For thermo-mechanical reliability, the difference between the actual use stress and accelerated qualification stress is most apparent in temperature cycling stress due to isothermal large temperature delta applied dur...
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For thermo-mechanical reliability, the difference between the actual use stress and accelerated qualification stress is most apparent in temperature cycling stress due to isothermal large temperature delta applied during temperature cycling vs. non-uniform low amplitude thermal changes in use condition. Power cycling is alternatively utilized to characterize these differences with common industry practice for power cycling is to stress functional devices since it requires to power on and off the components. To overcome the limited failure information that can be learned through functional device stressing, a novel power cycling tool is designed to stress test vehicles with dedicated electrical/thermal structures enabling targeted uniform or non-uniform power to be applied during stress and resulting temperature delta can be accurately measured through dedicated temperature sensors in the chip and package. Data collected with this tool is then compared with calculated acceleration through temperature cycling stress. Comparison shows temperature cycling based life estimations are conservative for thermal interface material degradation estimations. This work also encompassed use condition data collection and finite element modeling to derive the final knowledge-based requirements.
In today's high speed digital circuit design, some high data rate signal paths require interconnect simulations up to 100 GHz. One of the major challenges for these simulations is generating reliable and accurate ...
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In today's high speed digital circuit design, some high data rate signal paths require interconnect simulations up to 100 GHz. One of the major challenges for these simulations is generating reliable and accurate frequency dependent material models for dielectric constant (dk) and loss tangent (df). This paper will present a metrology for measurement of typical interconnect materials using cavity resonators including a method to capture all measurement variations. Once a precise metrology is established, the paper will then use the collected data to provide additional insight into popular modeling methods used to extrapolate data beyond measurement frequency. For the type of materials measured, specific recommendations will be made on the modeling parameters to have the most accurate high-frequency models for typical package substrate materials.
Surface mount technologies (SMT) are widely used in the electronic industry to mount integrated circuit (IC) component packages onto printed circuit boards (PCB). Increasing miniaturization and form factor reduction d...
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