检索结果-内蒙古大学图书馆

您好，读者！请登录

内蒙古大学图书馆

首页
概况
党建
资源
服务
科研支持
- 论文收录引用证明
- 科技查新
知识产权
档案馆
帮助

咨询与建议

建议与咨询留下您的常用邮箱和电话号码，以便我们向您反馈解决方案和替代方法

您的常用邮箱：*

您的手机号码：*

问题描述：

当前已输入0个字，您还可以输入200个字

全部搜索
期刊论文
图书
学位论文
标准
纸本馆藏
外文资源发现
数据库导航
超星发现

高级检索

时间限定

出版年份：

文献类型

图书期刊文献学位论文多媒体

馆藏选择

电子馆藏纸本馆藏

核心期刊

全部期刊 SCI 收录期刊 SSCI 收录期刊 EI 收录期刊 CSCD 收录期刊 CSSCI 收录期刊

语言

中文英文

文献类型

期刊文献图书学位论文标准纸本馆藏

帮助

文字说明：

T=题名（书名、题名），A=作者（责任者），K=主题词，P=出版物名称，PU=出版社名称，O=机构（作者单位、学位授予单位、专利申请人），L=中图分类号，C=学科分类号，U=全部字段，Y=年（出版发行年、学位年度、标准发布年）

检索规则说明：

AND代表“并且”；OR代表“或者”；NOT代表“不包含”；(注意必须大写,运算符两边需空一格)

检索范例：

范例一：(K=图书馆学 OR K=情报学) AND A=范并思 AND Y=1982-2016
范例二：P=计算机应用与软件 AND (U=C++ OR U=Basic) NOT K=Visual AND Y=2011-2016

分类表

所选分类

>> <<

限定检索结果

文献类型

126 篇 会议
3 篇 期刊文献

馆藏范围

129 篇 电子文献
0 种 纸本馆藏

日期分布

学科分类号

45 篇 工学
- 25 篇 电子科学与技术（可...
- 9 篇 机械工程
- 8 篇 材料科学与工程（可...
- 7 篇 冶金工程
- 7 篇 计算机科学与技术...
- 6 篇 电气工程
- 6 篇 软件工程
- 5 篇 仪器科学与技术
- 5 篇 动力工程及工程热...
- 4 篇 控制科学与工程
- 3 篇 光学工程
- 3 篇 化学工程与技术
- 3 篇 轻工技术与工程
- 2 篇 信息与通信工程
- 1 篇 力学（可授工学、理...
- 1 篇 航空宇航科学与技...
13 篇 理学
- 8 篇 物理学
- 3 篇 数学
- 3 篇 化学
- 1 篇 系统科学
- 1 篇 统计学（可授理学、...
4 篇 管理学
- 3 篇 管理科学与工程(可...
- 1 篇 图书情报与档案管...

主题

16 篇 packaging
13 篇 substrates
9 篇 inductors
7 篇 temperature meas...
7 篇 three-dimensiona...
7 篇 sockets
7 篇 voltage control
6 篇 temperature
6 篇 cooling
6 篇 regulators
5 篇 metals
5 篇 force
5 篇 resistance
5 篇 bonding
5 篇 soldering
5 篇 computational mo...
5 篇 silicon
5 篇 thermal manageme...
5 篇 training
5 篇 electronic packa...

机构

18 篇 assembly and tes...
5 篇 assembly and tes...
5 篇 assembly test te...
4 篇 assembly and tes...
4 篇 assembly test te...
4 篇 department of el...
4 篇 assembly test an...
4 篇 assembly & test ...
3 篇 components resea...
3 篇 scalable perform...
3 篇 department of in...
3 篇 assembly test te...
3 篇 corporate qualit...
3 篇 department of el...
3 篇 assembly test te...
2 篇 test technology ...
2 篇 assembly & test ...
2 篇 assembly and tes...
2 篇 towa corporation...
2 篇 assembly test te...

作者

12 篇 kemal aygün
7 篇 ahmet c. durgun
7 篇 kemal aygun
7 篇 srikrishnan venk...
6 篇 zhichao zhang
6 篇 krishna bharath
5 篇 srinivasan govin...
5 篇 cemil s. geyik
5 篇 leigh wojewoda
5 篇 x. f. brun
5 篇 kaladhar radhakr...
4 篇 rahul manepalli
4 篇 johanna swan
4 篇 loh wei keat
4 篇 dipanjan gope
3 篇 karumbu meyyappa...
3 篇 gregorio murtagi...
3 篇 gang duan
3 篇 chris edwards
3 篇 telesphor kamgai...

