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LIGA and LIGA-like processing with high energy photons

Microsystem Technologies 1995年第1期2.0卷 153-156页

作者： Guckel, H. Wisconsin Center for Applied Microelectronics Department of Electrical and Computer Engineering University of Wisconsin Madison 53706 WI United States

High energy X-rays, in the present case photons near 20,000 eV, can be used in LIGA-like processing. Heating problems with this type of photon flux can be avoided by proper filtration via transmission filters. The exposure of PMMA with high energy photons leads to cost effective exposures with full cost recovery estimates of $0.10 per square centimeter at 200 μm photoresist thickness. The cost advantage originates from increased PMMA absorption lengths and the ability to fabricate large area masks without diaphragms which permit large exposure fields. © 1995 Springer-Verlag.

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An electromagnetic micro dynamometer

An electromagnetic micro dynamometer

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IEEE International Conference on Micro Electro Mechanical Systems

作者： T.R. Christenson J. Klein H. Guckel Wisconsin Center for Applied Microelectronics Department of Electrical and Computer Engineering University of Wisconsin Madison WI USA

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POM: a processor model for image processing

POM: a processor model for image processing

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IEEE International Conference on computer Design: VLSI in computers and Processors, (ICCD)

作者： J.-P. Theis L. Thiele Applied Microelectronics Laboratory Public Research Center Henri Tudor Luxembourg Computer Engineering and Networks Laboratory Swiss Federal Institute of Technology Zurich Switzerland

In this paper, we describe a new processor model called Periodic Operation Model (POM) that is suitable for real time image processing. First we analyze existing image processing systems in order to situate our approach. Starting from the processor architecture, we derive the corresponding algorithm class by means of a novel hardware description. Then we address the allocation and scheduling problem. We show that allocation and scheduling can be decoupled in the mapping process related to POM-processor arrays and outline the principles of an optimal mapping trajectory. We describe the outline of a novel ILP-model for allocation of POM-processor arrays which takes into account array-topology and bus bandwidth constraints. Finally we discuss implementational aspects of the POM as well as applications in image processing. We especially show that POM-processor arrays can be integrated onto single chips, thereby allowing to achieve several GOPS processing power per chip.

关键词： Image processing Complexity theory Clocks Costs Laboratories Processor scheduling Application software Shift registers microelectronics Image analysis

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Micromechanics: an emerging technology

Micromechanics: an emerging technology

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IEEE SOI-3D-Subthreshold microelectronics Technology Unified Conference (S3S)

作者： T. Christenson H. Guckel Wisconsin Center for Applied Microelectronics Department of Electrical and Computer Engineering University of Wisconsin Madison WI USA

Summary form only given, substantially as follows. Micromechanics deals with sensors and actuators. Sensors are devices which measure some property of their environment. They should do this non-invasively. This implies small physical size and low power transfer with large sensitivity. These requirements demand very stable material characteristics which are available in single crystal silicon. Smallness can be accommodated via surface rather than bulk micromachining. In this procedure three-dimensionality is achieved by using a sacrificial layer which supports the sensor structure temporarily and is eventually removed by lateral etching. Silicon systems in which n-doped silicon is removed and p/sup +/-doped silicon is retained have been used successfully. The most commonly used material system consists of silicon dioxide as a sacrificial layer with single crystal silicon and deposited polycrystalline silicon as the construction material. Actuators are devices which interfere with their environment. They fundamentally use energy storing volumes and therefore are 3-dimensional devices. Construction techniques must recognize this and are evaluated by computing the output force per unit chip area. Deep X-ray lithography, the LIGA process, has many of the required attributes for actuator construction. This process can be further extended by combining it with surface micromachining which leads to assembled structures such as fully integrated magnetic micromotors and linear motors. These structures can be fabricated on most planar substrates.

