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Electronics Packaging technology Conference (EPTC)

作者： J. Pyland R. Pucha S. Sitaram Computer-Aided Simulation of Packaging Reliability CASPaR Laboratory The George W. Woodruff School of Mechanical Engineering Georgia Institute of Technology Atlanta GA USA Georgia Institute of Technology Atlanta GA US

ISBN: (纸本)0780366441

The effect of underfill on various thermomechanical reliability issues in SBGA (super ball grid array) packages is studied in this paper. Nonlinear finite element models with underfill and no-underfill have been developed, taking into consideration the process-induced residual stresses. In this study, the solder is modeled as time and temperature-dependent, while other materials are modeled as temperature and direction-dependent, as appropriate. The stress/strain variations in solder joints due to thermal cycling are analyzed. The effect of underfill is studied with respect to magnitude and location of time-independent plastic strain, time-dependent creep strain and total inelastic strain in solder balls. The possibility of delamination at the interposer-underfill interface and at the board-underfill interface is studied with the help of qualitative interfacial stress analysis. Results on SBGA packages indicate that the underfill does not always enhance BGA reliability, and that the properties of the underfill have a significant role in the overall reliability of the BGA solder balls.

关键词： Capacitive sensors Residual stresses Thermal stresses Thermomechanical processes Electronics packaging Finite element methods Temperature Soldering Plastics Creep

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Fracture-mechanics based delamination growth prediction in the very small periphery array (VSPA/sup TM/) package

Fracture-mechanics based delamination growth prediction in t...

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Electronics Packaging technology Conference (EPTC)

作者： V. Sundararaman R.J. Harries S.K. Sitaraman Computer Aided Simulation of &clcaging Eeliabiity (CASPaR) Laboratory The George W. Woodruff School of Mechanical Engineering Georgia Institute of Technology Atlanta GA USA Failure Analysis Associates Inc. CA USA

Interfacial delamination due to dissimilar material systems is a primary concern in electronic package design. CTE mismatch between layers can generate high interfacial stresses under thermal loads during fabrication, assembly and/or field-use conditions which can compromise interface adhesive integrity. Delamination propagation along such interfaces can degrade or destroy package functionality. This study aims to predict interfacial delamination propagation potential in a novel surface mountable, high I/O very small peripheral array (VSPA/sup TM/) package. Delamination growth prediction is based on comparison of interfacial fracture parameters obtained from numerical simulations to critical values determined experimentally using controlled fracture toughness tests. 2D/3D VSPA/sub TM/ package numerical models were constructed with interfacial cracks embedded at critical locations. The energy release rate associated with interfacial fracture was determined using global energy balance and a crack closure technique. The fracture mode mixity was determined using a crack surface displacement method. A material parametric study was also completed using numerical models with pre-existing delaminations to identify material property trends that would lower the failure potential. For a baseline materials suite, the fracture parameters were compared with experimentally determined critical interfacial fracture toughness data to ascertain the possibility of delamination growth. Interface fracture toughness was characterized using a test method that requires simple test specimen, fixture and loading geometries, and a data reduction method.

关键词： Delamination Electronic packaging thermal management Testing Thermal stresses Surface cracks Numerical models Thermal loading Fabrication Assembly Thermal degradation

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Two and three-dimensional modeling of VSPA butt solder joints

Two and three-dimensional modeling of VSPA butt solder joint...

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Electronic Components and technology Conference (ECTC)

作者： R.S. Murphy S.K. Sitaraman Computer-Aided Simulation of Packaging Reliability (CASPaR) Laboratory The George Woodruff School of Mechanical Engineering Packaging Research Center Georgia Institute of Technology Atlanta GA USA

The objective of this work is to develop two- and three-dimensional numerical models of VSPA, a new peripheral array package, and study its solder joint reliability. VSPA has multiple rows of butt-type leads around its periphery and is surface mounted on a standard FR-4 printed circuit board. The FR-4 and various package materials were modeled as temperature-dependent and elastic while the eutectic solder was modeled as temperature-dependent, elastic-plastic. The package and board assembly were subjected to a temperature increase (/spl Delta/T) of 85/spl deg/C with the assumption that the assembly is stress-free at room temperature. The results obtained from a three-dimensional 1/8th section model are compared with the results from 2-D plane-strain and plane-stress models and with 3-D "strip" models.

