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Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITHERM)

作者： A. Perkins S.K. Sitaraman Computer Aided Simulation for Package Reliability (CASPaR) Laboratory The George W. W&ff School of Mechanical Engineering Georgia Institute of Technology Atlanta GA USA

Finite-element simulations in combination with experimental data have been used extensively by researchers to predict the solder joint fatigue life in microelectronic packages. Such simulations often require good understanding of finite-element modeling, physics-based failure models, and time-, temperature-, and direction-dependent material constitutive behavior. Also, such simulations are computationally expensive and time-consuming. Microelectronic package designers do not have the time and the expertise to perform such simulations. Therefore, this work aims to develop predictive equations that are easy to use and are based on physics-based modeling. Using experimental data and finite-element simulations, this work has developed a polynomial predictive equation for solder fatigue life in a ceramic ball grid array (CBGA) package. The developed equation has been validated with other experimental data with good success. Efforts are underway to develop similar equations for other packages.

关键词： Fatigue Equations Electronics packaging Computational modeling Finite element methods Predictive models Microelectronics Soldering Polynomials Ceramics

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Exploring agent-supported simulation brokering on the semantic Web: foundations for a dynamic composability approach

Exploring agent-supported simulation brokering on the semant...

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simulation Winter Conference

作者： L. Yilmaz T.I. Oren Auburn Modeling & Simulation Laboratory Department of Computer Science and Engineering Aubum University Auburn AL USA Ottawa Center of the MISS School of Information Technology and Engineering SITE University of Ottawa Ottawa ONT Canada

Federated simulations address the need for interoperability, as well as the improvement of reuse and composability. The focal goal in a federated simulation is to facilitate composable simulations by standardizing interfaces to assure technical interoperability among disparate simulations. Yet, existing federated simulation infrastructures neither facilitate substantive interoperability nor are dynamically extensible. Emergent Web services technologies hold out the potential to significantly improve the development of interoperable, extensible, and dynamically composable federations. As such, recent initiatives (i.e., XMSF) are urging the use of open standards that can be applied within an extensible framework for next generation modeling and simulation applications. We discuss how the realization of multimodel and multisimulation formalisms in terms of semantic Web and agent technologies may bring new vistas to demonstrate runtime model discovery, instantiation, composition, and interoperation.

关键词： Semantic Web Runtime Ontologies Computational modeling computer simulation Microstrip Service oriented architecture Laboratories computer science Information technology

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Behavioral anticipation in agent simulation

Behavioral anticipation in agent simulation

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simulation Winter Conference

作者： T.I. Oren L. Yilmaz Ottawa Center of the MISS School of Information Technology and Engineering (SITE) University of Ottawa Ottawa ONT Canada Auburn Modeling & Simulation Laboratory Department of Computer Science and Engineering Aubum University Auburn AL USA

In this article, the following is done: (1) a systematic and comprehensive classification of input is given and the relevance of perception as an important type of input in intelligent systems is pointed out, (2) a categorization of perception is given and anticipation is presented as a type of perception, (3) the inclusion of anticipation in simulation studies is clarified and other aspects of perceptions in simulation studies especially in conflict situations are elaborated.

关键词： Character generation Predictive models Message passing Sensor fusion Computational modeling computer simulation Organisms Decoding Digital filters Passive filters

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Materials, processes and reliability of mixed-signal substrates for SOP technology

Materials, processes and reliability of mixed-signal substra...

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Electronic Components and technology Conference (ECTC)

作者： S. Mahalingam S. Hegde J. Ahmad R.V. Pucha V. Sundaram Fuhan Liu G. White R. Tummala S.K. Sitaraman Packaging Research Center Computer-Aided Simulation of Packaging Reliability (CASPaR) Laboratory The George W. Woodruff School of Mechanical Engineering Georgia Institute of Technology Atlanta GA USA Packaging Research Center Georgia Institute of Technology Atlanta GA USA

