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Electronic components and technology conference (ECTC)

作者： Ji-Won Shin Yong-Won Choi Young Soon Kim Un Byung Kang Sun Kyung Seo Kyung-Wook Paik Dept. of Materials Science and Engineering Korea Advanced Institute of Science and Technology (KAIST) Package Development team Semiconductor R&D Center Semiconductor Business Samsung Electronics Co. LTD

Non-conductive film (NCF) with Zn nano-particles is an effective solution for fine-pitch Cu-pillar/Sn-Ag hybrid bump interconnection in terms of manufacturing process and interfacial reliability. In this study, NCFs with Zn nano-particles of different acidity, viscosity, and curing speed were formulated, and diffused Zn contents in the Cu pillar/Sn-Ag hybrid bumps were measured after 3d TSV chip-stack bonding. Amount of Zn diffusion into the Cu pillar/Sn-Ag bumps increased as the acidity of resin increased, as the viscosity of resin decreased, as the curing speed of resin decreased, and as the bonding temperature increased. diffusion of Zn nano-particles into the Cu pillar/Sn-Ag bumps are maximized when the resin viscosity became lowered and the solder oxide layer was removed. To analyze the effect of Zn on IMC reduction, NCFs with 0 wt%, 1 wt%, 5 wt%, and 10 wt% of Zn nano-particles were bonded on the test vehicles, and aged at 150°C up to 500 hours. NCF with 10wt% Zn nano-particle showed remarkable suppression in Cu 6 Sn 5 and (Cu, Ni) 6 Sn 5 IMC compared to NCFs with 0 wt%, 1 wt%, and 5 wt% of Zn nano-particles. However, in terms of Cu 3 Sn IMC suppression, which is the most critical goal of this experiment NCFs with 1 wt%, 5wt%, and 10wt% showed an equal amount of IMC suppression. As a result, it was successfully demonstrated that the suppression of Cu-Sn IMCs was achieved by the addition of Zn nano-particles in the NCFs resulting an enhanced reliability performance in the Cu/Sn-Ag hybrid bumps bonding in 3d TSV interconnection.

关键词： Zinc resins Through-silicon vias Viscosity Curing Bonding Aging

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A Novel double Layer NCF for Highly reliable Micro-Bump Interconnection

A Novel Double Layer NCF for Highly Reliable Micro-Bump Inte...

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IEEE Electronic components and technology conference

ISBN: (纸本)9781479924080

40 μm pitch Cu-pillar/Sn-Ag bump to Ni pad thermo-compression bonding was performed using non-conductive films (NCFs) with different curing agents. The joint morphology of Cu-pillar/Sn-Ag bump/Ni pad was dependent on the viscosity and curing speed of NCFs. Imidazole NCF with high viscosity and fast curing speed showed no solder wetting on both Cu-pillar and Ni pad. However, anhydride NCF with low viscosity and slow curing speed showed both solder wetting on Cu-pillar and Ni pad. double layer NCF consisting of imidazole NCF as top layer and anhydride NCF as bottom layer was designed and optimized to eliminate solder wetting on Cu-pillar. Joints bonded using double layer NCF showed ideal joint shape with no solder wetting on Cu pillar and good wetting on pad. Thermal aging at 150℃ was performed and IMC growth rate of Cu6Sn5 and Cu3Sn was slower for double layer NCF compared to single layer NCF due to reduced reacting area for Cu and Sn.

关键词： NCF Novel double Layer Highly reliable Micro-Bump Interconnection

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Study of intermetallic compound growth and failure mechanisms in long term reliability of silver bonding wire

Study of intermetallic compound growth and failure mechanism...

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Electronics Packaging technology conference (EPTC)

作者： You Cheol Jang So Yeon Park Hyoung dong Kim Yeo Chan Ko Kyo Wang Koo Mi ri Choi Hyung Giun Kim Nam Kwon Cho Il Tae Kang Jae Hak Yee Sung Hwan Lim R&D Statschippac Korea Icheon Republic of Korea R&D STATSChipPAC Korea Icheon Republic of Korea Department of Advanced Materials Science and Engineering Kangwon National University Republic of Korea Gangwon Regional Division Korea Institute of Industrial Technology Gangneung Republic of Korea R&D Heraeus Oriental HiTec Co. Ltd Incheon Republic of Korea Kangwon National University Republic of Korea

ISBN: (纸本)9781479969951

Silver wires have become a novel bonding material in recent years. But users & field engineers are still divided over the issue of reliability performance including failure mechanism and intermetallic compounds (IMCs) formation. In this study, new type of high purity silver wire with 96Ag-3Pd-1Au alloy (96% Ag) is introduced, and the bonding properties on Al bond pad are evaluated through bondability & reliability test. reliability tests for wire characterization are high-temperature-storage lifetime test (HTST) and unbiased highly-accelerated stress test (uHAST) with temperature and humidity. Two types of mold compounds are used which have different Cl- ion content. Below 10 ppm of Cl- ion for the green compound and 27 ppm for the normal one. Bondability, IMC formation(Ag 2 Al, Ag 3 Al) & growth rate are measured for both HTST150'C & 175'C for 2000h and the possible failure mechanism is defined based on the micro-structural characterization from uHAST in which the repetitive oxidation and reduction reactions occur due to the galvanic reaction and the Cl- ions with sufficient moisture and thermal energy, and the reduction reaction of Ag-Al IMCs and Al pad causes to form the micro-crack failure.

