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21st International Display Workshops 2014, IDW 2014

作者： Son, Jung-Young Lee, Beom-Ryeol Park, Min-Chul Chernyshov, Oleksii Biomedical Engineering Dept. Konyang University Nonsan Chungnam320-711 Korea Republic of Next Generation Visual Computing Research Team ETRI DaeJeon305-700 Korea Republic of Sensor Systems Research Center Korea Institute of Science and Technology Seoul136-791 Korea Republic of

ISBN: (纸本)9781510827790

Properties of a DMD as being a display device for holographic displays and the condition of being a blazed grating are discussed. High speed, large separation between reconstructed image and reconstruction beam, a rhombic pixel arrangement and no zero11' order beam for a specific wavelength are those desired for the displays. © 2014 . Society for Information Display. All rights reserved.

关键词： Dynamic mode decomposition

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Optimization of geometric parameters for circular loop antenna in magnetic coupled wireless power transfer

Optimization of geometric parameters for circular loop anten...

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IEEE Wireless Power Transfer Conference (WPTC)

作者： Hyo-Jin Choi Sangbin Lee Cheolung Cha Department of Electrical and Computer Engineering Korea University Seoul Korea Next Generation Convergence Sensor Research Center Korea Electronics Technology Institute (KETI) Seongnam-si Korea

In this paper, a theoretical approach has been proposed to design coil-based loop antenna for magnetic coupled wireless power transfer systems. The proposed methodology can be applied to predict the power transfer efficiency at a specific target distance. The modeling of coil winding for optimized circular loop antenna has been optimized by calculation of mutual inductance using Neumann's formula and equivalent model of magnetic coupled WPT. The calculation of efficiency in accordance with transfer distance can be performed using the proposed model. The error rate between calculated and measured efficiency is less than 2.61% at target distance.

关键词： Antennas Inductance Antenna measurements Wireless communication Coils Magnetic resonance Couplings

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Chirped moirés in 3-D displays

Chirped moirés in 3-D displays

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Euro-American Workshop on Information Optics (WIO)

作者： Jung-Young Son Min-Chul Park Beom-Ryeol Lee Biomedical Engineering Dept. Konyang University Nonsan Korea Sensor Systems Research center Korea Institute of Science and Technology Seoul Korea Next generation visual computing research team Electronics and Telecom Research Institute Daejeon Korea

The moirés appearing in the contact-type 3 dimensional displays are chirped by the thickness of the viewing zone forming optics (VZFO) in the displays. Due to the thickness, the patterns of the display panels for the displays are refracted on to the pattern plane of VZFO to superpose with the pattern on the plane. The moirés formed this way can have chirped fringe patterns, and change numbers and phases of their fringes according to the changes in viewer's viewing positions and viewing angles at a given viewing distance.

关键词： Chirp Gratings Three-dimensional displays Lenses Refractive index Cameras

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SOI-based plasmonic nanogap resonator based wavelength filter

SOI-based plasmonic nanogap resonator based wavelength filte...

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The Joint International Conference on Optical Internet and next generation Network (COIN-NGNCON)

作者： Geum-Yoon Oh Junhee Park Jeong-ho Ha Tai-Young Kang Han-Young Lee Young-Wan Choi Next Generation Convergence Sensor Research Center Korea Electronics Technology Institute Bundang-gu Seongnam-si Gyeonggi-do Republic of Korea School of Electrical and Electronics Engineering Chung-Ang University Dongjak-gu Seoul Republic of Korea

We report the nanogap resonator with the straight waveguide without the ring shape resonator, which is replaced with a straight waveguide, metallic layer, and nanogap. We use the numerical method to investigate the resonant properties of the structure. The results reveal that the proposed structure has the band stop characteristic.

关键词： Optical waveguides Optical resonators Plasmons Optical filters Optical surface waves Surface waves

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Direct liquid cooling module with high reliability solder joining technology for automotive applications

Direct liquid cooling module with high reliability solder jo...

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International Symposium on Power Semiconductor Devices and Ics (ISPSD)

作者： Akira Morozumi Hiroaki Hokazono Yoshitaka Nishimura Yoshinari Ikeda Yoichi Nabetani Yoshikazu Takahashi Next Generation Module Development Center Fuji Electric Co. Ltd. Nagano Japan Fundamental Technology Research Center Fuji Electric Co. Ltd. Tokyo Japan Interdisciplinary Graduate School of Medicine and Engineering University of Yamanashi Kofu Japan

We developed the direct-liquid-cooling IGBT module which enabled downsizing of a power control unit for HEV system and high reliability simultaneously. This module eliminates thermal grease by unifying a ceramic substrate and a heat sink. It contributes this module realized the reduction of thermal resistance 30 % compared to the conventional indirect liquid cooling type. High thermal conductive Si 3 N 4 ceramics for the substrate and lightweight aluminum heat sink that are suitable for automotive use demand are applied. The technological challenge of this module is to overcome the decrease of the reliability of the joint by large CTE mismatch between substrate and heat sink. We developed the Sn-Sb based solder material which can attain high reliability for automotive use with large CTE mismatch components. And IGBT module with this new solder is applied to HEV.

