a product is manufactured at two different sites. Three approaches based on multi-... 详细信息
来源: 评论
Influence of mobility model on extraction of stress dependent source-drain series resistance
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MICROELECTRONICS RELIABILITY 2004年 第1期44卷 25-32页
作者: De Souza, MM Manhas, SK Sekhar, DC Oates, AS Chaparala, P Emerging Technologies Research Centre De Montfort University Gateway Street Leicester LE1 9BH UK TSMC 121 Park Ave 3 Science Based Industrial Park Hsinchu Taiwan Advanced Process Technology Development National Semiconductor Corp. 2900 Semiconductor Dr. M/S E-155 Santa Clara CA 95051 USA
The extraction of the parasitic source-drain series resistance after stress is a significant challenge, which has not been reported for channel lengths below 0.5 mum. Methods proposed until now yield a reducing series... 详细信息
来源: 评论
The effects of TaN thickness and strained substrate on the performance and PBTI characteristics of poly-Si/TaN/HfSiON MOSFETs
The effects of TaN thickness and strained substrate on the p...
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International Electron Devices Meeting (IEDM)
作者: H.-J. Cho H.L. Lee S.G. Park H.B. Park T.S. Jeon B.J. Jin S.B. Kang S.G. Lee Y.P. Kim I.S. Jung J.W. Lee Y.G. Shin U.-I. Chung J.T. Moon J.H. Choi Y.S. Jeong Process Development Team Samsung Electronics Semiconductor Research and Development Center South Korea AE Center Samsung Advanced Institute of Technology Yongin si Kyunggi South Korea
The effects of TaN metal-gate thickness on the electrical characteristics of poly-Si/metal-gate/HfSiON MOSFETs have been investigated. Too thin TaN was reactive with poly-Si gate, which led to the formation of Si-dope... 详细信息
来源: 评论
Novel ultra tough organic low-k dielectrics
Novel ultra tough organic low-k dielectrics
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International Meeting for Future of Electron Devices
作者: N. Aoi T. Fukuda H. Yanazawa ASET (Association of Super-Advanced Electronics Technologies) Japan Process Technology Development Center Semiconductor Company Matsushita Electric Industrial Company Limited Japan
We have proposed an ultra tough low-k film with a low density and highly cross-linked structure realized by a co-polymerization of a 3-dimensional rigid monomer and a 2-dimensional rigid monomer with self-organized na... 详细信息
来源: 评论
A mechanically enhanced storage node for virtually unlimited height (MESH) capacitor aiming at sub 70nm DRAMs
A mechanically enhanced storage node for virtually unlimited...
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International Electron Devices Meeting (IEDM)
作者: D.H. Kim J.Y. Kim M. Huh Y.S. Hwang J.M. Park D.H. Han D.I. Kim M.H. Cho B.H. Lee H.K. Hwang J.W. Song N.J. Kang G.W. Ha S.S. Song M.S. Shim S.E. Kim J.M. Kwon B.J. Park H.J. Oh H.J. Kim D.S. Woo M.Y. Jeong Y.I. Kim Y.S. Lee J.C. Shin J.W. Seo S.S. Jeong K.H. Yoon T.H. Ahn J.B. Lee Y.W. Hyung S.J. Park H.S. Kim W.T. Choi G.Y. Jin Y.G. Park Kinam Kim Advanced Technology Development Team Process Technology Team Semiconductor R&D Div Samsung Electronics Co Kiheung-Eup Yongin-City Kyunggi-Do Korea
Fully reliable lean-free stacked capacitor, with the meshes of the supporter made of Si/sub 3/N/sub 4/, has been successfully developed on 80nm COB DRAM application. This novel process terminates persistent problems c... 详细信息
来源: 评论
Multi-Site Performance Monitoring in Batch Pharmaceutical Production
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IFAC Proceedings Volumes 2004年 第1期37卷 683-689页
作者: C.W.L. Wong A.J. Morris E.B. Martin R.E.A. Escott Centre for Process Analytics and Control Technology School of Chemical Engineering and Advanced Materials University of Newcastle Newcastle upon Tyne NE1 7RU UK GlaxoSmithKline Chemical Development
A challenge facing the pharmaceutical and chemical industries is how to understand and identify differences in process behaviour where a product is manufactured at two different sites. Three approaches based on multi-... 详细信息
来源: 评论
Highly manufacturable high density phase change memory of 64Mb and beyond
Highly manufacturable high density phase change memory of 64...
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International Electron Devices Meeting (IEDM)
作者: S.J. Ahn Y.J. Song C.W. Jeong J.M. Shin Y. Fai Y.N. Hwang S.H. Lee K.C. Ryoo S.Y. Lee J.H. Park H. Horii Y.H. Ha J.H. Yi B.J. Kuh G.H. Koh G.T. Jeong H.S. Jeong Kinam Kim B.I. Ryu Advanced Technology Development Samsung Electronics Company Limited Yongin si Kyunggi South Korea Process Development Semiconductor Research and Development Div Samsung Electronics Company Limited Yongin si Kyunggi South Korea
Highly manufacturable 64Mbit PRAM has been successfully fabricated using N-doped Ge/sub 2/Sb/sub 2/Te/sub 5/ (GST) and optimal GST etching process. Using those technologies, it was possible to achieve the low writing ... 详细信息
来源: 评论