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A summary of team MIT's approach to the virtual robotics challenge

A summary of team MIT's approach to the virtual robotics cha...

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IEEE International Conference on Robotics and Automation (ICRA)

作者： R. Tedrake M. Fallon S. Karumanchi S. Kuindersma M. Antone T. Schneider T. Howard M. Walter H. Dai R. Deits M. Fleder D. Fourie R. Hammoud S. Hemachandra P. Ilardi C. Pérez-D'Arpino S. Pillai A. Valenzuela C. Cantu C. Dolan I. Evans S. Jorgensen J. Kristeller J. A. Shah K. Iagnemma S. Teller Center for Systems and Software Engineering University of Southern California Los Angeles CA USA Assembly and Test Technology Development Intel Corporation Chandler USA Scalable Performance CPU Development Group Intel Corporation Bengaluru India

The paper describes the system developed by researchers from MIT for the Defense Advanced Research Projects Agency's (DARPA) Virtual Robotics Challenge (VRC), held in June 2013. The VRC was the first competition in the DARPA Robotics Challenge (DRC), a program that aims to “develop ground robotic capabilities to execute complex tasks in dangerous, degraded, human-engineered environments”. The VRC required teams to guide a model of Boston Dynamics' humanoid robot, Atlas, through driving, walking, and manipulation tasks in simulation. Team MIT's user interface, the Viewer, provided the operator with a unified representation of all available information. A 3D rendering of the robot depicted its most recently estimated body state with respect to the surrounding environment, represented by point clouds and texture-mapped meshes as sensed by on-board LIDAR and fused over time.

关键词： Legged locomotion Robot sensing systems Planning Three-dimensional displays Kinematics Navigation

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High resolution and fast throughput-time X-ray computed tomography for semiconductor packaging applications

High resolution and fast throughput-time X-ray computed tomo...

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Electronic Components and technology Conference (ECTC)

作者： Yan Li Mario Pacheco Deepak Goyal John W. Elmer Holly D. Barth Dula Parkinson Assembly Test and Technology Development Failure Analysis Labs Intel Corporation Chandler AZ Materials Engineering Division Lawrence Livermore National Laboratory Livermore CA Advanced Light Source Lawrence Berkeley National Laboratory Berkeley CA

ISBN: (纸本)9781479924080

The recent applications of 3D X-ray computed tomography (CT) in microelectronic packages, including nondestructive failure analysis, defect monitoring in solder joints and Cu vias, and progressive reliability study of solder voids, electron migration induced void nucleation in solder joints, and void evolution in Cu vias are reviewed. The high resolution and non-destructive 3D X-ray CT data has proven to be highly valuable in package assembly process development, quality control and reliability risk assessment; however, the field of view of current lab-scale 3D X-ray CT technology is limited to about 1-2mm 2 localized area at micron level resolution, due to its low brightness and nonparallel X-ray beam resulting in long data acquisition time. Synchrotron X-ray sources, on the other hand, can provide large area collimated beams with high brightness, which allows imaging within 3-20 minutes an entire 3D package, including Si, underfill, multiple levels of solder joints, and dielectric layers, Cu vias as well as through holes in multiple substrates. The limitation of current 3D X-ray CT techniques as well as directions for next generation 3D X-ray CT techniques provided by the synchrotron X-ray study of 3D packages are discussed in this paper.

关键词： Three-dimensional displays Computed tomography X-ray imaging Soldering Substrates Synchrotrons

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Application of projection moiré in electronic packaging and assembly for post-surface mount warpage measurements

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2012 Annual Conference on Experimental and Applied Mechanics

作者： Kovalchick, Christopher Walwadkar, Satyajit McAllister, Alan Assembly Test and Technology Development Intel Corporation 5200 Elam Young Parkway Hillsboro OR 97124 United States

ISBN: (纸本)9781461442349

Geometric moiré techniques, such as shadow and projection moiré, are useful for quantifying the out-of-plane displacement, or warpage, of electronic packaging components at elevated temperature. While shadow moiré is widely used for measuring the warpage of ball grid array (BGA) packages and bare printed circuit boards (PCB's) with high accuracy and resolution, it is restricted by the need for a glass reference grating within close proximity to the sample. This prevents the capability from measuring surfaces varying largely in height, thus limiting the scope of study for deformations induced through the various stages of the electronic packaging, assembly and surface mount process. Projection moiré uses virtual gratings of various sizes, making it an ideal technique for investigating large field depths and boards populated with components. A novel projection moiré setup is used to investigate the warpage behavior of printed circuit boards with ball-grid array packages attached post-surface mount. Measurements are also obtained of the board and packages pre-surface mount both at room and elevated temperature, allowing for direct quantification of the deformations induced during the reflow process. Using this information, a simple model is developed for calculating individual solder ball stand-off heights, providing further insight into packaging and assembly specifications. © The Society for Experimental Mechanics, Inc. 2013.