Materials, processes and reliability challenges in mixed-signal (Digital, Optical and RF) microvia substrates for System-on-a-package (SOP) technology are presented. Models and methodologies to thermo-mechanically evaluate the microvia substrate reliability are discussed. Upfront process mechanics models with design of simulations approach are presented to evaluate various dielectrics and substrate materials with respect to warpage, dielectric cracking and microvia reliability in multi-layered microvia boards. Systematic optimization studies are conducted to arrive at appropriate set of material and geometry parameters to minimize the inelastic strain in the microvias, the film stress in the dielectric, and the warpage in the substrate. The test vehicles are subjected to liquid-to-liquid thermal shock cycles between -55/spl deg/C to 125/spl deg/C to assess reliability and model validation. Material length scale effects due to reduced feature sizes of microvias (10 microns or less) are addressed through computational algorithms to simulate the increased plastic strain hardening effects due to spatial strain gradients. System-level mixed-signal reliability is also discussed taking into consideration component-level reliability as well as statistical implications.

关键词： Materials reliability Dielectric substrates Dielectric materials Optical materials Capacitive sensors Conducting materials Optical films Radio frequency Thermomechanical processes Geometry

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Physical clearing mechanisms in power industry

Physical clearing mechanisms in power industry

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IEEE PES Power Systems Conference and Exposition, PSCE

作者： K. Atkins C.M. Homan A. Marathe Basic and Applied Simulation Science Group Los Alamos National Laboratory Los Alamos NM USA Department of Computer Science Rochester Institute of Technology Rochester NY USA Modeling Algorithms and Informatics Group Los Alamos National Laboratory Los Alamos NM USA

This paper studies the performance of several different physical clearing mechanisms in the electricity market. The study is done using the simulation tool, Marketecture, developed at the Los Alamos National laboratory. Two cities, Portland and Chicago, are used for simulating the physical clearing algorithms. The algorithms were chosen according to their ability to serve as a proxy for some of the well known policies. Our results show that, based on the economic measures chosen, both cities perform very similarly under the different physical clearing mechanisms.

关键词： Power industry Contracts Laboratories Computational modeling Power generation economics ISO Cities and towns Energy consumption Computational complexity computer industry

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Field-use conditions vs. thermal cycles - a physics-based mapping study

Field-use conditions vs. thermal cycles - a physics-based ma...

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Electronic Components and technology Conference (ECTC)

作者： K. Tunga J. Pyland R.V. Pucha S.K. Sitaramai Computer Aided Simulation for Package Reliability (CASPaR) Laboratory The George W. Woodruff School of Mechanical Engineering Georgia Institute of Technology Atlanta GA USA Computer Aided Simulation for Package Reliability (CASPaR) Laboratory Georgia Institute of Technology Atlanta GA

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/spl beta/-Helix: a lithography-based compliant off-chip interconnect

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IEEE Transactions on Components and Packaging Technologies 2003年第3期26卷 582-590页

作者： Qi Zhu Lunyu Ma S.K. Sitaraman Computer-Aided Simulation of Packaging Reliability (CASPaR) Laboratory The Georgia W. Woodruff School of Mechanical Engineering Georgia Institute of Technology Atlanta GA USA

Microsystems packages continue to demand lower cost, higher reliability, better performance and smaller size. Compliant wafer-level interconnects show great potential for next-generation packaging. The proposed /spl beta/-Helix interconnect, an electroplated compliant wafer-level off-chip interconnect, can facilitate wafer-level probing as well as wafer-level packaging without the need for an underfill. The fabrication of the /spl beta/-Helix interconnect is similar to conventional integrated circuit (IC) fabrication processes and is based on electroplating and photolithography. /spl beta/-Helix interconnect has good mechanical compliance in the three orthogonal directions and can accommodate the differential displacement induced by the coefficient of thermal expansion (CTE) mismatch between the silicon die and the organic substrate. In this paper, we report the wafer-level fabrication of area-arrayed /spl beta/-Helix interconnects. The geometry effect on the mechanical compliance and the electrical parasitics of /spl beta/-Helix interconnect has been studied. Thinner and narrower arcuate beams with larger radius and taller post are found to have better mechanical compliance. However, it is also found that structures with excellent mechanical compliance cannot have good electrical performance. Therefore, a trade off is needed. Using response surface methodology (RSM), an optimization has been done, and the optimal compliant /spl beta/-Helix interconnect will have a total standoff height of 110 /spl mu/m, radius of 37 /spl mu/m and cross section area of 525 /spl mu/m/sup 2/. It is also found that the structure self-weight effect during the fabrication and the die and heat sink weights during the assembly have negligible effect on the /spl beta/-Helix interconnect, especially when the interconnect density is high.

