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Mutual Authentication Protocol for Low Computational Capacity RFID Systems

Mutual Authentication Protocol for Low Computational Capacit...

引用

IEEE GLOBECOM 2008 - 2008 IEEE Global Telecommunications Conference

作者： Gyozo Godor Matyas Antal Sandor Imre Department of Telecommunications Budapest University슠of슠Technology슠and슠Economics Budapest Hungary

Since tags have very limited memory and very low computational capacity a so-called lightweight authentication is needed. The earlier suggested algorithms do not satisfy all of the security requirements. In this paper we introduce our SLAP protocol which meets all the security requirements. Our solution provides an efficient mutual authentication method by which a given tag and the back-end can authenticate each other easily, quickly and securely even if large amount of tags are stored in the database. The protocol can defy the well-known attacks and does not demand high computational capacity.

关键词： Authentication Radiofrequency identification Data security Cryptographic protocols Elliptic curve cryptography Telecommunication computing Databases Power generation economics Arithmetic Public key cryptography

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Fair radio resource allocation in multiuser OFDMA networks

Fair radio resource allocation in multiuser OFDMA networks

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Mediterranean Electrotechnical Conference (MELECON)

作者： S. Imre A. Mraz Department of Telecommunications Budapest University슠of슠Technology슠and슠Economics Budapest Hungary

Fair OFDMA (orthogonal frequency division multiple access) based subcarrier allocation algorithm is proposed. The method includes adaptive modulation and power control per subcarrier, considering actual channel state information between users and base station. To heighten dasiafairnesspsila, preliminary power control (PPC) is executed before efficient allocation of radio resources.

关键词： Modulation Resource management OFDM Signal to noise ratio Power control Base stations Quadrature amplitude modulation

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Investigate heat conduction ability of power components with Dijsktra Algorithm

Investigate heat conduction ability of power components with...

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International Spring Seminar on Electronics technology

作者： Balazs Illes Gabor Harsanyi Department of Electronics Technology Budapest University슠of슠Technology슠and슠Economics Budapest Hungary

In this paper we present that how the graph theory can be used in the field of thermal study. We have developed a method which can describe the heat conduction ability of large size power components during the reflow soldering. Our method exploit that the heat conduction ability of the materials can be described with time coefficients which is determined by the thermal resistance and the heat capacity of the given material. We implemented this in a Matlab program which generates a directed and weighted graph from the discrete thermal model of the investigated component. The program uses the Dijsktra Algorithm to find the shortest "conduction ways" between the different parts of the component. With our method, the following effects can be studied during the soldering: the deviation between the generated conduction heat flows from the different faces of the component, from which direction and way get a chosen point the most heat, the effect of heat distraction, etc...

关键词： Conducting materials Assembly Reflow soldering Temperature distribution Manufacturing processes Ovens Semiconductor device modeling Resistance heating Thermal resistance Surface-mount technology

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Detecting the normal quantum/Compound Quantum channel with von Neumann measurement

Detecting the normal quantum/Compound Quantum channel with v...

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IEEE International Symposium on Information Theory

作者： Lorant Farkas Department of Analysis Budapest University슠of슠Technology슠and슠Economics Budapest Hungary

In this brief summary we show an alternate prove for the fundamental theorem of quantum channel coding. This new prove is stronger then the previously known results because it is used von Neumann measurement. Moreover... 详细信息

ISBN: (纸本)9781424422562

关键词： Error probability Decoding Quantum mechanics Compounds Encoding Information theory Channel coding

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Automatic transformation generation in service oriented architecture

Automatic transformation generation in service oriented arch...

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International Spring Seminar on Electronics technology

作者： Peter Martinek Bela Szikora Department of Electronics Technology Budapest University슠of슠Technology슠and슠Economics Budapest Hungary

Enterprise application integration (EAI) is one of the most current topics in information technology today. Applying Service Oriented Architecture (SOA) is a fair headway in EAI, but involving the productive enterprise systems (ES) into such integration scenarios still raises a lot of open issues: the data representation probably differs in participating ESs, which indicates the need for detection of semantically related concepts between them, the appropriate services of the SOA architecture must be found to the right place of the chain of the collaborative business process and the composed process containing semantic services must be prepared for the process run-time, etc. In this paper we present an approach which extends SOA standards by attaching semantic metainformation to the services of ESs. The main part of our work is the adaptation of the services from legacy systems into our semantically enriched SOA environment. The focus is set on automatic finding of semantic related pairs between global schema concepts and the concepts of services. Furthermore a method for generation of transformation rules between the service's data schema and our semantic global schema is also introduced.

关键词： Service oriented architecture Business Electronic switching systems Collaborative work Companies Collaboration Manufacturing processes Environmental economics Information technology Runtime

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The application of the double domain simulation by different harmonic filtering methods of 25 kV electric traction systems

The application of the double domain simulation by different...

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International Conference on Harmonics and Quality of Power

作者： P. Kiss A. Dan Department of Electric Power Engineering Budapest University슠of슠Technology슠and슠Economics Budapest Hungary

ISBN: (纸本)9781424417711

The paper shows the present results of a long term research work. The authors are working on the modeling of penetration and elimination of harmonic disturbance originating from the high power railways. This paper presents the application of the so called double domain simulation method, which is a combination of frequency and time dependent model. This novel method is used to improve the accuracy of the frequency domain simulation. The double domain simulation is suitable for studying the different filtering methods, both the passive, active and hybrid filtering. This paper would like to give an overview about the application of filtering possibilities using the double domain simulation method.

