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Layout decomposition Algorithms for double Patterning Lithography 13

Layout Decomposition Algorithms for Double Patterning Lithog...

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2016 13th IEEE International Conference on Solid-State and Integrated Circuit technology (icSicT)

作者： Xuelian Zhang Yuping Wu Lan Chen Qi Zhang Weicheng Shi Institute of Microelectronics of Chinese Academy of Sciences Beijing Key Laboratory of 3D & Nano IC Design Automation Technology Key Laboratory of Microelectronic Devices & Integrated Technology CAS

ISBN: (纸本)9781467397209

We present an efficient layout decomposition flow and the corresponding optimization algorithms to minimize the stitches for double patterning *** the given power/ground preprocessing method for the flow reduces the complexity, and improves the speed and quality to the layout decomposition. Experiments show that our algorithms can effectively get the better results compared with other reported algorithms.

关键词： Estimation Field programmable gate arrays OFdM Modulation Filtration Clocks Signal processing algorithms

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SAPTL –based Robust Sub-threshold Adder Circuit design 13

SAPTL –based Robust Sub-threshold Adder Circuit Design

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2016 13th IEEE International Conference on Solid-State and Integrated Circuit technology (icSicT)

作者： Qi Zhang Yuping Wu Lan Chen Xuelian Zhang Weicheng Shi Institute of Microelectronics of Chinese Academy of Sciences Beijing Key Laboratory of 3D & Nano IC Design Automation Technology Key Laboratory of Microelectronic Devices & Integrated Technology CAS

ISBN: (纸本)9781467397209

Process variation results in up to an order of magnitude variation in on/off ratios, which significantly depresses the yield of the sub-threshold circuits. This paper presents low power sub-threshold adders using sense amplifier-based pass transistor logic(SAPTL). Based on the simulations in 130 nm CMOS process, the proposed two-phase synchronous SAPTL adder exhibits stronger robustness to process variations when compared to the ripple carry adder using standard cell circuits. And the adder based on AdSA-SAPTL features much less power consumption than synchronous SAPTL adder.

关键词： based Robust Sub-threshold Adder Circuit design SAPTL

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3d ic interconnect parasitic capacitance extraction with a reformulated PGd algorithm 17

3D IC interconnect parasitic capacitance extraction with a r...

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17th Biennial IEEE Conference on Electromagnetic Field Computation, IEEE CEFC 2016

作者： Li, Yalan Yan, Shuai Xu, Xiaoyu Lyu, Pengfei Ren, Zhuoxiang Institute of Microelectronics of Chinese Academy of Science Beijing100029 China University of Chinese Academy of Sciences Beijing100029 China Beijing Key Laboratory of 3D and Nano IC Electronic Design Automation Technologies Beijing China Sorbonne Universités Univ. Paris 06 UR2 L2E ParisF-75005 France

ISBN: (纸本)9781509010325

Proper generalized decomposition (PGd) is a new model order reduction (MOR) method based on the use of separated representations. In this work, PGd is applied on 3d capacitance extraction of interconnects in ic to reduce its computational complexity. To make the PGd solver feasible, the complex geometries are simplified by a characteristic function technique. 3d singular value decomposition (SVd) of the characteristic functions is avoided by a reformulation of the PGd algorithm. A numerical example is given to verify the method. © 2016 IEEE.

关键词： Singular value decomposition

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Stationary electro-thermal coupling analysis considering dual finite element formulations of steady current field

Stationary electro-thermal coupling analysis considering dua...

