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Board design optimization for fine pitch BGA components

Board design optimization for fine pitch BGA components

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Electronics System-Integration technology Conference, ESTC

作者： Attila Geczy Zsolt Illyefalvi-Vitez Department of Electronics Technology Budapest University슠of슠Technology슠and슠Economics Budapest Hungary

With the dominance of surface mounted technology in electronics mass production, the application of fine pitch components became common due to their small size and increasing functionality. These components are considered fine pitch, if lead pitches are equal or lower than 0.65 mm (25 mils). For Ball Grid Array (BGA) components, this value by IPC standards is considered to be around 1 mm (39 mil). Fine pitch ICs require careful approach for design, assembly and process control. Design for Manufacturing (DfM) disciples must be handled carefully by taking into account the parameters and sizes of the applied components. Layout design for fine pitch components requires customized design rules and appropriate wiring agreeing both electrical and technology demands. Fine pitch BGA components involved in a design may decrease product yield negatively if DfM rules are neglected. A test board was designed to reveal manufacturing limits of the department's PWB manufacture facility. technology limitations are revealed by monitoring each step of the production flow. The sample board is suited for a commercial 0.65 mm fine pitch BGA component. For a very fine pitch (e.g. 0.300 mm) component, more strict rules and approaches are needed. Preliminary soldering tests were carried out with the commercially available BGA chip; however current research involves a custom, in-house designed dummy component. Component soldering is performed with a laboratory vapor phase reflow soldering station with Galden fluid. The study aims to highlight performance analyses and differences between two base board wiring conceptions as well.

关键词： Bridges Reliability

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Validating Query/View/Transformation Relations

Validating Query/View/Transformation Relations

引用

Workshop on Model-Driven Engineering, Verification, and Validation (MoDeVVa)

作者： L´szló Lengyel Istv´n Madari M´rk Asztalos Tihamér Levendovszky Department of Automation and Applied Informatics Budapest University슠of슠Technology슠and슠Economics Budapest Hungary

Model-based software engineering is an increasingly applied method in producing software artifacts that is driven by model transformation. For example, Model-Driven Architecture (MDA) is an approach to develop software based on different models. Source code is generated automatically from these models. This makes model transformations the heart of MDA and other model-based software engineering approaches. Query/View/Transformation (QVT) is a transformation technology aimed solving model transformation challenges. There is a demand for making model transformation more flexible, efficient, highly-configurable as well as validated. For graph rewriting-based model transformations, we have developed an approach to support online validation of model transformations. This approach has been implemented in Visual Modeling and Transformation System (VMTS). Furthermore, VMTS has a QVT plug in supported with a QVT Toolkit to execute QVT Relations-based transformations. This paper discusses the details applying the online validation approach to model transformation rules defined in the QVT Relations language.

关键词： Unified modeling language Computational modeling Context Visualization Testing Analytical models Engines

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Effects of test conditions on shear strength of surface mount solder joints

Effects of test conditions on shear strength of surface moun...

引用

International Spring Seminar on Electronics technology

作者： Endre Harkai Bálint Balogh István Latos Department of Electronics Technology Budapest University슠of슠Technology슠and슠Economics Hungary

In electronic industry shear test is a commonly used method to classify the mechanical properties and reliability of solder joints. The aim of this paper is to investigate how the shear test conditions (shear rate, shear height) affect the measured shear strength values. To study this, a series of experiments have been conducted on 0603 sized chip resistors. The experiments showed that increasing the shear rate results in slightly higher measured shear strength in the 60.600 μm/s range. The higher the shear height the lower the measured shear force was, thus it is advisable to perform the shear tests with the lowest reproducible shear height. In case of the tested components the fracture always formed between the ceramic body of the resistor and its metallization.

关键词： Soldering Force measurement Resistors Surface topography Joints Surface cracks Metallization

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Perspective Reconstruction and Camera Auto-Calibration as Rectangular Polynomial Eigenvalue Problem

Perspective Reconstruction and Camera Auto-Calibration as Re...

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International Conference on Pattern Recognition

作者： Akos Pernek Levente Hajder MTA SZTAKI Budapest University슠of슠Technology슠and슠Economics Hungary

Motion-based 3D reconstruction (SfM) with missing data has been a challenging computer vision task since the late 90s. Under perspective camera model, one of the most difficult problems is camera auto-calibration which means determining the intrinsic camera parameters without using any known calibration object or assuming special properties of the scene. This paper presents a novel algorithm to perform camera auto-calibration from multiple images and dealing with the missing data problem. The method supposes semi-calibrated cameras (every intrinsic camera parameter except for the focal length is considered to be known) and constant focal length over all the images. The solution requires at least one image pair having at least eight common measured points. Tests verified that the algorithm is numerically stable and produces accurate results both on synthetic and real test sequences.

关键词： Cameras Equations Calibration Three dimensional displays Eigenvalues and eigenfunctions Image reconstruction Mathematical model

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Package–on–Package – Review on a Promising Packaging technology

Package–on–Package – Review on a Promising Packaging Tech...

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International Spring Seminar on Electronics technology

作者： Attila Geczy Zsolt Illyefalvi-Vitez Department of Electronics Technology Budapest University슠of슠Technology슠and슠Economics Budapest Hungary

Package-on-Package (PoP) components are BGA packages stacked on each other. With this method not only board space is saved, but signal routes are also shortened. It was presented by a cooperation of Amkor and Nokia. The vertical 3 dimensional stacking of BGA components broadens the possibilities of planar surface mounting technology. The PoP technology is constantly evolving; the latest solutions offer wide variety of bumping and stacking technologies. This paper is a review on this aspiring 3D packaging method. Preliminary soldering experiments with dummy packages are also presented.

