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SSRN 2022年

作者： Du, Lin Li, Yuxin Wang, Jie Zhou, Zijian Jing, Dalei Zhou, Jia School of Mechanical Engineering University of Shanghai for Science and Technology Shanghai China School of Optical-Electrical and Computer Engineering University of Shanghai for Science and Technology Shanghai China State Key Laboratory of ASIC and System School of Microelectronics Fudan University Shanghai China

The division of aqueous samples conveniently into droplets is necessary for many biochemical and medical analysis applications. In this article, we propose the design of a cost-effective droplet generator for potential bio-chemical application, featuring two symmetric tubes. The new droplet generator revisits the relationship between capillary components and liquid flow rates. The size of generated droplets by prototype depends only on generator dimensions, without precisely needing to control external flow conditions or driving pressure. Even when the relative extreme difference in flow rate for generating nL level droplets is over 57.79%, and the relative standard deviation (RSD) of the volume of droplets is barely about 9.80%. A dropper working as a pressure resource is used to verify the rapidity and robustness of this principle of droplet generation, which shows great potential for a wide range of droplet-based applications. © 2022, The Authors. All rights reserved.

关键词： Cost effectiveness

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Next-generation machine vision systems incorporating two-dimensional materials: Progress and perspectives

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InfoMat 2022年第1期4卷 23-39页

作者： Peisong Wu Ting He He Zhu Yang Wang Qing Li Zhen Wang Xiao Fu Fang Wang Peng Wang Chongxin Shan Zhiyong Fan Lei Liao Peng Zhou Weida Hu State Key Laboratory of Infrared Physics Shanghai Institute of Technical PhysicsChinese Academy of SciencesShanghaiChina University of Chinese Academy of Sciences BeijingChina Hangzhou Institute for Advanced Study University of Chinese Academy of SciencesHangzhouChina State Key Laboratory of ASIC and System School of MicroelectronicsFudan UniversityShanghaiChina Henan Key Laboratory of Diamond Optoelectronic Materials and Devices School of Physics and EngineeringZhengzhou UniversityZhengzhouChina Department of Electronic and Computer Engineering The Hong Kong University of Science and TechnologyClear Water BayKowloonHong Kong SARChina School of Physics and Electronics Hunan UniversityChangshaChina

Machine vision systems(MVSs)are an important component of intelligent systems,such as autonomous vehicles and ***,with the continuous increase in data and new application scenarios,new requirements are put forward for the next generation of *** is an urgent need to find new material systems to complement the existing semiconductor technology based on thin-film materials,and new architectures must be explored to improve *** of their unique physical properties,two-dimensional(2D)materials have received extensive attention for use in MVSs,especially in biomimetic ones:the human visual system,which can process complex visual information with low power consumption,provides a model for next-generation *** review paper summarizes the progress and challenges of applying 2D material photodetectors in sense-memory-computational integration and biomimetic image sensors for machine vision.

关键词： in-sensor computing machine vision systems photodetectors two-dimensional materials

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Fea Study on the Tsv Copper Filling Influenced by the Additives and Electroplating Process

SSRN

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SSRN 2023年

作者： Zhao, Zifeng Liu, Ziyu Chen, Lin Sun, Qingqing Liu, Hongye Sun, Yabin School of Optical-Electrical and Computer Engineering University of Shanghai for Science and Technology Shanghai200093 China State Key Laboratory of ASIC and System School of Microelectronics Fudan University Shanghai200433 China Jiashan Fudan Institute Zhejiang Province Jiaxing314100 China Department of Electrical Engineering East China Normal University Shanghai200241 China

Abstract Through-Silicon Via (TSV) is a key technology of three-dimensional (3D) integration. However, it is easy to have voids in the Cu filling process of TSV. Additives and optimized filling process are used to solve this problem. However, the comprehensive analysis of these affecting parameter needs many experiments and cost much time. Thus, the finite element analysis (FEA) for the mass transferring of electroplating is carried out by the COMSOL software in the work. The filling processes with different inhibitor concentrations are first studied and the most suitable density of 64mol/m2 is obtained. However, high inhibitor concentration will lead to much lower plating speed. Thus, the effect of filling process such as current density and plating bath flow velocity on the voids are investigated under the optimized concentrations above. The best filling quality is obtained at the current density of 1.4 ASD and the bath stirring velocity of 0.4 m/s. The underlying growth mechanism of these influencing factors are also analyzed and revealed. © 2023, The Authors. All rights reserved.