关键词： Soldering Electronics packaging Electronic packaging thermal management Lead Thermal stresses Assembly Fatigue Temperature Thermal expansion Semiconductor device packaging

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Influence of human engineering on manning levels and human performance on ships

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NAVAL ENGINEERS JOURNAL 1997年第5期109卷 67-76页

作者： Anderson, DE Oberman, FR Malone, TB Baker, CC David E. Anderson:has a bachelor of science degree in environmental engineering from Florida Technological University and a master's degree in environmental engineering from the University of Central Florida. He is a graduate of the Naval Sea Systems Command's Engineer-In-Training (EIT) Program. Mr. Anderson was instrumental in introducing the collective protection system (CPS) in the U.S. Navy developing the initial forward-fit package for the USS Gunston Hall and the engineering change proposal (ECP) for the USS Wasp. In 1990 he joined the Human Systems Integration (HSI) Division (SEA 55W5) where he was task leader for auxiliary ships. He is currently the HSI manager for the future technology variant of the SeaLift ship and the future carrier. Association of Scientists and Engineers 33rdAnnual Technical Symposium 26 April 1996. Fred R. Oberman:has B.A. and M.A. degrees from the University of Chicago and Loyola University (experimental psychology) and an M.S. degree in industrial engineering and operations research from Virginia Polytechnic Institute (VPI). He has more than 30 years experience in HSI management planning research analysis design and testing in government and private sector positions. He is currently responsible for NavSea HSI generic research and tool development efforts. He is responsible for Human Engineering Specifications and Standards (Commercial Hypertext) and is the NavSea 03D7 representative on HSI in Performance Specifications and for integration of HSI within Integrated Logistic Support (ILS). He has served as DoD HSI SubTAG chair and member of the Simulation and Modeling Test and Evaluation Display and Control Systems Human Computer Interaction Specifications and Standards and Systems Design Sub Tags as a member of the Society of Naval Architects and Marine Engineers (SNAME) Systems Safety Panel and a member of NATO RSG 14 on man-machine analysis. Thomas B. Malone: CHFEP received a Ph.D. in experimental psychology from Fordham University in 1964. He is president of Carlow

The objectives of Human Engineering (HE) are generally viewed as increasing human performance, reducing human error, enhancing personnel and equipment safety, and reducing training and related personnel costs. There are other benefits that are thoroughly consistent with the direction of the Navy of the future, chief among these is reduction of required numbers of personnel to operate and maintain Navy ships. The Naval Research Advisory Committee (NRAC) report on Man-Machine technology in the Navy estimated that one of the benefits from increased application of man-machine technology to Navy ship design is personnel reduction as well as improving system availability, effectiveness, and safety The objective of this paper is to discuss aspects of the human engineering design of ships and systems that affect manning requirements, and impact human-performance and safety The paper will also discuss how the application of human engineering leads to improved performance, and crew safety, and reduced workload, all of which influence manning levels. Finally, the paper presents a discussion of tools and case studies of good human engineering design practices which reduce manning.

关键词： Human engineering

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PARALLEL AND DISTRIBUTED TLM COMPUTATION WITH SIGNAL-PROCESSING FOR ELECTROMAGNETIC-FIELD MODELING

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INTERNATIONAL JOURNAL OF NUMERICAL MODELLING-ELECTRONIC NETWORKS DEVICES AND FIELDS 1995年第3-4期8卷 169-185页