关键词： Power harmonic filters Filtering Active filters Passive filters Voltage Rail transportation Impedance Frequency domain analysis Power system harmonics Harmonic distortion

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Rigid-flexible interconnection realized by laser soldering through polyimide

Rigid-flexible interconnection realized by laser soldering t...

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Electronics System-Integration technology Conference, ESTC

作者： Balint Balogh Zsolt Illyefalvi-Vitez Zsolt Baranyay Department of Electronics Technology Budapest University슠of슠Technology슠and슠Economics Budapest Hungary

The transmission laser soldering technology described in this paper enables the realization of rigid - flexible interconnection after mass reflow soldering of the surface mount components to the rigid printed circuit board (PCB). The novelty of our approach is that the solder paste is heated up selectively by an Nd:YAG laser through the flexible substrate, which is in most cases polyimide (PI). The amount of transmitted laser energy can be controlled and concentrated so precisely to the metallic parts (pad and solder), that it enables the application of solder paste with higher melting point as the temperature tolerance of the flexible substrate, thus solder joints can be formed on polyethylene-terephtalate (PET) and polyethylene-naphtalate (PEN) substrates as well. The paper describes the transmission laser soldering process parameters used for PI, PET and PEN substrates and SnAgCu and SnBi solders. The metallographic analysis and the pull strength measurement results are also presented. Based on our experiments it can be stated that our laser soldered joints of rigid to flexible printed circuits show similar quality and reliability properties to the reflow soldered ones.

关键词： Soldering Polyimides Pump lasers Flexible printed circuits Integrated circuit interconnections Positron emission tomography Polymers Connectors Power lasers Copper

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Life-time test of laser and reflow soldered flexible substrates

Life-time test of laser and reflow soldered flexible substra...

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International Spring Seminar on Electronics technology

作者： Reka Batorfi Zsolt Illyefalvi-Vitez Department of Electronics Technology Budapest University슠of슠Technology슠and슠Economics Budapest Hungary

We examined the quality and the reliability of lead-free solder joints which were made with a selective laser soldering process. The three types of applied substrate materials - polyimide (PI), a kind of polyester (PET) and polyethylene-naphtalate (PEN) - withstood the local heat dose even if the allowed temperature limits of them were lower than the melting points of the applied solders. We used substrates with different adhesives and cover layers. The two types of solder pastes were SnBi and SnAgCu (SAC) alloys. Altogether 16 solder-substrate-adhesive combinations were tested and compared to similar reflow soldered combinations when the implementation of the technology was possible. The testboards were submitted to HAST (highly accelerated stress test) and the degradation was monitored. Optical inspection and shear force measurements were used for comparative analyses. As a result, the combinations were put in order on the basis of these data. With these achievements; the processing, materials, product performance and reliability could be improved.

关键词： Life testing Soldering Optical materials Environmentally friendly manufacturing techniques Lead Polyimides Positron emission tomography Temperature Life estimation Stress

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Electrochemical characterization of DNA covered gold thin film electrodes for biosensoric applications

Electrochemical characterization of DNA covered gold thin fi...

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International Spring Seminar on Electronics technology

作者： Attila Bonyar Hunor Santha Department of Electronics Technology Budapest University슠of슠Technology슠and슠Economics Budapest Hungary

The scope of this work is to create different biologically active monolayers on gold thin film electrodes applying Self Assembled Monolayer (SAM) technology and to characterize them with electrochemical methods like Cyclic Voltammetry (CV) and Electrochemical Impedance Spectroscopy (EIS). Three monolayer structures applying different methods that are used to gain better probe orientation were created and compared according to hybridization with complementary target DNA chains in two different lengths. An electrocleaning protocol to gain high quality electrode surfaces without the need of chemical cleaning reagents and a procedure to qualitatively monitor bioreceptor surfaces with good reproducibility were investigated.

关键词： DNA Gold Transistors Electrodes Biosensors Electrochemical impedance spectroscopy Probes Protocols Chemicals Cleaning

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Multithreading and Strassen’s algorithms in SUNRED field solver

Multithreading and Strassen’s algorithms in SUNRED field so...

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International Workshop on Thermal Investigation of ICs and Systems (THERMINIC)

作者： Laszlo Pohl Department of Electron Devices Budapest University슠of슠Technology슠and슠Economics Budapest Hungary

Complex structures can be well modeled by simulation using appropriate field solvers; however the investigation of detailed models is a time demanding process even on the latest computers. This article surveys the new developments resulting in execution time reduction of the thermal and electro thermal field solver that takes a finite differences method (FDM) based model as input. This tool is based on the vectorized version of SUNRED algorithm. One part of the developments is architectural optimization: multithreading, memory and cache system optimization, the other part is the implementation of matrix multiplication and inversion acceleration algorithms. The result is a significantly faster field solver program.

关键词： Multithreading Yarn Computational modeling Finite difference methods Voltage Analytical models Transient analysis Steady-state Appropriate technology Electron devices

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