关键词： Copper

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Temperature-switching logic in MoS2 single transistors

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Chinese Physics B 2020年第9期29卷 464-469页

作者： Xiaozhang Chen Lehua Gu Lan Liu Huawei Chen Jingyu Li Chunsen Liu Peng Zhou The State Key Laboratory of ASIC and System Department of MicroelectronicsFudan UniversityShanghai 200433China Department of Physics State Key Laboratory of Surface PhysicsKey Laboratory of Micro and Nano Photonic Structures(Ministry of Education)and Institute for Nanoelectronic Devices and Quantum ComputingFudan UniversityShanghai 200433China School of Computer Science Fudan UniversityShanghai 200433China

Due to their unique characteristics,two-dimensional(2D)materials have drawn great attention as promising candidates for the next generation of integrated circuits,which generate a calculation unit with a new working mechanism,called a logic *** figure out the application prospects of logic transistors,exploring the temperature dependence of logic characteristics is *** this work,we explore the temperature effect on the electrical characteristic of a logic transistor,finding that changes in temperature cause transformation in the calculation:logical output converts from‘AND’at 10 K to‘OR’at 250 *** transformation phenomenon of temperature regulation in logical output is caused by energy band which decreases with increasing *** the experiment,the indirect band gap of MoS2 shows an obvious decrease from 1.581 eV to 1.535 eV as the temperature increases from 10 K to 250 *** change of threshold voltage with temperature is consistent with the energy band,which confirms the theoretical ***,as a promising material for future integrated circuits,the demonstrated characteristic of 2D transistors suggests possible application for future functional devices.

关键词： molybdenum disulfide(MoS2) logic temperature dependence mobility

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Fast optical proximity correction based on graph convolution network 34

Fast optical proximity correction based on graph convolution...

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Optical Microlithography XXXIV 2021

作者： Zhang, Shengen Ma, Xu Zhang, Junbi Chen, Rui Pan, Yihua Yu, Chengzhen Dong, Lisong Wei, Yayi Arce, Gonzalo R. Key Laboratory of Photoelectronic Imaging Technology and System Ministry of Education of China School of Optics and Photonics Beijing Institute of Technology Beijing100081 China Integrated Circuit Advanced Process Center Institute of Microelectronics Chinese Academy of Sciences Beijing100029 China Department of Electrical and Computer Engineering University of Delaware NewarkDE19716 United States

ISBN: (数字)9781510640603

ISBN: (纸本)9781510640597

Optical proximity correction (OPC) is regarded as one of the most important computational lithography approaches to improve the imaging performance of sub-wavelength lithography process. Traditional OPC methods are computationally intensive to pre-warp the mask pattern based on inverse optimization models. This paper develops a new kind of pixelated OPC method based on an emerging machine learning technique namely graph convolutional network (GCN) to improve the computational efficiency. In the proposed method, the target layout is raster-scanned into pixelated image, and the GCN is used to predict its corresponding OPC solution pixel by pixel. For each layout pixel, we first sub-sample its surrounding geometrical features using an incremental concentric circle sampling method. Then, these sampling points are converted into graph signals. Then, the GCN model is established to process the pre-defined graph signals and predict the central pixel within the sampling region on the OPC pattern. After that, the GCN is moved to predict the OPC solution of the next layout pixel. The proposed OPC method is validated and discussed based on a set of simulations, and is compared with traditional OPC methods. © 2021 SPIE.

关键词： Pixels

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Disjoint-Path and Golden-Pin Based Irregular PCB Routing with Complex Constraints 23

Disjoint-Path and Golden-Pin Based Irregular PCB Routing wit...