关键词： Wires Bonding Electromagnetic compatibility reliability Gold Silver Failure analysis

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Fast estimation algorithm for living body radar

Fast estimation algorithm for living body radar

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International Symposium on Antennas and Propagation (ISAP)

作者： dai Sasakawa Keita Konno Naoki Honma Kentaro Nishimori Nobuyasu Takemura Tsutomu Mitsui Yoshitaka Tsunekawa Graduate School of Engineering Iwate University Morioka Japan Graduate School of Science and Technology Niigata University Niigata Japan Samsung R&D Institute Japan CO. LTD. Yokohama Japan

The authors have proposed a direction estimation method of the living-body using array antenna in multi-path environment. However, this method has a problem that takes time as several tens of seconds. In this paper, we present a fast algorithm for estimating living-body direction. The experiment showed that the proposed method works well in estimating living-body direction with high accuracy in multi-path environment even when the observation time is less than conventional method.

关键词： Estimation Arrays Channel estimation Antenna measurements radar Antenna arrays directive antennas

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Abstracts from the Food Allergy and Anaphylaxis Meeting 2016 Abstracts

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CLINICAL ANd TrANSLATIONAL ALLErGY 2017年第SUPPL 1期7卷 10-10页

作者： [Anonymous] Department of Pediatrics Children’s Hospital Roubaix France Division of Pulmonology and Allergology Department of Pediatrics Faculty of Medicine and Children’s Hospital Lille France Allergy Vigilance Network Vandoeuvre les Nancy France Université Lille 2 CHU Lille EA 2694 - Santé Publique: épidémiologie et qualité des soins Lille France Biostatistics Unit Maison Régionale de la Recherche Clinique CHRU Lille Lille France Department of Allergology Emile Durkheim Hospital Epinal France Centre d’Epidémiologie sur les Causes Médicales de Décès INSERM CHU de Bicêtre Le Kremlin-Bicêtre France The Allergy Vigilance Network University Hospital Nancy Nancy France Pediatric Pulmonology and Allergy Department Hôpital Jeanne de Flandre CHU Lille Lille France Charité - Universitätsmedizin Berlin Berlin Germany Institute for Social Medicine Epidemiology and Health Economics Charité - Universitätsmedizin Berlin Berlin Germany Institute of Social Medicine Epidemiology and Health Economics Charité Universitätsmedizin Berlin Berlin Germany Department of Dermatology and Allergology Comprehensive Allergy Center Charité Charité – Universitätsmedizin Berlin Berlin Germany Department of Dermatology and Allergy Allergie-Centrum-Charité Charité-Universiätsmedizin Berlin Berlin Germany Department of Dermatology and Allergology Comprehensive Allergy Center Charité Charité Universitätsmedizin Berlin Berlin Germany University Hospital Basel Basel Switzerland Allergy Unit Department of Dermatology University Hospital Basel Switzerland Universitätsklinikum Salzburg Salzburg Austria Department of Dermatology and Allergy Centre Odense Research Center for Anaphylaxis (ORCA) Odense University Hospital Odense Denmark Odense University Hospital Odense Denmark Serviço de ImunoalergologiaCentro Hospitalar de São João E.P.E. Porto Portugal GRIAC Research Institute University of Groningen University Medical Center Groningen Groningen The Netherlands Serviço de Imunoalergologia Centr

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GPU Accelerated High-dimensional compressed Sensing MrI

GPU Accelerated High-dimensional Compressed Sensing MRI

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International conference on control, Automation, robotics & Vision

作者： Zhen Feng He Guo Yinxin Wang Yeyang Yu Yang Yang Feng Liu Stuart Crozier System Software R&D Department Inspur (Beijing) Electronic Information Industry Co. Ltd. Jinan 250101 P. R. China School of Computer Science & Technology Dalian University of Technology Dalian 116624 P. R. China School of Information Technology & Electrical Engineering The University of Queensland Brisbane QLD 4072 Australia

ISBN: (纸本)9781479952007

recently, we have developed a tensor-decomposition based compressed sensing (CS) method for dynamic magnetic resonance imaging (dMrI) [1]. The proposed CS-dMrI method exploits the sparsity of the multi-dimensional MrI signal using Higher-order singular value decomposition (HOSVd). Our preliminary study indicates that, compared with conventional approaches, the proposed CS method offers further acceleration in acquisition and also improves image quality. To further enhance the algorithm efficiency, in this work, we present a parallelized implementation of the HOSVd-based CS reconstructions using a graphics processing unit (GPU). The cine cardiac MrI study indicated the efficiency and accuracy of the GPU-accelerated high-dimensional CS-dMrI method.