关键词： Substrates Heat sinks Ceramics Materials reliability Resistance heating

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Sa1621 Percutaneous Endoscopic Gastrostomy Under Steady Pressure Automatically Controlled Endoscopy (SPACE)

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Gastrointestinal Endoscopy 2014年第5期79卷 AB277-AB277页

作者： Hiroyuki Imaeda Kiyokazu Nakajima Naoki Hosoe Masanori Nakahara Shinichiro Zushi Motohiko Kato Kazuhiro Kashiwagi Yasushi Matsumoto Rieko Nakamura Norihito Wada Masahiko Tsujii Naohisa Yahagi Toshifumi Hibi Takanori Kanai Tetsuo Takehara Department of General Internal Medicine Saitama Medical University Saitama Japan Division of Collaborative Research for Next Generation Endoscopic Intervention Osaka University Osaka Japan Center for Diagnostic and Therapeutic Endoscopy Keio University Tokyo Japan Department of Gastroenterology Ikeda Municipal Hospital Osaka Japan Department of Gastroenterology and Hepatology Osaka University Osaka Japan Department of Surgery Keio University Tokyo Japan Division of Research and Development for Minimally Invasive Treatment Cancer Center Keio University Tokyo Japan Center for Advanced IBD Research and Treatment Kitasato University Kitasato Institute Hospital Tokyo Japan Division of Gastroenterology and Hepatology Department of Internal Medicine Keio University Tokyo Japan

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The K computer: 10 Peta-FLOPS supercomputer

The K computer: 10 Peta-FLOPS supercomputer

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The Joint International Conference on Optical Internet and next generation Network (COIN-NGNCON)

作者： Motoyoshi Kurokawa Development Group Next-Generation Supercomputer Research and Development Center RIKEN Kobe Hyogo Japan

The K computer currently known as most powerful supercomputer in the world, achieved LINPACK benchmark of 10.51 Peta-FLOPS. This talk gives an overview of the K computer and then describes its system configuration and key technologies. As an essential tool for science and technology, we provide overwhelming computing power to supercomputing users of many application fields through the K computer.

关键词： Supercomputers File systems Benchmark testing Reliability next generation networking Network topology

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Electro-migration behavior in low temperature flip chip bonding

Electro-migration behavior in low temperature flip chip bond...

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Electronic Components and Technology Conference (ECTC)

作者： Kei Murayama Mitsutoshi Higashi Taiji Sakai Nobuaki Imaizumi Product Planning & Development Dept I Research and Development Division Shinko Electric Industries Co Ltd. Japan Next-Generation Manufacturing Technologies Research Center Fujitsu Laboratories Ltd. Atsugi-shi Japan

In this report, we investigated electro-migration behavior of two types of low temperature bonding. One was Sn-57 Bi using conventional C4 process. The other was Au-In Transient Liquid Phase bonding (TLP). Electron flow to induce the electro-migration was from substrate side (Ni pad) to chip side (Cu post) with current density of 40000A/cm 2 at 150 degree C. In the case of Sn-57 Bi conventional C4 process, Bi quickly migrated to accumulate on the anode side (Cu post) and Sn migrated to the cathode side (substrate Ni pad). And the interconnect resistance increased until about 150 hours. Although this temperature was higher than the melting point of Sn57 Bi solder, there was no electrically break failure and the resistance was stabilized at 80% increase of initial resistance for more than 2800 hours, that was 10 times longer life of the Sn3.0wt%Ag0.5wt%Cu (SAC305) solder joint. From the cross-sectional analyses of Sn-57 Bi solder joints after the test, it was found that Bi layer and intermetallic compound (IMC) behaved as the barriers of the Cu atom migration into Sn solder. In the case of Au-In TLP bonding, remarkable change was not observed in metallic structure. And resistance was stabilized at 0.5% increase of initial for more than 1300 hours. Sn57 Bi solder joining and Au-In TLP bonding are promising candidates for the bonding technique of high density Flip Chip packages and 3D packages.

关键词： Nickel Resistance Current density Bismuth Tin Substrates Bonding

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Burst-mode wavelength upconversion using gain-clamped SOA for applying WDM technique to TDM-PON

Burst-mode wavelength upconversion using gain-clamped SOA fo...

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Optical Fiber Communication (OFC) Conference

作者： Chang-Jian Ke Bing Zhao Min-Ming Zhang De-Ming Liu Song-Lin Zhu Jie Su Alan E. Willner National Engineering Laboratory for Next Generation Internet Access System Huazhong University of Science and Technology Wuhan China Department of Electrical Engineering University of Southern California Los Angeles CA USA ZTE Shanghai Research and Development Center ZTE Corporation Shanghai China

We propose a WDM/TDM-PON utilizing AOWC. ~23 nm multiple- to single-wavelength upconversion for 1.25 Gbit/s burst-mode signals is realized by GC-SOA. The measured optical equalization is >8 dB and average latency is

ISBN: (纸本)9781557529381

关键词： Optical wavelength conversion Wavelength division multiplexing Optical filters Passive optical networks Wavelength measurement Optical fibers

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Stretchable Electronics: Load‐Controlled Roll Transfer of Oxide Transistors for Stretchable Electronics (Adv. Funct. Mater. 16/2013)

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Advanced Functional Materials 2013年第16期23卷

作者： Bhupendra K. Sharma Bongkyun Jang Jeong Eun Lee Sang‐Hoon Bae Tae Woong Kim Hak‐Joo Lee Jae‐Hyun Kim Jong‐Hyun Ahn School of Advanced Materials Science and Engineering SKKU Advanced Institute of Nanotechnology Sungkyunkwan University Suwon 440‐476 Korea Department of Nano Mechanics Nano‐Convergence Mechanical Systems Research Division Korea Institute of Machinery & Materials 156 Gajeongbuk‐ro Yuseong‐gu Daejeon 305‐343 Korea Next Generation B/P Development Team OLED R&D Center Samsung Mobile Display Suwon 440‐476 Korea

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