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Proceedings of the 60th Annual ACM/IEEE Design Automation Conference

作者： Qinghai Liu Qinfei Tang Jiarui Chen Chuandong Chen Ziran Zhu Huan He Jianli Chen Yao-Wen Chang Center for Discrete Mathematics Fuzhou University Fuzhou China and Fujian Science & Technology Innovation Laboratory for Optoelectronic Information of China Fuzhou China Center for Discrete Mathematics Fuzhou University Fuzhou China College of Computer and Date Science Fuzhou University Fuzhou China Department of Microelectronics Fuzhou University Fuzhou China Department of Microelectronics Southeast University Nanjing China Hangzhou Huawei Enterprises Telecommunication Technologies Co. Ltd Hangzhou China State Key Lab of ASIC & System Fudan University Shanghai China Graduate Institute of Electronics Engineering National Taiwan University Taipei Taiwan and Department of Electrical Engineering National Taiwan University Taipei Taiwan

ISBN: (纸本)9798350323481

PCB routing becomes time-consuming as the complexity of PCB design increases. Unlike traditional schemes that treat the two essential PCB routing processes separately, namely, escape and bus routing, we consider the continuity between them and present a golden-pin-based routing scheme to find the desired solution with angle and topology constraints. Further, conventional rip-up and reroute methods are often ineffective and inefficient for congestion alleviation and routability optimization. We construct a component graph by modeling components as vertices and applying the minimum weight vertex covering method to improve the routability. A self-adaptable ordering method is presented for escape routing to arrange the pin order on the component boundary, guaranteeing successful bus routing. In addition, escape routing is performed based on a disjoint path method. We construct a dynamic Hanan grid in bus routing and utilize a novel congestion adjustment technique to improve solution quality. Compared with FreeRouting and Allegro, the experiment results show that our algorithm achieves high routability and a significant 90% runtime reduction.

关键词： escape routing

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On the Information Freshness of A Two-Sensor Status Update system

On the Information Freshness of A Two-Sensor Status Update S...

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IEEE Conference on Vehicular Technology (VTC)

作者： Tianqing Yang Zhengchuan Chen Howard H. Yang Nikolaos Pappas Min Wang Yunjian Jia Tony Q. S. Quek School of Microelectronics and Communication Engineering Chongqing University Chongqing China Zhejiang University/University of Illinois at Urbana-Champaign Institute Zhejiang University Zhejiang China Department of Computer and Information Science Linköping University Linköping Sweden School of Optoelectronics Engineering Chongqing University of Posts and Telecommunications Chongqing China Information System Technology and Design Pillar Singapore University of Technology and Design Singapore

This work studies the average Age of Information (AoI) of a remote monitoring system in which two sensors observe the same physical process and update the status to a common monitor using orthogonal channels. While using redundant devices to update the status of a process can improve the information timeliness at the monitor, the out-of-order arrivals of updates impose a challenge to the AoI analysis. We first model the system as two parallel M/M/1/1 queues. By leveraging tools from stochastic hybrid systems, we obtain analytically the average AoI of the system. In particular, when the arrival or service rates are the same for the two sensors, the average AoI is given in closed form. Our analysis reveals that the average AoI of the considered system is reduced by 16.44% compared to the single-sensor system when the arrival and service rates are equal to 1. Numerical results show that the considered system outperforms the M/M/2 system in average AoI at high arrival rates.