语言

119 篇 英文
6 篇 中文
4 篇 其他

检索条件"机构=Assembly Test Technology Development"

共 129 条记录，以下是61-70 订阅

全选清除本页清除全部题录导出标记到"检索档案"

详细简洁

排序：

Enforcing Causality and Passivity of Neural Network Models of Broadband S-Parameters

Enforcing Causality and Passivity of Neural Network Models o...

引用

IEEE Topical Meeting on Electrical Performance of Electronic Packaging (EPEPS)

作者： Hakki M. Torun Ahmet C. Durgun Kemal Aygün Madhavan Swaminathan 3D Systems Packaging Research Center (PRC) Georgia Institute of Technology Atlanta GA Assembly and Test Technology Development Intel Corporation Chandler AZ

ISBN: (数字)9781728145853

ISBN: (纸本)9781728145860

This paper proposes a method to ensure that S-Parameters generated using neural network (NN) models are physically consistent and can be safely used in subsequent time-domain simulations. This is achieved by introducing causality and passivity enforcement layers as the last two layers of the NN, while minimizing their computational overhead to the training and inference of the NN model. Proposed technique is demonstrated on learning the mapping from 13 dimensional geometrical parameters of a differential plated through hole (PTH) in package core to its corresponding broadband S-Parameters up to 100 GHz.

关键词： Scattering parameters Predictive models Artificial neural networks Training Frequency response Broadband communication Computational modeling

来源：评论

学校读者我要写书评

暂无评论

Heterogeneous Integration Using Omni-Directional Interconnect Packaging

Heterogeneous Integration Using Omni-Directional Interconnec...

引用

International Electron Devices Meeting (IEDM)

作者： A. A. Elsherbini S. M. Liff J. M. Swan Components Research Technology & Manufacturing Group Intel Corp. Chandler AZ USA Assembly & Test Technology Development Technology & Manufacturing Group Intel Corp. Chandler AZ USA

We present a new packaging building block for 3D integrated circuits: Omni Directional Interconnect (ODI). It adds a new degree of freedom in packaging that enables combining the high bandwidth benefit of standard 3D stacking with the minimal die area, thermal performance and direct power delivery of 2D packaging. ODI performance and cost benefits in high-performance computing are summarized. It is shown that by using careful assembly strategy, the required tolerances can be made the same as other 2.5/3D technologies. The fabrication results for two of the architectures are included and show good repeatability and robust assembly.

关键词：

来源：评论

学校读者我要写书评

暂无评论

A method to model Vccinfeedthrough Noise in Microprocessors with Fully Integrated Voltage Regulators - Distributed Formulation

A method to model Vccinfeedthrough Noise in Microprocessors ...

引用

IEEE Topical Meeting on Electrical Performance of Electronic Packaging (EPEPS)

作者： Srinivasan Govindan Krishna Bharath Dipanjan Gope Srikrishnan Venkataraman Nikita Ambasana Scalable Performance CPU Development Group Intel Technology India Pvt. Ltd Bangalore India Assembly Test and Technology Development Intel Corporation Chandler Arizona Department of Electrical Communication Engineering Indian Institute of Science Bangalore India

ISBN: (数字)9781728145853

ISBN: (纸本)9781728145860

Modern high performance server microprocessors processors have built-in Fully Integrated Voltage Regulators (FIVR) to generate the on-chip power domains. The multiple FIVRs in the chip share a common input power network for platform VRM cost reduction. However the load current transitions at the output of one FIVR can couple to the other FIVR through the input network and deteriorate its performance. In this paper we extend our earlier lumped formulation to include distributed models of the converters.

关键词： Inductors Voltage control Matrices System-on-chip Capacitors Regulators Load modeling

来源：评论

学校读者我要写书评

暂无评论

Phase Change Material Compact Model: Validation and Sensitivity as Thermal Interface Material

Phase Change Material Compact Model: Validation and Sensitiv...

引用

Electrical Design of Advanced Packaging and Systems Symposium, EDAPS

作者： Javed Shaikh Je-Young Chang Weihua Tang Assembly and Test Technology Development Intel Corporation Bangalore India

ISBN: (纸本)9781538665930;9781538665923

The Phase Change Material (PCM) is explored as potential passive thermal solution in package thermal design due to the burst power requirements in the mobile applications. In this paper, a compact model based on the apparent heat capacity method is proposed and implemented in Icepak ® . The model is validated with the experimental results, also the compact model results are verified with the detailed computational fluid dynamics (CFD) simulations using Fluent ® solver. The compact model is used to perform the sensitivity study using different commercial PCMs as thermal interface material (TIM) in the bare die package under JEDEC boundary conditions. The effect of conductivity and capacitance is discussed with respect to different PCMs as TIM.