关键词： compressed sensing dynamic magnetic resonance imaging GPU computing

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Some Items of Interest to Process r&d Chemists and Engineers

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Organic Process research & development 2015年第10期19卷 1369-1373页

作者： John Knight Sylvain Guizzetti Wenyi Zhao James A. Schwindeman dongbo Zhao J-KONSULT Ltd. 1 Beechwood Lane Heathfield East Sussex TN21 8QQ U.K. The Zlota Company LLC 15 Fairbanks Road Sharon Massachusetts 02067-2858 United States. E-mail: Pfizer Chemistry 10578 Science Center Drive San Diego California 09121 United States. E-mail: Bristol-Myers Squibb Chemical Development One Squibb Drive New Brunswick New Jersey 08903 United States. E-mail: Jacobus Pharmaceutical Co. Inc. Princeton New Jersey 08540 United States. E-mail: Bayer Technology & Engineering (Shanghai) Co. Ltd. 82 Mu Hua Road Shanghai Chemical Industry Park Shanghai 201507 P. R. China. E-mail: NovAlix Building A: Chemistry Bioparc Bld Sébastien Brant BP 30170 F-67405 Illkirch Cedex France. E-mail: Polyurethane Process R&D The Dow Chemical Co. Freeport TX 77541 United States. E-mail: Rohner Inc. 4066 Belle Meade Circle Belmont NC 28012 United States. E-mail:

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Surface passivation of c-Si by Atomic Layer deposition TiO2 thin films deposited at low temperature

Surface passivation of c-Si by Atomic Layer Deposition TiO2 ...

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2014 IEEE 40th Photovoltaic Specialist conference (PVSC)

作者： Ing-Song Yu I-Hsuan Chang Hsyi-En- Cheng Yung-Sheng Lin Department of Materials Science and Engineering National Dong Hwa University Hualien Taiwan R.O.C. Department of Electro-Optical Engineering Southern Taiwan University of Science and Technology Tainan Taiwan R.O.C. R&D Department E-Ton Solar Tech. Co. LTD. Tainan Taiwan R.O.C.

ISBN: (纸本)9781479943975

For the silicon surface passivation, we investigate titanium dioxide (TiO 2 ) deposited on p-type FZ silicon wafer by Atomic Layer deposition (ALd) technique at low temperature as 200°. In the repost, four kinds of film thickness: 8 nm, 15 nm, 35 nm and 66 nm were proposed, and we found amorphous TiO 2 thin film with thickness 8 nm have very good surface passivation properties on Si, and its surface recombination velocity can be lowered to 44.24 cm/s, which is good for the applications in crystalline silicon solar cells. However, we find the surface passivation properties decline as increasing the thickness of TiO 2 films. From the characterization of Scanning Electron Microscopy (SEM), Grazing Incidence X-ray (GIXrd), Transmission Electron Microscopy (TEM), Atomic Force Microscopy (AFM) and stress measurements of thin film, TiO 2 anatase phase forms due to the stress inducing phase transformation, and surface roughness increases a lot for thicker TiO 2 films. The phase transformation and surface roughening make the defects formation at the interface of Si and TiO 2 , which increase surface recombination velocity.

关键词： Films Silicon Photovoltaic cells Microscopy Annealing Indexes radio frequency

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Erratum: “Effect of hydrothermal condition on the formation of multi-component oxides of Ni-based metallic glass under high temperature water near the critical point” [AIP Advances 5, 077132 (2015)]

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AIP Advances 2015年第12期5卷

作者： J. S. Kim S. Y. Kim d. H. Kim r. T. Ott H. G. Kim M. H. Lee Headquarters Bearing Division Iljin Global Co. Ltd. Seoul 135-875 South Korea Rare Metals R&D Group Korea Institute of Industrial Technology Incheon 406-840 South Korea Center for Noncrystalline Materials Yonsei University Seoul 120-749 South Korea Division of Materials and Engineering Ames Laboratory US DOE Ames Iowa 50011 USA LWR Fuel Technology Division Korea Atomic Energy Institute Daejeon 305-600 South Korea

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Joining of Pc and Pmma by Inserting Their Injection Molding Blends into the Interface

Joining of Pc and Pmma by Inserting Their Injection Molding ...

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The 11th China-Japan joint conference on composite Materials(第十一届中日复合材料学术会议)

作者： Eiichi Sakai Jianhui Qiu Genki Watanabe Kento Sasaki Departnent of Machine Intelligence and Systems Engineering Facultyof System Science and TechnologyAkita Prefectural University84-4 Tsuchiya EbinokuchiYurihonjoAkita015-0055Japan Panasonie System Networks R&D Lab.Co.Ltd.2-5 Akedorilzumi-kuSendaiMiyagi981-3206Japan

Polycarbonate (PC)-poly (methyl methacrylate) (PMMA) joints were prepared by injection welding of inserting their *** shear strength of the interface was measured in relation to the blend ratio of inserted PC/*** highest strength of about 23.7 MPa was shown in the joint specimen inserting PC/PMMA with the blend ratio of 75:25 (PC:PMMA).

关键词： Polycarbonate (PC) Poly (methyl methacrylate) (PMMA) blends Joint strength Interface

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