关键词： Deformation

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Moisture absorption and diffusion in an underfill encapsulant at T > T g and T g

Moisture absorption and diffusion in an underfill encapsulan...

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作者： He, Yi Alam, Zina Assembly Materials Characterization Laboratory Assembly Test and Technology Development Intel Corporation 5000 W. Chandler Blvd. Chandler AZ 85226-3699 United States

Moisture absorption and diffusion behavior of an underfill material used for electronic packaging with a glass transition temperature (T g) slightly above room temperature have been investigated by the sorption thermogravimetric analysis technique. It has been found that moisture diffusion in this material follows the Fick's diffusion model, and moisture absorption-desorption is reversible and repeatable. Based on moisture-induced mass gain versus time curve, the diffusion constant can be determined. It was found that below T g, moisture diffusivity exhibits an Arrhenius temperature dependence, which changes to a different Arrhenius temperature dependence as the temperature increases to T > T g. The change in diffusivity from T g to T > T g is accompanied by a significant decrease in the energy barrier for moisture diffusion. Results shed light on the change in moisture diffusion in polymer-based materials in the glassy and the rubbery state. © 2013 Akadémiai Kiadó, Budapest, Hungary.

关键词： Moisture

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Performance evaluation of a sessile drop deposition process

Performance evaluation of a sessile drop deposition process

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28th Annual Meeting of the American Society for Precision Engineering, ASPE 2013

作者： Chesna, Jacob W Rivers, Ryan I Smith, Stuart T Samara, Ayman M Center for Precision Metrology University of North Carolina at Charlotte Charlotte NC United States Assembly and Test Technology Development Intel Chandler AZ United States

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Large angle of bragg diffraction using interfrence of acoustic wave inside acousto-optic deflector

Large angle of bragg diffraction using interfrence of acoust...

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32nd International Congress on Applications of Lasers and Electro-Optics, ICALEO 2013

作者： Wang, Tiansi Zhang, Chong Aleksov, Aleksandar Salama, Islam A Kar, Aravinda Material Science Engineering Department College of Optics and Photonics Mechanical and Aeronautical Engineering University of Central Florida P.O. Box 162700 Orlando FL 32816-2700 United States Intel - Assembly and Test Technology Development 5000 W Chandler Blvd Chandler AZ 85226 United States Intel - Components Research 5000 W Chandler Blvd Chandler AZ 85226 United States

The laser beam is often steered in different directions in a variety of laser-advanced microprocessing technologies, such as laser micromachining, laser patterning and laser selective-area doping. Scanners are traditionally used to direct the beam to different locations on the workpiece. The mechanical motion of x-y mirrors in such scanners affects the accuracy of beam positioning and repeatability in high precision manufacturing. Beam steering without any moving optical component is necessary to overcome the limitations of current scanning technology. Stationary optical devices such as acousto-optic modulators (AOM), acousto-optic deflectors (AOD) and acousto-optic tunable filters (AOTF) have widespread applications in the field of laser microfabrication for intensity modulation and laser beam steering. AODs are commonly used with continuous-wave lasers in laser direct writing systems to provide flexible and high-speed beam scanning with high precision and accuracy. A pair of AODs is mounted orthogonally to provide dual axis (x-y) laser scanning. The deflection scan angle, however, is small due to the finite distance between the two separate deflectors. This optical configuration can be simplified by realizing 2D AO interaction in a single AO crystal. This paper discusses an integrated AOD to allow compact construction and efficient operation with large deflection scan angle. This type of AODs would be useful for large-area processing with high throughput.

关键词： Continuous wave lasers

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Low-k ILD Reliability Through Chip-Package assembly: Engineering Appropriate Stress tests and Process Certification Criteria

Low-k ILD Reliability Through Chip-Package Assembly: Enginee...