关键词： Sensor phenomena and characterization Actuators Crystalline materials Micromachining Building materials Etching Silicon compounds X-ray lithography Assembly Micromagnetics

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SILICON MICROSENSORS - CONSTRUCTION, DESIGN AND PERFORMANCE

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MICROELECTRONIC engineering 1991年第1-4期15卷 387-398页

作者： GUCKEL, H Wiscon Center for Applied Microelectronics Department of Electrical and Computer Engineering University of Wisconsin Madison WI 53706 USA

Sensors are devices which convert non-electronic variables to currents or voltages. They become microsensors when they are fabricated by modified integrated circuit techniques. Microsensors fall into two classes: replacements for existing devices with physically smaller, higher performance and lower cost structures;and novel sensors which can only be constructed by using micromechanics. These ideas can be illustrated by the results of a major effort in surface micromachined pressure transducers which started with the goal of producing designable, economically viable, absolute pressure sensors with a scaling reduction factor of at least 100 over existing devices. Since an absolute pressure transducer consists of a vacuum sealed pill box which deforms with applied pressure and a sensing scheme which converts deformation with applied pressure to electronic signals, reliable pill box construction must be addressed first. Mechanical considerations in conjunction with the desired scaling lead to the conclusion that a pill box wall thickness of roughly 2 micrometers would be required. This implies the use of thin films and because of thermal consideration leads to the selection of polysilicon as the most attractive film for pill box construction. High packing densities, a requirement for novel sensors, leads to a pill box construction technique which uses surface micromachining with silicon dioxide as a sacrificial layer which is etched laterally as the technology of choice. This choice becomes defendable if the mechanical properties of polysilicon can be determined and if process design can be implemented to produce repeatable, predetermined built-in strain, Young's modulus, and tensile strength. Special micromechanical test structures and film morphology measurements were used to eliminate this problem and, in particular, led to processing conditions in which the inherent compressive strain is converted to tensile strain. Sealing of etch channels and vacuum generation fo

关键词： Semiconducting Silicon

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SURFACE MICROMACHINED PRESSURE TRANSDUCERS

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SENSORS AND ACTUATORS A-PHYSICAL 1991年第2期28卷 133-146页

作者： GUCKEL, H Wisconsin Center for Applied Microelectronics Department of Electrical and Computer Engineering University of Wisconsin Madison WI 53706 U.S.A.

Typical IC processing is fundamentally two dimensional;sensors are three-dimensional structures. In surface micromachining, two-dimensional IC processing is extended to sensor structures by the addition of one or more sacrificial layers which are removed by lateral etching. The resulting sensor structures involve the substrate and one or more deposited films which form the intended micromechanical component. The concepts of this type of sensor manufacturing are readily demonstrated by considering absolute pressure transducers in some detail. Absolute pressure transducers involve a vacuum-sealed cavity and a deformation sensing technique. The cavity is formed from the substrate and a low-pressure chemical vapor deposited polycrystalline silicon film. The mechanical properties of this film must be controlled well enough to allow the device to be designed. This implies morphological control during processing. Optimized films which do exhibit controlled compressive or tensile strains exclude oxygen or nitrogen and are therefore not modified by extended hydrofluoric acid etches. Their mechanical behavior is monitored by micromechanical test structures which measure Euler buckling and thereby determine the value of the built-in strain. The cavity vacuum is established by reactive sealing. Long-term vacuum integrity is achieved by a low-stress silicon nitride barrier which also acts as a dielectric isolation barrier. Sensing is accomplished via deposited polysilicon resistors. These devices behave like metal resistors in terms of their temperature coefficient of resistance and noise figure. Their piezoresistive behavior is larger than that of typical metal film structures and smaller than that of single-crystal resistors. Pressure sensors with four diaphragms, two active and two inactive, have been constructed and optimized towards manufacturability. The measured performance is excellent and agrees with the predictions of the design algorithm.

关键词： Pressure Transducers

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SILICON MICROSENSORS - CONSTRUCTION, DESIGN AND PERFORMANCE 21

SILICON MICROSENSORS - CONSTRUCTION, DESIGN AND PERFORMANCE

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21ST EUROPEAN SOLID STATE DEVICE RESEARCH CONF ( ESSDERC 91 )

作者： GUCKEL, H Wisconsin Center for Applied Microelectronics Department of Electrical and Computer Engineering University of Wisconsin Madison 53706 WI United States

ISBN: (纸本)0444890661

关键词： Elastic moduli

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Fabrication of assembled micromechanical components via deep X-ray lithography

Fabrication of assembled micromechanical components via deep...

