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Mm-wave rectangular slot loop antenna array for broad spatial coverage

Mm-wave rectangular slot loop antenna array for broad spatia...

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Antennas and Propagation Society International Symposium

作者： Helen K. Pan Bryce D. Horine Kranti K. Tantwai Intel Laboratory Intel Corporation Hillsboro OR USA Assembly Test and Technology Development Intel Corporation India

ISBN: (纸本)9781424449675

In this paper, a planar rectangular slot loop antenna is proposed that provides unique radiation pattern with broad beam pattern tilting toward the side. Other than typical broadside or endfire antenna array, the beam tilted rectangular slot loop antenna array brings flexibility for platform placement while providing broad spatial coverage.

关键词： Slot antennas Antenna radiation patterns Arrays Antenna arrays Microstrip antennas Bandwidth

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Cooling performance of piezoelectric fan in notebook system

Cooling performance of piezoelectric fan in notebook system

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34th International Electronics Manufacturing technology Conference, IEMT 2010

作者： Kar Mun, Ng Sauciuc, Ioan Wada, Hiroaki Tanaka, Nobuhira Intel Asia-Pacific Research and Development Ltd. Shanghai Zizhu Science Park No. 880 Zi Xing Road Shanghai 20041 China Assembly and Test Technology Development Intel Corporation 5000 W. Chandler Blvd Arizona United States Murata Manufacturing Company Ltd. 1-10-1 Higashikotari Nagaokakyo-shi Kyoto 617-8555 Japan

ISBN: (纸本)9781424488278

Thin form factor and high computing performance are the inevitable trend of notebook industry. Both vectors impose more stringent challenge on thermal solution design to maintain internal components and external chassis surfaces within temperature requirements. Cooling industry contributed great effort in miniaturizing conventional blower fan to thin form factor for supporting thin notebook cooling. However, due to the physical size constraints such as rotary blade, magnetic coil, bearing mechanism & circuit board, the effective flowrate of thin form factor fan is relative low. Multiple past researches have been focusing on characterization of thermal performance at component level. However, investigation of practical cooling application of piezofan in thin notebook has not been widely studied. This paper investigates the feasibility of implementing piezoelectric fan (referred as piezofan from now) as an alternative cooling technology in thin notebook. The piezofan design is constrained by volumetric size not greater than blower fan used for cooling thin notebook. The selected notebook is low power thin & light 13 notebook, with processor TDP (Thermal Design Power) of 18W. Firstly, the cooling impact of heat exchanger design is studied in terms of position, fin gap & inlet shape. The optimum cooling performance is observed when heat exchanger design is with 1.5mm fin gap, additional recesses at top & bottom of inlet plane and positioned at in front (0mm) of piezofan vibration tip. Secondly, cooling characteristic of piezofan is studied in terms of blade length (l), thickness (t), operating frequency () and amplitude (A). First resonance frequency is observed to be linearly dependent on t/l2. The cooling performance of piezofan is concluded inversely power to A. Better cooling performance is obtained at higher resonance frequency and larger vibration amplitude. Piezofan with shorter vibration blade generates higher A value (better cooling performance). The sound pres

关键词： Cooling

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Cooling performance of piezoelectric fan in notebook system

Cooling performance of piezoelectric fan in notebook system

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IEEE/CHMT(CPMT) International Electronics Manufacturing technology Symposium

作者： Ng Kar Mun Ioan Sauciuc Hiroaki Wada Nobuhira Tanaka Intel Asia-Pacific Research & Development Ltd. No. 880 Zi Xing Road Shanghai Zizhu Science Park 20041 China Assembly & Test Technology Development Chandler Arizona Murata Manufacturing Company Ltd. Kyoto Japan

Thin form factor and high computing performance are the inevitable trend of notebook industry. Both vectors impose more stringent challenge on thermal solution design to maintain internal components and external chassis surfaces within temperature requirements. Cooling industry contributed great effort in miniaturizing conventional blower fan to thin form factor for supporting thin notebook cooling. However, due to the physical size constraints such as rotary blade, magnetic coil, bearing mechanism & circuit board, the effective flowrate of thin form factor fan is relative low. Multiple past researches have been focusing on characterization of thermal performance at component level. However, investigation of practical cooling application of piezofan in thin notebook has not been widely studied. This paper investigates the feasibility of implementing piezoelectric fan (referred as piezofan from now) as an alternative cooling technology in thin notebook. The piezofan design is constrained by volumetric size not greater than blower fan used for cooling thin notebook. The selected notebook is low power thin & light 13" notebook, with processor TDP (Thermal Design Power) of 18 W. Firstly, the cooling impact of heat exchanger design is studied in terms of position, fin gap & inlet shape. The optimum cooling performance is observed when heat exchanger design is with 1.5mm fin gap, additional recesses at top & bottom of inlet plane and positioned at in front (~0 mm) of piezofan vibration tip. Secondly, cooling characteristic of piezofan is studied in terms of blade length (l), thickness (t), operating frequency (f) and amplitude (A). First resonance frequency is observed to be linearly dependent on t/l 2 . The cooling performance of piezofan is concluded inversely power to A × f. Better cooling performance is obtained at higher resonance frequency and larger vibration amplitude. Piezofan with shorter vibration blade generates higher A × f value (better cooling performance).