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IEEE Conference on Electromagnetic Field Computation

作者： Xiaoyu Xu Pengfei Lyu Shuai Yan Zhuoxiang Ren Beijing Key Laboratory of 3D & Nano IC Electronic Design Automation Technologies Beijing China Institute of Microelectronics of Chinese Academy of Sciences Beijing China Sorbonne Universités UPMC Univ Paris 06 Paris France

ISBN: (纸本)9781509010332

The interaction between steady current field and thermal field occurs in various engineering applications. The fields are mutually two-way coupled due to the heat generated by electric current and temperature-dependent resistivity. It is a computational challenge to analyse such multiphysics problems when the geometric structures are complex. One possibility for reducing the computational costs is to acquire relatively accurate solutions with less unknowns that results from coarser mesh. This paper utilizes the complementarity of dual finite element formulations of steady current field to accelerate convergence of the coupling analysis. The performance and convergence are demonstrated with a micro-resistor beam benchmark problem.

关键词： Finite element analysis Couplings Conductivity Resistance heating Convergence Electric potential Mathematical model

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Multiphysics coupling analysis of TSV by using discrete geometric method based on Tonti diagram

Multiphysics coupling analysis of TSV by using discrete geom...

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IEEE Conference on Electromagnetic Field Computation

作者： Zhan Gao Xiaoyu Xu Shuai Yan Pengfei Lyu Zhuoxiang Ren Institute of Microelectronics of Chinese Academy of Sciences Beijing China Beijing Key Laboratory of 3D & Nano IC Electronic Design Automation Technologies Beijing China Sorbonne Universités UPMC Univ Paris 06 Paris France

ISBN: (纸本)9781509010332

The Tonti diagram conceives a general mathematical structure for several physical fields, and hence provide uniform topological operators to establish global stiffness matrices for various field solvers in differential forms. The discrete geometric method implements the Hodge discretization of constitutive laws through the division of geometric parameters of primal and dual meshes. Complying with Tonti diagrams, it can be achieved as an elegant solution for multiphysics problems intuitively and practicably. The stationary electro-thermo-mechanical coupled problem, including building of the constitutive equations and treating of the coupling terms, is studied. A typical problem with regard to thermo-mechanical stress induced by resistive losses in a through-silicon-via (TSV) structure of 3d ic is investigated.

关键词： Through-silicon vias Stress Thermal conductivity Couplings Electric potential Three-dimensional displays

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3d capacitance computation using polygonal prism elements through piecewise interpolation

3D capacitance computation using polygonal prism elements th...

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IEEE Conference on Electromagnetic Field Computation

作者： Pengfei Lyu Xiaoyu Xu Shuai Yan Zhuoxiang Ren Institute of Microelectronics Chinese Academy of Sciences Beijing China Beijing Key Laboratory 3D & Nano IC Electronic Design Automation Technologies Beijing China UR2 UPMC Univ Paris 06 Paris France

ISBN: (纸本)9781509010332

The Galerkin FEM based on GBCs over polygon or polyhedron are heavily time consuming. In light of the simple shape functions in simple geometric elements, such as triangle, tetrahedron, a fast three-dimensional interpolation FEM based upon piecewise interpolation technique over convex polygonal prism mesh is presented. The polytope is divided into several sub triangular prisms according to its barycenter, where the shape functions of all vertexes on the whole volume are easily and quickly acquired. The presented method has the advantage over the frequently-used GBCs in computational costs. A capacitance extraction example in integrated circuits (ics) is performed and shows that the polytope FEM has good convergence and high accuracy.

关键词： Interpolation Finite element analysis Shape Three-dimensional displays Capacitance Integrated circuits Convergence

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3d ic interconnect parasitic capacitance extraction with a reformulated PGd algorithm

3D IC interconnect parasitic capacitance extraction with a r...

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IEEE Conference on Electromagnetic Field Computation

作者： Yalan Li Shuai Yan Xiaoyu Xu Pengfei Lyu Zhuoxiang Ren Institute of Microelectronics Chinese Academy of Science Beijing China University of Chinese Academy of Sciences Beijing China Beijing Key Laboratory of 3D & Nano IC Electronic Design Automation Technologies Beijing China UR2 Univ. Paris 06 Paris France

ISBN: (纸本)9781509010332

关键词： Three-dimensional displays Parasitic capacitance Integrated circuit modeling Conductors Integrated circuit interconnections Geometry

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