作者： SO, PPM ESWARAPPA, C HOEFER, WJR NSERC/MPR Teltech Research Chair in RF Engineering Department of Electrical and Computer Engineering University of Victoria Victoria British Columbia V8W 3P6 Canada Poman So received his B.Sc. degree in computer science and physics from the University of Toronto Toronto Onatario Canada in 1985. He obtained his B.A. Sc. and M.A.Sc. degrees in electrical engineering (summa cum laude) from the University of Ottawa Ottawa Ontario Canada in 1987 and 1989 respectively. Mr So was a research engineer in the University of Ottawa from January 1989 to October 1991 his research interests included CAD techniques of microwave circuits and numerical methods for electromagnetic wave modelling. He specialized in the development of electromagnetic engineering CAD software and successfully implemented a number of electromagnetic wave simulators based on the two-dimensional and three-dimensional transmission-line matrix methods. From August 1990 to February 1991 he accompanied Professor W. J. R. Hoefer to Rome Italy and Sophia Antiopolas France. During that time he implemented a parallel version of the 3D-TLM simulator for the CM-2 Connection Machine using C-Star and X Windows Library. He is a research engineer and a Ph.D. student at the University of Victoria Victoria British Columbia Canada. He ported the 2D- and 3D-TLM simulators to DECmpp 1200 massively parallel computer using MPL C and C++. He also combined OSA90/hope a commercially available microwave CAD program with a 2D-TLM simulation module for geometry optimization using the Datapipe technique of OSA90/hope. Recently he has developed a distributed client-server computing technique for the TLM method this technique could accelerate the TLM simulation by more than an order of magnitude. Channabasappa Eswarappa received the M.Tech. degree in electrical engineering from the Indian Institute of Technology Kanpur India in 1983 and Ph. D. degree from the University of Ottawa Canada in 1990. He worked as an Assistant Executive Engineer and later as

This paper describes the implementation of transmission-line matrix (TLM) method algorithms on a massively parallel computer (DECmpp 12000), the technique of distributed computing in the UNIX environment, and the combination of TLM analysis with Prony's method as well as with autoregressive moving average (ARMA) digital signal processing for electromagnetic field modelling. By combining these advanced computation techniques, typical electromagnetic field modelling of microwave structures by TLM analysis can be accelerated by a few orders of magnitude.

关键词： Mathematical models

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Electromagnetic design of high-temperature superconducting microwave filters

Electromagnetic design of high-temperature superconducting m...

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Microwave, MTT-S International Symposium

作者： J.W. Bandler R.M. Biernacki S.H. Chen P.A. Grobelny C. Moskowitz S.H. Talisa Optimization Systems Associates Inc. Dundas ONT Canada Simulation Optimization Systems Research Laboratory and Department of Electrical and Computer Engineering McMaster University Hamilton ONT Canada Westinghouse Electronics Systems Group Baltimore MD USA Westinghouse Science and Technology Center Pittsburgh PA USA

We present novel approaches to electromagnetic design of high-temperature superconducting quarter-wave parallel coupled-line microstrip filters. The dielectric constant of substrate materials used in high-temperature superconductor technology is too large to be accurately treated by traditional microwave circuit design software packages with analytical/empirical models. We employ electromagnetic field simulation and develop a look-up table method and a powerful space mapping optimization technique, which dramatically reduce the CPU time for the design process.< >

关键词： High temperature superconductors Superconducting filters Superconducting microwave devices Electromagnetic coupling Space technology Coupling circuits Microstrip filters Microwave filters Dielectric constant Dielectric substrates

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TECHNICAL ISSUES REGARDING SATELLITE PACKET-SWITCHING

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INTERNATIONAL JOURNAL OF SATELLITE COMMUNICATIONS 1994年第3期12卷 257-267页