关键词： Integrated circuit interconnections Fabrication Wafer scale integration Costs Integrated circuit packaging Lithography Thermal expansion Silicon Geometry Response surface methodology

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Asymmetric accelerated thermal cycles: an alternative approach to accelerated reliability assessment of microelectronic packages

Asymmetric accelerated thermal cycles: an alternative approa...

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Electronics Packaging technology Conference (EPTC)

作者： F.C. Classe S.K. Sitaraman Computer-Aided Simulation of Packaging Reliability (CASPaR) Laboratory Georgia Institute of Technology George W. Woodruff School of Mechanical Engineering Atlanta GA USA

This work uses MicroBGA assemblies on an organic substrate to compare different symmetric and asymmetric accelerated thermal cycles (ATCs) using numerical simulations and experimental measurements. This work has developed several finite-element models: a 2D plane strain model, a generalized plane deformation (GPD) model, and a 3D quarter symmetry model, with different solder constitutive models: bi-linear kinematic hardening, multilinear kinematic hardening with power-law creep, and Anand's viscoplastic model. The symmetric cycles examined in this work are: (a) 125/spl deg/C to -40/spl deg/C with ten-minute dwell each at 125/spl deg/C and -40/spl deg/C, and (b) 150/spl deg/C to -65/spl deg/C with ten-minute dwell each at 150/spl deg/C and -65/spl deg/C. The asymmetric cycles examined are: (c) 150/spl deg/C to -65/spl deg/C with a ten-minute dwell at 150/spl deg/C and a five-minute dwell at -65/spl deg/C and (d) 150/spl deg/C to -65/spl deg/C with a ten-minute dwell at 150/spl deg/C and a three-minute dwell at -65/spl deg/C. Transient thermal analysis has been done to ensure that the components reach a steady-state temperature, when the dwell time is reduced. The numerical simulations show that there is little difference in the predicted number of cycles to failure, between symmetric and asymmetric cycles, and the experimental data agrees with the predictions by the numerical models.

关键词： Acceleration Microelectronics Packaging Deformable models Numerical simulation Kinematics Transient analysis Assembly Finite element methods Capacitive sensors

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Thermo-mechanical failure comparison and evaluation of CCGA and CBGA electronic packages

Thermo-mechanical failure comparison and evaluation of CCGA ...

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Electronic Components and technology Conference (ECTC)

作者： A. Perkins S.K. Sitaraman Computer Aided Simulation for Package Reliability (CASPaR) Laboratory The George W. Woodruff School of Mechanical Engineering Georgia Institute of Technology Atlanta GA USA

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Single-substrate decohesion test (SSDT) for interfacial fracture toughness measurement

Single-substrate decohesion test (SSDT) for interfacial frac...

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Electronics Packaging technology Conference (EPTC)

作者： M.B. Modi S.K. Sitaraman Computer-Aided Simulation of Packaging Reliability (CASPaR) Laboratory George W. Woodruff School of Mechanical Engineering Georgia Institute of Technology Atlanta GA USA

We have developed a test method, called the Single-Substrate Decohesion Test (SSDT), to measure the interfacial fracture toughness for thin-film interfaces used in microelectronic applications. SSDT can be used to measure the interfacial fracture toughness over a range of mode mixity. In this work the results of the measurement of the full mode mixity versus interfacial fracture toughness curve for a submicron physical vapor deposited titanium thin film on a silicon substrate using SSDT are presented.

关键词： Testing Substrates Transistors Surface cracks Mechanical variables measurement Packaging Microelectronics Titanium Silicon Delamination

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