As a result of the increasing operating frequency and the number of transistors of IC, not only the signal integrity (SI), but the power integrity (PI) has also grown from non-existent to an important system. The obje...
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ISBN:
(纸本)9781467394932
As a result of the increasing operating frequency and the number of transistors of IC, not only the signal integrity (SI), but the power integrity (PI) has also grown from non-existent to an important system. The objective of power integrity is to produce a clean signal for the high-speed driver by supplying a good source. A good source needs to fulfill two criteria: 1) meet the DC power requirement and 2) reduce the power fluctuation caused by the AC current switch. This paper will discuss power integrity simulation using the 3D fullwave simulation tool cst STUDIO SUITE. The accuracy of the simulation results are also compared with the measurement results.
Field evaluations close to electrically large scattering structures are a demanding task for numerical simulation techniques. Based on a ray optical asymptotic method, we implement a technique for the fast calculation...
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Field evaluations close to electrically large scattering structures are a demanding task for numerical simulation techniques. Based on a ray optical asymptotic method, we implement a technique for the fast calculation of a large amount of near field samples. The accuracy of the method is verified by comparing to the Mie field solution of a plane wave incident on a perfectly conducting sphere and analyzing its convergence for large radii of curvature. By using hardware acceleration, we achieve a considerable speedup compared to the CPU-only algorithm.
This paper considers the hp-finite element discretization of an elliptic boundary value problem using tetrahedral elements. The discretization uses a polynomial basis in which the number of nonzero entries per row is ...
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Surface impedance boundary conditions (SIBC) for superconductor layers are provided. These can be used for arbitrary thick conductors from very thin to very thick. A superconducting layer is considered as a TEM transm...
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This paper outlines a process as it is commonly being used for developing commercial electromagnetic simulation tools. Special emphasis is taken on how research fits into this process and in particular on the importan...
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Surface impedance boundary conditions (SIBC) for lossy metal layers are presented that are not limited to the frequency range in which a metal layer is thicker than several skin depth. A metal layer is considered as a...
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Elements of high-frequency circuits are often subject to high temperatures caused by power losses. If properties of materials comprising these elements depend on temperature, this heating may modify the spectral chara...
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This paper outlines a process as it is commonly being used for developing commercial electromagnetic simulation tools. Special emphasis is taken on how research fits into this process and in particular on the importan...
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ISBN:
(纸本)9781457702501
This paper outlines a process as it is commonly being used for developing commercial electromagnetic simulation tools. Special emphasis is taken on how research fits into this process and in particular on the importance of cooperations between tool vendors and research institutions. Some examples for successful cooperation projects are given to illustrate different possible types of cooperation models.
Elements of high-frequency circuits are often subject to high temperatures caused by power losses. If properties of materials comprising these elements depend on temperature, this heating may modify the spectral chara...
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Elements of high-frequency circuits are often subject to high temperatures caused by power losses. If properties of materials comprising these elements depend on temperature, this heating may modify the spectral characteristics of these elements considerably. In the current work a procedure is demonstrated allowing to estimate this effect quantitatively. As an example, a dielectric resonator is considered containing elements with a high temperature-dependent permittivity. A finite difference time domain solver delivers the distribution of losses within the resonator. A finite difference thermal solver utilizes this information for the computation of temperature distribution. The new material permittivity is then computed and the transient computation repeated with the new material properties. S-parameters of the heated filter are compared with those of the "cold" filter. The whole solution strategy is shown, illustrating a new concept developed for coupled computations.
Surface impedance boundary conditions (SIBC) for lossy metal layers are presented that are not limited to the frequency range in which a metal layer is thicker than several skin depth. A metal layer is considered as a...
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Surface impedance boundary conditions (SIBC) for lossy metal layers are presented that are not limited to the frequency range in which a metal layer is thicker than several skin depth. A metal layer is considered as a TEM transmission line so that the SIBCs can be obtained as the input impedances of an open ended and a short circuited transmission line, respectively. The SIBCs are verified for a MMIC microstrip line and a coplanar waveguide.
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