A three‐dimensional computational simulator of nonplanar substrates coated with positive photoresists is presented. The model includes four major steps: projection printing, exposure, post‐exposure baking (PEB), and...
A three‐dimensional computational simulator of nonplanar substrates coated with positive photoresists is presented. The model includes four major steps: projection printing, exposure, post‐exposure baking (PEB), and dissolution. Projection printing is based on Hopkins’ classical work. The exposure model employs the full nonlinear wave equation coupled with the photoactive compound (PAC) bleaching rate equation. These equations are solved using a spectral element iterative scheme. The PEB is treated as a material diffusion equation employing ideas introduced by Mack and the dissolution algorithm is our LEAD (least action dissolution) algorithm modified for nonplanar substrates. Several realistic examples are presented displaying final profiles at various dissolution times.
S. Kida, M. Takaoka, F. Hussain; Corrigendum:‘‘Reconnection of two vortex rings’’ [Phys. Fluids A 1, 630 (1989)]Comments, Physics of Fluids A: Fluid Dynamics, V
S. Kida, M. Takaoka, F. Hussain; Corrigendum:‘‘Reconnection of two vortex rings’’ [Phys. Fluids A 1, 630 (1989)]Comments, Physics of Fluids A: Fluid Dynamics, V
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