作者： IVANCIC, WD CHU, P SHYY, DJ National Aeronautics and Space Administration Lewis Research Center Cleveland Ohio 44135 USA. A design engineer in the Digital Technology Branch of the Space Electronics Division. He has extensive experience in satellite communications systems modulation and coding on-board switching and routeing and high speed digital design. Since joining NASA in 1982 Mr. Ivancic has been responsible for the development of a variety of matrix switch controllers ground terminal equipment numerous pieces of special test equipment a beacon controller for the SARSAT program (Search and Rescue Satellite) and a time-shared decoder for a processing satellite. In addition Mr. Ivancic has been technical contract monitor on a number of advanced communications technology contracts including the Advanced Modulation Technology Development a 5 GHz fibre-optic link and multi-programmable modem study. He was awarded the B.S.E.E. and M.S.E.E. degrees by Cleveland State University in 1982 and 1986 respectively. Cleveland State University Cleveland Ohio 44115 USA. Currently an assistant professor of Electrical Engineering Department at Cleveland State University. He obtained the M.S. and Ph.D. degrees from Iowa State University majoring in Electrical and Computer Engineering. His research interests include high-speed computer networks digital systems and neural networks applications. He is a member of Sigma Xi Phi Kappa Phi as well as the IEEE and ACM. ComSearch Reston Virginia 22091 USA. Received the B.S. degree in electrical engineering from National Chiao-Tung University Hsin-Chu Taiwan in 1983 and the M.S. and Ph.D. degrees in electrical engineering from Georgia Institute of Technology Atlanta GA in 1986 and 1990 respectively. From June 1987 to October 1987 he worked for the Department of Neurology Emory University Atlanta as a Programmer. From September 1989 to December 1989 he worked for the Advanced Development Laboratory. AMP Inc. Atlanta as a Test Engineer. From February 1990 to August 1993 he wor

Many concepts for advanced communication satellite networks have recently been proposed. Critical technical issues relating to satellite packet switching for meshed very small aperture terminal networks and broadband ... 详细信息

关键词： FAST PACKET SWITCH BISDN MESHED VSAT ON-BOARD PROCESSING

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NONLINEAR TRANSIENT ANALYSIS OF COUPLED RLGC LINES BY THE METHOD OF CHARACTERISTICS

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INTERNATIONAL JOURNAL OF MICROWAVE AND MILLIMETER-WAVE computer-AIDED ENGINEERING 1992年第2期2卷 108-115页

作者： ORHANOVIC, N TRIPATHI, VK Department of Electrical and Computer Engineering Oregon State University Corvallis Oregon 97331 Neven Orhanovic was born in Osijek Croatia on July 131964. He received the Dipl. Ing. degree in electrical engineering from the University of Zagreb Croatia where he studied from 1983 to 1988. He received the M.S. degree in electrical engineering from Oregon State University Corvallis in 1990. Presently he is a Research Assistant at Oregon State University in the Department of Electrical and Computer Engineering where he is working towards a PhD degree. His areas of interest include electromagnetic simulation of microwave components and circuits. Vijai K. Tripathi received the BSc degree from Agra University Uttar Pradesh India in 1958 the MSc Tech degree in electronics and radio engineering from Allahabad University Uttar Pradesh. India in 1961 and the MSEE and PhD degrees in electrical engineering from the University of Michigan Ann Arbor in 1964 and 1968 respectively. From 1961 to 1963 he was a Senior Research Assistant at the Indian Institute of Technology Bombay India. In 1963 he joined the Electron Physics Laboratory of the University of Michigan where he worked as a Research Assistant from 1963 to 1965 and as a Research Assistant from 1966 to 1967 on microwave tubes and microwave solid-state devices. From 1968 to 1973 he was an assistant Professor of Electrical engineering at the University of Oklahoma. Norman. In 1974 he joined Oregon State University Corvallis where he is a Professor of Electrical and Computer Engineering. His visiting and sabbatical appointments have included the Division of Network Theory at Chalmers University of Technology in Gothenburg Sweden from November 1981 through May 1982: Duisburg University Duisburg Germany from June through September 1982 and the Electronics Technology Division of the Naval Research Laboratory in Washington. D.C. in the summer of 1984. His current research activities are in the areas of microwave circuits and devices electro

A computationally efficient numerical technique for the evaluation of the time domain response of coupled lossy uniform and nonuniform transmission lines terminated in general nonlinear elements is presented. The technique is based on the method of characteristics where the original system of coupled transmission line equations is transformed into a system of ordinary differential equations which hold along a family of characteristic curves. An algorithm to solve these equations is presented. The procedure is applicable to both uniform and nonuniform coupled systems and examples of two and three line structures terminated in linear and nonlinear elements are included to demonstrate the versatility and the usefulness of the algorithm.

