Memory represents a major bottleneck in modern embeddedsystems. Traditionally, memory organizations for programmable systems assumed a fixed cache hierarchy. With the widening processor-memory gap, more aggressive me...
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ISBN:
(纸本)0769508316
Memory represents a major bottleneck in modern embeddedsystems. Traditionally, memory organizations for programmable systems assumed a fixed cache hierarchy. With the widening processor-memory gap, more aggressive memory technologies and organizations have appeared, allowing customization of a heterogeneous memory architecture tuned for the application. However, such a processor-memory co-exploration approach critically needs the ability to explicitly capture heterogeneous memory architectures. We present in this paper a language-based approach to explicitly capture the memory subsystem configuration, and perform exploration of the memory architecture to trade-off cost versus performance. We present a set of experiments using our Memory-Aware Architectural Description Language to drive the exploration of the memory subsystem for the TIC6211 processor architecture, demonstrating a range of cost and performance attributes.
Recent approaches on language-driven Design Space Exploration (DSE) use Architectural Description Languages (ADL) to capture the processor architecture, generate automatically a software toolkit (including compiler, s...
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Recent approaches on language-driven Design Space Exploration (DSE) use Architectural Description Languages (ADL) to capture the processor architecture, generate automatically a software toolkit (including compiler, simulator, and assembler) for that processor, and provide feedback to the designer on the quality of the architecture. It is important to verify the ADL description of the processor to ensure the correctness of the software toolkit. We present in this paper an automatic validation framework, driven by an ADL. We present algorithms for automatic validation of ADL specification of the processor pipelines. We applied our methodology to verify several realistic processor cores to demonstrate the usefulness of our approach.
Polymer composite, compared with conventional sing-phase insulation, can have improved dielectric properties. The field dependent conductivity inorganic filler in polymer can make the polymer composite into non-linear...
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Polymer composite, compared with conventional sing-phase insulation, can have improved dielectric properties. The field dependent conductivity inorganic filler in polymer can make the polymer composite into non-linear insulating materials used to improve the distribution of electric field. In this study, three kinds of polyethylene (LDPE, LLDPE and HDPE) were take as basic resins filled with carborundum (SiC) powder, and the field dependent conductivity properties of these composites were investigated through experiment at different temperatures
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