Thermal effect plays an important role during frequency tripled nanosecond Nd:YAG laser ablation of polyimide. This paper describes simulation results and experimental investigations of laser induced temperature chang...
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Thermal effect plays an important role during frequency tripled nanosecond Nd:YAG laser ablation of polyimide. This paper describes simulation results and experimental investigations of laser induced temperature change in polyimide. The experimental results show that the ablation rate is temperature dependent, which means the underlying copper layer and the pulse repetition frequency (PRF) influence the etch depth. Based on our model it is possible to control the processing parameters according to the pattern geometry for a better exploitation of laser micromachining
Ethernet is being increasingly employed in metro networks. Ethernet gives routing schemes and protocols for building up trees, for instance STP, RSTP and MSTP. It also implies simple restoration mechanisms. In this pa...
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Ethernet is being increasingly employed in metro networks. Ethernet gives routing schemes and protocols for building up trees, for instance STP, RSTP and MSTP. It also implies simple restoration mechanisms. In this paper we propose an optimization framework, where the Ethernet MSTP trees are protected and QoS is guaranteed even after a failure. The optimization is based not only on the topology, but it also takes traffic conditions and QoS constraints into account. The numerical results show that the proposed optimization significantly increases the throughput of the network. The best result can be achieved when preemption is assumed, i.e., when the best effort traffic may remain unprotected, but not the high priority one. This way high throughput can be realized at normal operation, while it still protects prioritized traffic in case of a failure. Furthermore, protection mechanisms act faster than the standard restoration mechanism resulting shorter out-of-service times, and therefore higher availability.
The last 20 years have seen a lot of changes in the life of organizations. The always strong competition to be on the edge increased due to the saturation of the consumer markets. The new way to improve everyday worki...
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The last 20 years have seen a lot of changes in the life of organizations. The always strong competition to be on the edge increased due to the saturation of the consumer markets. The new way to improve everyday working is computer-based information systems, which have become essential for survival in the last couple of years. This paper presents the short history of ERP systems first. From computer support in separated areas, through understanding the importance of big information (data) storages to proving the unique advantages of integration we arrive to the most modern ERPs. The demands (new challenges) and capabilities are examined and compared. On the other hand the creation of some practical examples and solutions are also presented. The full life-cycle (planning, development, testing, installation and continuous expansion) of the printed circuit board support system at the Department of Electronic technology of budapestuniversity of technology and economics (BUTE) is shortly described. Lastly a modern concept and a new model are presented based on the view of business and workflow processes
After an introductory discussion of the thermal issues in stacked die packages in general, two major subjects are discussed in the paper: the qualification of die attach in stacked die structures and the questions of ...
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After an introductory discussion of the thermal issues in stacked die packages in general, two major subjects are discussed in the paper: the qualification of die attach in stacked die structures and the questions of compact thermal modeling. An overview is given about the currently used techniques for the qualification of the die attach for failure analysis in stacked structures. The third part of the paper presents the state-of-the-art and the major issues of compact thermal modeling of stacked die packages.
Summary form only given. TCP congestion control can perform badly in highspeed wide area networks because of its slow response with large congestion window. The challenge for any alternative protocol is to better util...
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Summary form only given. TCP congestion control can perform badly in highspeed wide area networks because of its slow response with large congestion window. The challenge for any alternative protocol is to better utilize networks with high bandwidth-delay products in a simple and robust manner without interacting badly with existing traffic. Scalable TCP is a simple sender side alteration to the TCP congestion window update algorithm. In this paper we numerically evaluate the congestion control method of scalable TCPs and its impact on other existing TCP versions. The general purpose of this work is to study the behavior of scalable TCP not only in situations where it was reportedly performing good but also under more extreme conditions. We also revealed whether scalable TCP maintains an acceptable fairness towards highspeed and/or regular TCP versions. Fairness of scalable TCPs with different round trip times are also investigated.
The article presents the visions, plans, and actions related to the implementation of electronic governmental and electronic public administration services in Hungary, in the past few years. The roles of governmental ...
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The article presents the visions, plans, and actions related to the implementation of electronic governmental and electronic public administration services in Hungary, in the past few years. The roles of governmental organizations (such as the Ministry of Informatics and Communications, Prime Minister's Office, Ministry of Interior, Ministry of Finance), the legal and technical regulations (such as the XXXV. act in 2001, CVIII. act in 2001, 20/2004. (IV. 21.)), some of the concrete projects (such as the WEB-based pilot projects, XR, IOP, local governmental pilot projects) and plans about the future (written in Hungarian Information Society Strategy) are also shown in the article. Experts keep on working in Hungary therefore this article can be just a snapshot about the actualities.
The chip manufacturers are loading more functions onto smaller silicon chips, challenging the back end assembly, which cover dicing, die attach, wire bonding, encapsulation, form and test. High density packages are pu...
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The chip manufacturers are loading more functions onto smaller silicon chips, challenging the back end assembly, which cover dicing, die attach, wire bonding, encapsulation, form and test. High density packages are pushing the limits of equipment and process. Micro wire bonding is the process of connecting the silicon chip to external contacts of the package. Different types of wires are used for the wire bond process example: gold (Au), aluminum (Al). They are both ductile enough to withstand deformation during the bonding steps - while remaining strong and reliable - and highly conductive. X-ray inspection is widely used to inspect and analyze micro wire bonds because s ing X-ray - it makes hidden anomalies visible. Integrated circuits - after packaging - cover their micro wire bonds and the optical testers are unsuitable for check them, and X-ray inspection systems are suitable for check these hidden wires. As conclusion, this article has presented, how we can use X-ray inspection systems to see through and into the integrated circuits and how to check hidden wire anomalies
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