关键词： Blades Heating Cooling Resonant frequency Voltage measurement Vibrations Frequency measurement

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A compact 802.11 a/b/g/n WLAN Front-End Module using passives embedded in a flip-chip BGA organic package substrate

A compact 802.11 a/b/g/n WLAN Front-End Module using passive...

引用

Microwave, MTT-S International Symposium

作者： Telesphor Kamgaing Emile Davies-Venn Kaladhar Radhakrishnan Components Research Intel Corporation Chandler AZ USA Assembly and Test Technology Development Intel Corporation Chandler AZ USA

ISBN: (纸本)9781424428038

This paper discusses the design and implementation of a compact RF front-end-module for 802.11 a/b/g/n application. A high performance embedded passives technology has been developed by extending existing multilayer FCBGA packaging substrate technology to include thin film capacitors, resistors and spiral inductors. Using these basic elements, all of the passive building blocks for the RF front-end module (FEM) have been designed and characterized individually. Several of these building blocks have then been used in combination with surface mounted active dies to realize a dual-band one-transmit/one-receive WiFi FEM with dimensions of 8 mm times 8 mm times 1 mm. Preliminary measurements indicate small signal gain of 10 dB at 2.4 GHz for the Rx chain.

关键词： Wireless LAN Packaging Substrates Radio frequency Thin film inductors Nonhomogeneous media Capacitors Resistors Spirals Dual band

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A peer-to-peer approach to providing QoS monitoring for web service activities 9

A peer-to-peer approach to providing QoS monitoring for web ...

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9th ACM/IFIP/USENIX International Middleware Conference, Middleware 2008

作者： Karim, Fariaz Intel Corporation Assembly/Test Technology Development ChandlerAZ United States

ISBN: (纸本)9781605583693

Steady increases in the adoption of web services for automating critical business processes or activities demand that certain Quality of Service (QoS) metrics are met. Common approaches to QoS monitoring are primarily based on a centralized model that we found to be inadequate in large-scale and high-volume computing environments, such as Intel's assembly and test manufacturing facilities. The main reasons are: scalability, issues related to practical deployment, and reconfigurability. In this paper, we will present a peer-to-peer approach that works by transparently turning a web service into a potential QoS monitor for all activities that flow through it. A lightweight middleware component, residing within the web service implementation, provides this transparency. The middleware component collects QoS metrics from a web service during activity processing and embeds the metrics within the business data payload. This allows the peers of that service to receive QoS metrics, apply specific monitoring rules, or take specific actions as the activity flows from one web service to the next. This decentralized pattern allows activities of different complexity and length to be monitored seamlessly. We will discuss our experience in implementing and using this technique at Intel's high-volume assembly and test manufacturing environment that span across multiple continents and geographic regions. Copyright 2008 ACM.

关键词： Middleware

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Characterization of halogen-free package materials using cavity resonators

Characterization of halogen-free package materials using cav...

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IEEE Topical Meeting on Electrical Performance of Electronic Packaging (EPEPS)

作者： Kemal Aygun Grace Hu Assembly and Test Technology Development Intel Corporation Chandler AZ USA

Dielectric properties of substrate materials have a significant impact on electrical performance of packages including signaling power loss, propagation delay and crosstalk. With the focus on halogen-free (HF) package substrates, it is critical to understand the impact of this material change on high-speed signal integrity. In this paper, a closed rectangular cavity resonator and an open Fabry-Perot cavity resonator are proposed to characterize package materials over 2 GHz - 28 GHz range. The paper first studies the metrology repeatability and sensitivity to sample positioning and sample thickness. Then the proposed metrologies are used for electrical characterization of both HF and halogenated (H) package core materials. Finally, the impact of the core material change on the high-speed signaling performance is investigated through a modeling study for a typical differential input/output (IO) interface.

关键词： Packaging Cavity resonators Dielectric materials Dielectric substrates Dielectric losses Hafnium Metrology Performance loss Propagation losses Propagation delay

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Numerical Prediction of Socket Solder Joint Reliability during Shock

Numerical Prediction of Socket Solder Joint Reliability duri...