关键词： Soldering Inspection Materials Stacking Copper Springs

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Transient heating of gas insulated switchgears

Transient heating of gas insulated switchgears

引用

IEEE PES Transmission and Distribution Conference and Exposition

作者： L. Koller B. Novák Department of Electric Power Engineering Budapest University슠of슠Technology슠and슠Economics Hungary

ISBN: (纸本)9781424465460;9781424465477

This paper investigates the thermal effects of short fault currents in switchgears. During short circuits, the current and temperature distribution over the cross section and even along the perimeter of the busbars and the enclosures can become non-uniform, exposing the separate contact elements of the contact systems to different temperatures. This effect will be demonstrated with an example of a medium voltage unit. All the results were obtained from coupled field finite element simulations. With the coupling of the electromagnetic and the thermal models, the temperature dependence of the material properties was also taken into account.

关键词： Heating Gas insulation Switchgear Temperature distribution Electromagnetic coupling Fault currents Circuits Medium voltage Finite element methods Electromagnetic modeling

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Model-driven development of ARINC 653 configuration tables

Model-driven development of ARINC 653 configuration tables

引用

Conference on Digital Avionics Systems (DASC)

作者： Ákos Horváth Dániel Varró Department of Measurement and Information Budapest University슠of슠Technology슠and슠Economics Budapest Hungary

Model-driven development (MDD) has become a key technique in systems and software engineering, including the aeronautic domain. It facilitates on systematic use of models from a very early phase of the design process and through various model transformation steps (semi-)automatically generates source code and documentation. However, on one hand, the use of model-driven approaches for the development of configuration data is not as widely used as for source code synthesis. On the other hand, we believe that, particular systems that make heavy use of configuration tables like the ARINC 653 standard can benefit from model-driven design by (i) automating error-prone configuration file editing and (ii) using model based validation for early error detection. In this paper, we will present the results of the European project DIANA that investigated the use of MDD in the context of Integrated Modular Avionics (IMA) and the ARINC 653 standard. In the scope of the project, a tool chain was implemented that generates ARINC 653 configuration tables from high-level architecture models. The tool chain was integrated with different target systems (VxWorks 653, SIMA) and evaluated during case studies with real-world and real-sized avionics applications.

关键词： Unified modeling language Analytical models Mathematical model Biological system modeling Data models Documentation Atmospheric modeling

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Feasibility study of a CMOS-compatible integrated solar photovoltaic cell array

Feasibility study of a CMOS-compatible integrated solar phot...

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Design, Test, Integration and Packaging of MEMS/MOEMS

作者： B. Plesz L. Juhász J. Mizsei Department of Electron Devices Budapest University슠of슠Technology슠and슠Economics Budapest Hungary

ISBN: (纸本)9781424466368;9782355000119

Due to the low power consumption of sensors resulted by recent developments solar energy seems to be an attractive power source for self-powered devices. A proposal of a chip-scale solar module was given by Perlaky et al, containing a possible structure and a model for the proposed structure. This paper gives a more sophisticated model of the structure proposed in by taking into account the parasitic transistor present in the structure. Based on this model simulations are performed and some crucial issues of the structure are detected. Finally a modified structure of a chip-scale solar module is presented, that incorporates solutions for the issues found during simulations.

关键词： Photovoltaic cells Intelligent sensors Sensor arrays Energy consumption Solar power generation P-n junctions Solar energy Photovoltaic systems Voltage Photoconductivity

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Evaluation of WS-* Standards Based Interoperability of SOA Products for the Hungarian e-Government Infrastructure

Evaluation of WS-* Standards Based Interoperability of SOA P...

引用

International Conference on the Digital Society

作者： Balázs Simon Zoltán László Balázs Goldschmidt Károly Kondorosi Péter Risztics Department of Control Engineering and Information Technology Budapest University슠of슠Technology슠and슠Economics Budapest Hungary

ISBN: (纸本)9781424458059;9780769539539

The proposed architecture of the Hungarian e-government framework, mandating the functional co-operation of independent organizations, puts special emphasis on interoperability. WS-*standards have been created to reach uniformity and interoperability in the common middleware tasks for Web services such as security, reliable messaging and transactions. These standards, however, while existing for some time, have implementations slightly different in quality. In order to assess implementations, thorough tests should be performed, and relevant test cases ought to be accepted. For selecting mature SOA products for e-government application, a methodology of such an assessment is needed. We have defined a flexible and extensible test bed and a set of test cases for SOA products considering three aspects: compliance with standards, interoperability and development support.

关键词： Semiconductor optical amplifiers Electronic government Simple object access protocol Testing Security Standards development Standards organizations Web services Service oriented architecture Identity management systems

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Shared protection of demands with Physical Impairment Constrained Routing

Shared protection of demands with Physical Impairment Constr...

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NETWORKS International Telecommunications Network Strategy and Planning Symposium

作者： Tibor Cinkler Peter Soproni Gyula Sallai Department of Telecommunications and Media Informatics Budapest University슠of슠Technology슠and슠Economics Budapest Hungary

The difference between dedicated and shared protection is well known. In this paper we investigate these ideas applied to sharing power budgets of links. When defining protection paths not as a “hot stand-by” but rather as a “cold stand-by” the power needed for protection will be lower; therefore the routeable distance of certain connections should be longer, that increases the number of routeable demands. In this paper we present simulation results to show that in reality with the introduction of shared protection for Physical Impairment Constrained Routing (PICR) in large or saturated networks the number of routeable demands is lowered.

关键词： Routing Optical fiber networks Optical attenuators Quality of service Modulation Reliability Nonlinear optics

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