This article proposes a novel Peeling of Nano-Particle (PNP) process to locally remove material on a hard material surface using controllable magnetic fields. Fe3O4 particles in the size range of 50-100 nm in aqueous ...
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In the wet semiconductor process, abrasive nanoparticles are widely used in the chemical mechanical polishing (CMP) process to polish wafer surfaces for high planarization. During polishing, nanoparticles move with a ...
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The purpose of this study is to improve the accuracy of automatic HTML generation from web page design images. pix2code is the state of art in this field. It is consist of design image learning part by CNN and HTML le...
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To directly investigate the dynamic nanoscale phenomenon on the surface being processed in wet conditions such as precision polishing, and cleaning in semiconductor industrial, an optical method for visualization and ...
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Visual place recognition using 3D lidar in robotics is a popular research topic. Feature representation descriptors, such as scan-context descriptors, which are 2D descriptors obtained from 3D point clouds, are one of...
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To directly investigate the dynamic nanoscale phenomenon on the surface being processed in wet conditions such as precision polishing, and cleaning in semiconductor industrial, an optical method for visualization and ...
To directly investigate the dynamic nanoscale phenomenon on the surface being processed in wet conditions such as precision polishing, and cleaning in semiconductor industrial, an optical method for visualization and observation of each sub-100 nm sized particle that is moving on an interface such as a silica glass surface by applying an evanescent field have been proposing. Subsequently, we developed an experimental apparatus equipped with an optical microscopy system for verifying the moving particle observation method in a laboratory scale. This article introduces some experimentally direct observation results of duplicated wet processes.
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