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IEEE Holm Conference on Electrical Contacts

作者： Yupeng Li Robert Atkinson Hong Xie Shijiang He Assembly Test Technology Development Intel Corporation Chandler AZ USA

ISBN: (纸本)9781424419012

This paper proposes a simulation methodology to assess the risk in solder joint reliability (SJR) of Pin Grid Array (PGA)/ Land Grid Array (LGA) Socket during Mechanical shock. One of the main challenges in simulation is the complex socket/contact geometry convoluted with its massive number of degrees of freedom. This paper proposes a technique, Contact Isolation Method (CIM), to simplify the geometry so that it can be modeled with highly reduced degrees of freedom (DOFs) while still maintaining 90% of the in-plane and out-of-plane stiffness compared with the original structure. The Pin Grid Array 700 socket (PGA700) and Pin Grid Array 604 socket (PGA604) were used as case studies to demonstrate this methodology. A system model was completed for the PGA604 socket with a focus on its capability to assess SJR. A reasonable correlation between the modeling and experiment on the dynamic board strain demonstrates that this technique is viable. In addition, this paper verifies that the board strain is a proper metric for the risk assessment in SJR, and defines the optimal strain gauge location. The impact of the boundary conditions is also investigated.

关键词： Sockets Soldering Electric shock Electronics packaging Capacitive sensors Solid modeling Geometry Computer integrated manufacturing Risk management Boundary conditions

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LC-based WiFi and WiMAX baluns embedded in a multilayer organic Flip-Chip Ball Grid Array (FCBGA) package substrate

LC-based WiFi and WiMAX baluns embedded in a multilayer orga...

引用

2008 58th Electronic Components and technology Conference, ECTC

作者： Davies-Venn, Emile Kamgaing, Telesphor Assembly and Test Technology Development Intel Corporation 5000 W. Chandler Blvd Chandler AZ 85226 United States Corporate Technology Group Intel Corporation 5000 W. Chandler Blvd Chandler AZ 85226 United States

ISBN: (纸本)9781424422302

Two lumped element baluns designed using embedded inductors and capacitors are discussed in this paper. The structures designed for WiFi and mobile WiMAX applications have very small form-factors with surface area of 3mm2 or less making them ideal for portable wireless communication devices such as mobile internet devices and ultra-mobile personal computers. The baluns, fabricated as part of a multi-layer FCBGA package substrate, also display very good electrical performance. The measured insertion loss and phase imbalances were lower than -0.85dB and 3 degrees respectively for some implementations. © 2008 IEEE.

关键词： Wireless local area networks (WLAN)

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LC-based WiFi and WiMAX Baluns embedded in a multilayer organic flip-chip ball grid array (FCBGA) package substrate

LC-based WiFi and WiMAX Baluns embedded in a multilayer orga...

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Electronic Components and technology Conference (ECTC)

作者： Emile Davies-Venn Telesphor Kamgaing Assembly and Test Technology Development Intel Corporation Chandler AZ USA Corporate Technology Group Intel Corporation Chandler AZ USA

Two lumped element baluns designed using embedded inductors and capacitors are discussed in this paper. The structures designed for WiFi and mobile WiMAX applications have very small form-factors with surface area of 3 mm 2 or less making them ideal for portable wireless communication devices such as mobile internet devices and ultra-mobile personal computers. The baluns, fabricated as part of a multi-layer FCBGA package substrate, also display very good electrical performance. The measured insertion loss and phase imbalances were lower than -0.85 dB and 3 degrees respectively for some implementations.

关键词： WiMAX Impedance matching Nonhomogeneous media Electronics packaging Mobile computing Inductors Capacitors Application software Wireless communication Internet

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In-situ characterization of moisture absorption and desorption in a thin BT core substrate

In-situ characterization of moisture absorption and desorpti...

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57th Electronic Components and technology Conference 2007, ECTC '07

作者： He, Yi Fan, Xuejun Intel Corporation Assembly Test and Technology Development 5000 W. Chandler Blvd. Chandler AZ 85226 United States

ISBN: (纸本)1424409853

Bismaleimide-triazine (BT) resin/glass fiber laminates are commonly used as a substrate core material in microelectronic packaging. Their moisture absorption and diffusion behavior have a significant impact on package reliability. The traditional method to determine moisture absorption relies on a weight gain measurement metrology with an analytical balance. This approach is generally not suitable for thin films. In this study, the moisture absorption-desorption behavior of a thin BT core was characterized in-situ using a sorption TGA over a temperature range of 30 to 80°C, in an environment of up to 80% relative humidity. From the experimental results, the moisture diffusivity and the saturated moisture content have been determined. Within the experimental temperature range, the diffusivity can be described by the Arrhenius equation and the activation energy can be computed. The obtained results are compared with literature data. The impact of moisture diffusion in BT core on the reliability of ultra-thin stacked chip scale packages (UT/SCSP) will be discussed. © 2007 IEEE.

关键词： Laminates

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