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IEEE Electronic Components and technology Conference

作者： Sudarshan Rangaraj Jeffrey Hicks Michael O'Day Ankur Aggarwal Terri Wilson Ramanarayanan Panchapakesan Rohit Grover Guotao Wang Technology Development and Manufacturing Quality and Reliability Intel Corporation Design Technology Solutions Intel Corporation Portland Technology Development Intel Corporation Assembly and Test Technology Development Intel Corporation

ISBN: (纸本)9781479902330

Inter-layer dielectric (ILD) materials used in silicon chip backend layers tend to be mechanically fragile, and the industry trend is towards ILD materials with even lower dielectric constants and fracture toughness. Flip-chip packaging with lead-free solder materials imposes significant thermo-mechanical stresses on these fragile ILD films due to the thermal expansion miss-match between the silicon chip and organic package. To guarantee low-K ILD integrity through chip-package assembly and reliability in use with adequate margin it is crucial to understand and quantify the sources of stress, their variability and use this information to define the right stress tests and success criterion. This paper will present a systematic study of the modulators of low-K ILD stress using empirical data from 45, 32 and 22nm Intel processes as well as finite element modeling. Key sources of variation in the silicon chip process as well as the chip-package assembly process will be examined and their effects on ILD stress will be quantified. This information will be used to assess the amount of over-stress needed to account for worst case manufacturing variation in silicon chip and chip - package assembly processes. Two approaches to characterization tests that provide the required over-stress will be discussed. The first approach is based on chip processing and package design skews to increase the ILD stress while the second approach relies on cooling the chip-package to below room temperature post-assembly in order to exaggerate the thermal expansion miss-match and over-stress the ILD layers. Process certification criteria to guarantee ILD reliability will be presented and optimized sampling plans to demonstrate that these goals are met will also be discussed.

关键词： ILD assembly Engineering

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Moisture absorption and hygroscopic swelling behavior of an underfill material

Moisture absorption and hygroscopic swelling behavior of an ...

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作者： He, Yi Assembly Test and Technology Development MS CH5-157 Intel Corporation 5000 W. Chandler Blvd. Chandler AZ 85226 United States

In situ moisture absorption and hygroscopic swelling behavior of an underfill material used for electronic packaging have been investigated using sorption thermogravimetric analysis (sorption TGA) and dynamic mechanical analysis (DMA) techniques under a controlled relative humidity (RH) environment. Results showed that moisture diffusion in this material can be described by Fick's diffusion law when the relative humidity is 60% or less, while at a high moisture level (85% RH), non-Fickian diffusion becomes apparent in the latter stage of the diffusion process. An increase in moisture absorption ability was observed after exposure at high temperature and high humidity level, which can be attributed to hygrothermal aging-induced damage in the material. DMA results revealed that hygroscopic swelling is significant comparing with the thermal expansion of the material. The coefficient of hygroscopic swelling (CHS) was calculated and the results showed that CHS is temperature dependent, and it increases with the increasing temperature. © 2012 Elsevier B.V. All rights reserved.

关键词： Dynamic mechanical analysis

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Thermal management of packages with 3D die stacking

Thermal management of packages with 3D die stacking

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International Microsystems, Packaging, assembly and Circuits technology (IMPACT)

作者： Chia-Pin Chiu Je-Young Chang Sanjoy Saha Assembly & Test Technology Development Intel Corporation Chandler AZ USA

ISBN: (纸本)9781467316354

The objective of thermal design requirement for 3D stacked die package is to maintain the junction temperatures of active devices in the package at or below specified limits. In this paper, die-to-die thermal resistance is identified as the key bottleneck in 3D thermal management, and two solution paths are proposed: fully-populated thermal bump array and thermally conductive underfill materials. The sensitivity of the thermal bump array design and the effective thermal conductivity of underfill materials will be discussed. In addition to die-to-die thermal resistance reduction, enhancement of the overall packaging cooling capability by integrating liquid cooling to the package heat spreader is another option especially for the server type of environment which typically dissipates high power. An alternative approach is to integrate thermo-electric cooling to the heat spreader for hot spot cooling. For systems that are limited to traditional air cooling, this paper will propose a different package architecture which will utilize existing cooling capability of 3D die stacking. Although the power dissipation capability of 3D die stacking is worse than the 2D multiple-chip packages, dual-die stacking can potentially achieve a higher efficiency of “performance per power” by utilizing the same concept of dual-core microprocessor. This approach is very useful especially when the package real estate is limited and 3D die stacking is the preferred package architecture.

关键词： Thermal resistance Cooling Thermal conductivity Microchannel Heating Materials

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Reducing uncertainty of wettability measurements through controlled sessile droplet deposition: Current issues

Reducing uncertainty of wettability measurements through con...

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27th Annual Meeting of the American Society for Precision Engineering, ASPE 2012

作者： Chesna, Jacob W. Rivers, Ryan I. Smith, Stuart T. Her, Tsing-Hua Samara, Ayman M. Center for Precision Metrology UNC Charlotte Charlotte NC United States Physics and Optical Science UNC Charlotte Charlotte NC United States Assembly and Test Technology Development Intel Chandler AZ United States

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