关键词： Phase change materials Heating systems Numerical models Liquids Computational modeling Temperature Electronic packaging thermal management

来源：评论

学校读者我要写书评

暂无评论

Understanding Underfill Degradation in Reliability testing Conditions for ADAS Package development

Understanding Underfill Degradation in Reliability Testing C...

引用

Electronic Components and technology Conference (ECTC)

作者： Ziyin Lin Vijay Subramanian Pramod Malatkar Nisha Ananthakrishnan Assembly &Test Technology Development Intel Corporation Chandler AZ USA

Harsh advanced driver assistance systems (ADAS) user conditions lead to stringent reliability requirements for electronic packages. In order to develop packages that meet ADAS reliability target, it is necessary to not only have highly reliable packaging materials but also create quick turn monitor (QTM) materials screening processes to facilitate the development cycle. In this paper, we used underfill as an example to demonstrate that material degradation in reliability testing conditions is an important modulator for underfill performance. It was found that one of underfill materials in our study experienced significant fracture toughness degradation after temperature cycling or high temperature bake; and the toughness degradation explained the poor package level reliability performance. The root cause of fracture toughness degradation is found to be the thermal degradation of polymer resin in reliability conditions. Further fundamental study revealed that fracture toughness/thermal degradation could be attributed to the thermal stability of the raw material structures. It is demonstrated that the characterization of the properties of packaging materials post temperature cycling/high temperature bake can be used as a QTM for material screening. The QTM offers more than three times improvement in data turns and allows for faster materials screening without the need for extensive package level experiments.

关键词： Degradation Materials reliability Thermal stability Stress Thermal degradation Temperature measurement

来源：评论

学校读者我要写书评

暂无评论

Robust temperature and humidity dependent electrical package material characterization

Robust temperature and humidity dependent electrical package...

引用

IEEE Conference on Electrical Performance of Electronic Packaging and Systems

作者： Yidnekachew S. Mekonnen Michael J. Hill Leigh Wojewoda Kemal Aygun Assembly and Test Technology Development Intel Corporation Chandler AZ

Increasing high speed data rates for digital signaling and emerging technologies such as 5G have expanded the frequency range of interest for package dielectric materials characterization and generated interest in characterization over use conditions such as temperature and humidity. In this paper, a robust dielectric material characterization metrology with high repeatability under different temperature and humidity conditions is presented. Temperature and humidity dependent interpolation of material properties based on measured data is also presented and shown to provide good estimates for environmental conditions not in the original data set.

关键词： Temperature measurement Humidity Temperature Temperature dependence Dielectric loss measurement Semiconductor device measurement

来源：评论

学校读者我要写书评

暂无评论

Method to Model Input Voltage Ripple in Multi-Domain Fully Integrated Voltage Regulators

Method to Model Input Voltage Ripple in Multi-Domain Fully I...

引用

Electrical Design of Advanced Packaging and Systems Symposium, EDAPS

作者： Srinivasan Govindan Dipanjan Gope Krishna Bharath Srikrishnan Venkataraman Department of Electrical Communication Engineering Indian Institute of Science Bangalore India Assembly Test and Technology Development Intel Corporation Chandler Arizona Scalable Performance CPU Development Group Intel Technology India Pvt. Ltd Bangalore India

ISBN: (纸本)9781538665930;9781538665923

The on-chip power domains of the latest generation of high performance server microprocessors are generated using integrated switched mode dc-dc converters also known as Fully Integrated Voltage regulators (FIVR). The multi-domain FIVRs in the chip share a common input power supply and the input voltage ripple can be quite high when all of them switch together. The modeling of the input voltage ripple in multi-domain FIVRs using circuit simulation tools such as SPICE is a tedious task. This paper proposes a simple method to accurately model the steady state input voltage ripple using the Harmonic Domain (HD) method.

关键词： Harmonic analysis Switches Voltage control Integrated circuit modeling Inductors Mathematical model Matrices

来源：评论

学校读者我要写书评

暂无评论

Design of Low-loss Transmission Lines with Common Mode Suppression for Packages

Design of Low-loss Transmission Lines with Common Mode Suppr...

引用

IEEE Conference on Electrical Performance of Electronic Packaging and Systems

作者： Ahmet C. Durgun Kemal Aygun Assembly and Test Technology Development Intel Corporation Chandler AZ USA

Increasing data rates of high speed serial interfaces forces the insertion loss and common mode (CM) noise requirements to be tighter. This paper addresses both of these challenges by introducing a new low-loss transmission line design with simultaneous common mode filtering property. The line is composed of periodical repetitions of narrow and wide sections, which generates a CM impedance contrast to filter out the CM noise, while differential impedance is kept constant by locally voiding the planes below and above the wide trace sections. As a result of the wider sections, the loss is also smaller.