关键词： Mathematical Techniques

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FUTURE NAVAL CONTINGENCY AND LIMITED WAR OPERATIONS

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NAVAL ENGINEERS JOURNAL 1991年第4期103卷 89-91页

作者： PACE, DK VLAHOS, M The Author The Author is a member of the Principal Professional Staff of The Johns Hopkins University Applied Physics Laboratory (APL). From 1987 to 1989 he was APL's resident liaison with the Naval War College where as an adjunct professor he developed an elective course on technology and naval warfare as well as serving as analytic lead for the Technology Initiative Games. He teaches in the graduate technical management curriculum of the Whiting School of Engineering at The Johns Hopkins University. As a specialist in operations research and systems analysis his professional responsibilities include leadership roles in the Military Operations Research Society the Summer Computer Simulation Conference the American Society of Engineering Management and membership on the ASNE JournalCommittee. His undergraduate studies were in mathematics and physics at the University of Chicago and his graduate studies in theology at several seminaries with a decade as a correctional chaplain.

The world has changed dramatically in the past few years. In large part, many of the changes have been driven by the emphasis now given to contingency and limited war operations. Navy leadership even coined a special term for them late in the 1980s: CALOW (Contingency and Limited Objective Warfare). As a result, naval planning has also changed, and with it so have the demands upon naval engineering. This paper addresses some of the factors that are now shaping naval planning. Characteristics of contingency and limited war operations are presented. Their implications for naval planning, for naval systems, for concepts of employment, and for naval force structure are examined. It is important that both Navy leadership and the naval engineering community understand these implications fully so that they may respond to them appropriately. The specific value of this paper lies in its synthesis of information so that the naval engineering community may appreciate the full impact of future contingency and limited war operations.

关键词： Naval Warfare

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technology GAMING

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NAVAL ENGINEERS JOURNAL 1989年第3期101卷 240-250页

作者： PACE, DK MORAN, DD Dale K. Pace Th.D.:is a member of the Principal Professional Staff of The Johns Hopkins University Applied Physics Laboratory (APL). He currently serves as the APL liaison with the Naval War College where as an adjunct professor he conducts a course on technology and naval warfare. He also teaches in the graduate technical management curriculum of the Whiting School of Engineering at The Johns Hopkins University. His professional responsibilities have included various leadership roles in the Military Operations Research Society the Summer Computer Simulation Conference and simulation conferences in Japan and China the American Society of Engineering Management and chairmanship of the ASNE Journal Committee. David D. Moran Ph.D.:is assistant technical director of the David Taylor Research Center. He also holds the position of adjunct full professor at The George Washington University. Dr. Moran is a graduate of MIT and the University of Iowa in the fields of hydrodynamics and naval architecture. His current responsibilities for the David Taylor Research Center involve long range development of advanced technical and management interactions and strategic planning for the future role of the Center in the Navy RDT&E Laboratory system.

Wise investment of Department of Defense research and development (R&D) resources is becoming increasingly important. R&D policymakers and managers use a variety of means to guide their decisions. This paper discusses one of them: technology gaming. technology gaming is a complement to traditional methods of technology forecasting, with technology gaming providing insights about constraints imposed upon advanced systems and technologies by operational environments and about their interactions with one another. The potential and practice of technology gaming are described, drawing upon experiences acquired from several technology gaming endeavors in 1988, including the technology Initiatives 88 Game (TIG-88) performed at the Naval War College under the joint-sponsorship of the Office of Research, Development, and Acquisition in OpNav (OP-098) and the Naval War College.

关键词： Technological Forecasting

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