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检索条件"机构=Applied Microelectronics and Computer Engineering"
428 条 记 录,以下是421-430 订阅
排序:
Advances in processing techniques for silicon micromechanical devices with smooth surfaces
Advances in processing techniques for silicon micromechanica...
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IEEE International Conference on Micro Electro Mechanical Systems
作者: H. Guckel J.J. Sniegowski T.R. Christenson Wisconsin Center for Applied Microelectronics Department of Electrical and Computer Engineering University of Wisconsin Madison WI USA
The use of fine-grained polysilicon in the development of micromechanical devices (e.g. bearings, with smooth surfaces) is discussed. Fine-grained polysilicon can be produced with surface roughness near 8 AA r.m.s. (r... 详细信息
来源: 评论
Synthesis of analog ASICs using optimization in conjunction with circuit simulation techniques
Synthesis of analog ASICs using optimization in conjunction ...
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Annual IEEE International Conference and Exhibit ASIC
作者: K. Doganis K. Walsh P. Linardes Electrical Engineering Software Inc. Santa Clara CA USA Computer Science and Microelectronics Dept School of Applied Science Aristotelion University Thessaloniki Greece
A description is given of the optimization methodology applied by the PRECISE computer program for the synthesis of analog ASICs. The application of simulation and optimization technology allows engineers to determine... 详细信息
来源: 评论
FINE-GRAINED POLYSILICON FILMS WITH BUILT-IN TENSILE STRAIN
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IEEE TRANSACTIONS ON ELECTRON DEVICES 1988年 第6期35卷 800-801页
作者: GUCKEL, H BURNS, DW VISSER, CCG TILMANS, HAC DEROO, D Wisconsin Center of Applied Microelectronics Department of Electrical and Computer Engineering University of Wisconsin Madison Madison WI USA Dept. of Electr. & Comput. Eng. Wisconsin Univ. Madison WI USA
Novel processing conditions and strain diagnostic structures are used to demonstrate that polysilicon films with built-in tensile-strain can be achieved and that any physical size limitations due to compressive-buckli... 详细信息
来源: 评论
Weighted fuzzy logic and its applications
Weighted fuzzy logic and its applications
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IEEE Annual International computer Software and Applications Conference (COMPSAC)
作者: X. He Wisconsin Center of Applied Microelectronics Department of Electrical and Computer Engineering University of Wisconsin Madison Madison WI USA
A weighted fuzzy logic is presented in which the truth of a conjunction of propositions (or predicates) is a weighted sum of the truth of each proposition (or predicate). This is different from traditional logic where... 详细信息
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Processing conditions for polysilicon films with tensile strain for large aspect ratio microstructures
Processing conditions for polysilicon films with tensile str...
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IEEE Workshop on Solid-State Sensor and Actuator
作者: H. Guckel D.W. Burns H.A.C. Tilmans C.C.G. Visser D.W. DeRoo T.R. Christenson P.J. Klomberg J.J. Sniegowski D.H. Jones Wisconsin Center of Applied Microelectronics Department of Electrical and Computer Engineering University of Wisconsin Madison WI USA Delft University of Technology Delft Netherlands Delco Electronics Corporation Kokomo IN USA
The processing conditions to obtain high-quality and repeatable polysilicon films are described. These include substrate preparation, the deposition procedure, reactor configuration, and postdeposition treatment. Exam... 详细信息
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Mechanical properties of fine grained polysilicon-the repeatability issue
Mechanical properties of fine grained polysilicon-the repeat...
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IEEE Workshop on Solid-State Sensor and Actuator
作者: H. Guckel D.W. Burns H.A.C. Tilmans D.W. DeRoo C.R. Rutigliano Wisconsin Center of Applied Microelectronics Department of Electrical and Computer Engineering University of Wisconsin Madison WI USA Delco Electronics Corporation Kokomo IN USA BIT Inc. Beaverton OR USA
Calculation and measurements of Young's modulus, Poisson's ratio, shear modulus, and internal strain for fine-grained polysilicon as a function of processing conditions are presented. Calculations are based on... 详细信息
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Plasma polymerization of methyl methacrylate: a photoresist for 3D applications
Plasma polymerization of methyl methacrylate: a photoresist ...
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IEEE Workshop on Solid-State Sensor and Actuator
作者: H. Guckel J. Uglow M. Lin D. Denton J. Tobin K. Euch M. Juda Wisconsin Center f o r Applied Microelectronics Department of Electrical and Computer Engineering University of Wisconsin Madison WI USA Texas Instruments Inc. Dallas TX USA Intel Corporation Santa Clara CA USA
The use of plasma polymerized methyl methacrylate (PPMMA) as a deep UV photoresist is described. By depositing a light sensitive polymer film from a plasma, very irregular surfaces can be coated and patterned. Other k... 详细信息
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Intelligent Interactive Assistance and Mobile Multimedia Computing  1
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丛书名: Communications in computer and Information Science
1000年
作者: Djamshid Tavangarian Thomas Kirste Dirk Timmermann Ulrike Lucke Daniel Versick
来源: 评论