关键词： Low-loss transmission line Common mode filter High-speed interfaces Periodic structures

来源：评论

学校读者我要写书评

暂无评论

Temperature Impact on Surface Roughness Modeling for On-Package High Speed Interconnects

Temperature Impact on Surface Roughness Modeling for On-Pack...

引用

IEEE Conference on Electrical Performance of Electronic Packaging and Systems

作者： Cemil S. Geyik Zhichao Zhang Sean R. Christ Leigh E. Wojewoda Kemal Aygun Assembly Test Technology Development Intel Corporation Chandler Arizona USA

The introduction of new dielectrics and adhesion promotion techniques for future interconnect technology generations is one of the key enablers for lower loss and higher bandwidth. However, temperature increase due to active die or environmental factors can cause variations in material properties and loss, which is required to be included in modeling assumptions to be able to set realistic specifications. High temperature can account for significant increase in dielectric loss and decrease in bulk conductivity. The former becomes less critical considering today's on-package high speed interconnect loss is largely dominated by conductors due to thinner substrate. The latter has a loss impact only at low frequencies due to skin effect, and high frequency conductor loss is considerably influenced by surface roughness. This paper presents a systematic methodology to show temperature impact on surface roughness modeling for on-package high speed interconnects. Correlation to high fidelity insertion loss measurements at different temperatures indicates the roughness correction factor extracted at one temperature does not fit all, necessitating an explicit temperature dependence for surface roughness models.

关键词： Temperature Relative humidity Surface roughness Dielectric loss Conductor loss Effective conductivity Skin effect Transmission line measurements

来源：评论

学校读者我要写书评

暂无评论

Method to Model Vccin Feedthrough Noise in Multi-Domain Fully Integrated Voltage Regulators

Method to Model Vccin Feedthrough Noise in Multi-Domain Full...

引用

IEEE Conference on Electrical Performance of Electronic Packaging and Systems

作者： Srinivasan Govindan Krishna Bharath Dipanjan Gope Srikrishnan Venkataraman Department of Electrical Communication Engineering Indian Institute of Science Bangalore India Assembly Test and Technology Development Intel Corporation Chandler Arizona Scalable Performance CPU Development Group Intel Technology India Pvt. Ltd Bangalore India

The on-chip power supply domains of high performance server microprocessors are generated using built-in switching voltage regulators (also know as Fully Integrated Voltage regulators-FIVRs). The advantages of integrated voltage generation are improved performance and reduced platform cost. However, the FIVRs share a common input power plane in the package and the coupling of noise between FIVRs is of significant concern. This noise is also known as the Vccin feedthrough noise. The modeling of the vccin feedthrough noise using circuit simulation tools such as SPICE is a laborious and time consuming task. This paper proposes a simple method to accurately predict the vccin feedthrough noise based on the state-space averaged small signal method. This method simplifies the modeling of vccin feedthrough noise and saves lot of time and effort.

关键词： Power integrity and power distribution networks Electromagnetic (EM) and EM interference modeling Simulation algorithms Tools Flows Electronic packages and microsystems

来源：评论

学校读者我要写书评

暂无评论

没有更多数据了...

全选清除本页清除全部题录导出标记到“检索档案”

共13页 << < 3 4 5 6 7 8 9 10 11 12 > >>

检索报告对象比较合并检索0

隐藏清空

合并搜索

回到顶部

执行限定条件

内容：

评分：

请选择保存的检索档案：

请选择收藏分类：

订阅名称：

通借通还

温馨提示：

图书名称：

借书校区：

取书校区：

手机号码：

邮箱地址：

一卡通帐号：

电话和邮箱必须正确填写，我们会与您联系确认。

联系人：

所在院系：

联系邮箱：

联系电话：

内蒙古自治区呼和浩特市赛罕区大学西街235号邮编: 010021

建议与咨询 留下您的常用邮箱和电话号码，以便我们向您反馈解决方案和替代方法

时间限定

文献类型

馆藏选择

核心期刊

语言

文献类型

帮助

文字说明：

检索规则说明：

检索范例：

分类表

所选分类

限定检索结果

文献类型

馆藏范围

日期分布

学科分类号

主题

机构

作者

语言

请选择保存的检索档案： 新增检索档案 确定 取消

请选择收藏分类： 新增自定义分类 确定 取消

通借通还

建议与咨询留下您的常用邮箱和电话号码，以便我们向您反馈解决方案和替代方法

请选择保存的检索档案：

请选择收藏分类：