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IEEE International Conference on Micro Electro Mechanical Systems

作者： K. Guckel K.J. Skrobis T.R. Christenson J. Klein S. Han B. Choi E.G. Lovell Wisconsin Center for Applied Microelectronics Department of Electrical and Computer Engineering University of Wisconsin Madison WI USA

A variant of deep X-ray lithography, the LIGA process, is described. The fundamental processing sequence has been augmented with a locally defined sacrificial polyimide layer. This requires alignment of the X-ray mask to the optically defined sacrificial pattern via specially developed align-and-clamping jigs. The end results of this process are either fully unsupported metal structures or components which are locally attached to the substrate. Attempts to use this type of processing to produce assembled devices have been successful. Thus, free gears and fully attached shafts have been connected to form a nickel gear box. More complex assembly experiments have been completed successfully and are encouraging enough to pursue this approach further.< >

关键词： Fabrication Assembly Micromechanical devices X-ray lithography Resists Gears Micromachining Etching Silicon Additives

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Silicon Microsensors: Construction, Design and Performance

Silicon Microsensors: Construction, Design and Performance

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European Conference on Solid-State Device Research (ESSDERC)

作者： H. Guckel Wisconsin Center for Applied Microelectronics Department of Electrical and Computer Engineering University of Wisconsin Madison WI USA

Sensors are devices which convert non-electronic variables to currents or voltages. They become microsensors when they are fabricated by modified integrated circuit techniques. Microsensors fall into two classes: replacements for existing devices with physically smaller, higher performance and lower cost structures; and novel sensors which can only be constructed by using micromechanics. These ideas can be illustrated by the results of a major effort in surface micromachined pressure transducers which started with the goal of producing designable, economicaly viable absolute pressure sensors with a scaling reduction factor of at least 100 over existing devices. Since an absolute pressure transducer consists of a vacuum sealed pill box which deforms with applied pressure and a sensing scheme which converts deformation with applied pressure to electronic signals, reliable pill box construction must be addressed first. Mechanical considerations in conjunction with the desired scaling lead to the conclusion that a pill box wall thickness of roughly 2 micrometers would be required. This implies the use of thin films and because of thermal consideration leads to the selection of polysilicon as the most attractive film for pill box construction. High packing densities, a requirement for novel sensors, leads to a pill box construction technique which uses surface micromachining with silicon dioxide as a sacrificial layer which is etched laterally as the technology of choice. This choice becomes defendable if the mechanical properties of polysilicon can be determined and if process design can be implemented to produce repeatable, predetermined built-in strain, Young's modulus, and tensile strength.

关键词： Silicon Microsensors Transducers Voltage Costs Transistors Gas detectors Mechanical sensors Lead compounds Rough surfaces

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THE APPLICATION OF FINE-GRAINED, TENSILE POLYSILICON TO MECHANICALLY RESONANT TRANSDUCERS

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SENSORS AND ACTUATORS A-PHYSICAL 1990年第1-3期21卷 346-351页

作者： GUCKEL, H SNIEGOWSKI, JJ CHRISTENSON, TR RAISSI, F Wisconsin Center for Applied Microelectronics Department of Electrical and Computer Engineering University of Wisconsin Madison WI 53706 U.S.A.

Resonant force sensors are devices which convert axially applied forces to changes in resonant frequency. These structures are fundamentally wires or beams or more complicated structures which are in a vacuum envelope. They become interesting and useful if they can be miniaturized, can be fabricated from a single material in a cost effective manner and can be excited and read via simple techniques. The devices which are reported here satisfy most of the above criteria. The construction material involves a silicon substrate, tensile strain polysilicon films and strain-compensated silicon nitride deposits. Clamped-clamped beams of polysilicon, typically 400,μm long, 40,μm wide and 2μm thick are fabricated with an isoplanar process over an oxide filled tub. Low-pressure chemical-vapor-deposited (LPCVD) nitride is used as a second sacrificial layer which also serves to support a second polysilicon layer which is part of the vacuum envelope. Internal surface adhesion problems are avoided by freeze-sublimation procedures which remove surface tension-induced beam deflections. Passivation and sealing is accomplished via LPCVD nitride and reactive sealing. Excitation and sensing is accomplished via ion implanted resistors. Experimental results always produce quality factors, Q , above 35 000. Resonant frequencies to 750 kHz have been achieved. It is estimated that these devices can measure axially applied forces below 0.1 dyne with standard electronic interfaces.

关键词： Resonators, Crystal

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