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The Effect of Device Redundancy in Timeliness of Information

The Effect of Device Redundancy in Timeliness of Information

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IEEE International Conference on Communications (ICC)

作者： Kang Lang Zhengchuan Chen Nikolaos Pappas Howard H. Yang Yunjian Jia Tony Q. S. Quek School of Microelectronics and Communication Engineering Chongqing University Chongqing China State Key Laboratory of Integrated Services Networks Xidian University Xi'an China Department of Computer and Information Science Linköping University Linköping Sweden Zhejiang University/University of Illinois at Urbana-Champaign Institute Zhejiang University Haining China Information System Technology and Design Pillar Singapore University of Technology and Design Singapore

Emerging interaction-based Internet of Things (IoT) applications have stringent demand for timeliness, imposing critical challenges to the design of status update system. Using redundant devices to update the status of the same process is a promising way to improve timeliness, but this approach can result in out of order update arrivals, making it difficult to analyze timeliness. To that end, the present paper conducts a theoretical study toward the Age of Information (AoI) of a multi-queue status update system where multiple sensors observe one physical process and update a common monitor. Based on the stochastic hybrid systems method, the average AoI of the considered system is derived in closed form. The theoretical results are consistent with the simulation results, verifying the correctness of the theoretical analysis. It is shown that the logarithm of the average AoI is linearly decreasing with the logarithm of the number of sensors.

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Power silicon carbide schottky diodes as current mode ?-radiation detectors 32

Power silicon carbide schottky diodes as current mode ?-radi...

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32nd IEEE International Conference on microelectronics, MIEL 2021

作者： Ilic, S.D. Andjelkovic, M.S. Carvajal, M.A. Lallena, A.M. Krstic, M. Stankovic, S. Ristic, G.S. University of Belgrade Center of Microelectronic Technologies Technology and Metallurgy Serbia IHP-Leibniz-Institut für Innovative Mikroelektronik System Architectures Department Frankfurt Germany University of Granada Department of Electronics and Computer Technology Granada Spain Vincca Institute of Nuclear Sciences Department of Radiation and Environmental Belgrade Serbia University of Niš Faculty of Electronic Engineering Department of Microelectronics Niš Serbia

ISBN: (纸本)9781665445283

In this paper, the feasibility of using commercial power Silicon Carbide (SiC) Schottky diodes as a current mode ?-radiation detector have been examined. Diodes with almost identical electric characteristics are purchased from two different manufacturers, On Semiconductor and RoHM. They have been tested under gamma radiation exposure from a Co-60 source. The current response during irradiation has been measured for various dose rates with reversed diode bias. Investigated range of dose rates was from 0.258 Gy/h to 26.312 Gy/h, and reverse diode bias values were 10 V, 20 V, 50 V, 100 V and 200 V. Tested Schottky diodes produce stable current response for the investigated dose rates. Although the manufacturers are different, the results show that the dosimetric characteristics of these diodes have an excellent match. Sensitivity was proportional to the applied reverse bias voltage. A simple power-law can very well describe the dependence of measured radiation-induced current on dose rate. © 2021 IEEE.

关键词： Silicon carbide

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Two New Kinds of Interference Alignment Schemes for Cellular K-user MIMO Downlink Networks

arXiv

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arXiv 2021年

作者： Li, Jingfu Feng, Wenjiang Yu, F. Richard Jiang, Weiheng The School of Microelectronics and Communication Engineering Chongqing University Chongqing400044 China The Department of System and Computer Engineering Carleton University OttawaONK1S 5B6 Canada

It is known that interference alignment (IA) plays an important role in improving the degree of freedom (DoF) of multi-input and multi-output (MIMO) systems. However, most of the traditional IA schemes suffer from the high computational complexity and require the global and instantaneous channel state information (CSI), both of which make them difficult to be extended to cellular MIMO systems. To handle these issues, two new interference alignment schemes, i.e., the retrospective interference regeneration (RIR) scheme and the beamforming based distributed retrospective interference alignment (B-DRIA) scheme, are proposed for cellular K-user MIMO downlink networks. For the RIR scheme, it adopts interference elimination algorithm to erase redundant symbols in inter-cell interference (ICI) signals, and then uses interference regeneration algorithm to avoid secondary interference. The RIR scheme obtains greater DoF gain than the retrospective interference alignment (RIA) scheme, but incurs performance degradation when the transceiver antennas ratio (TAR) approaches 1. Therefore, the B-DRIA scheme is further proposed. For the B-DRIA scheme, the cellular beamforming matrix is introduced to eliminate the ICI, and meanwhile distributed retrospective interference alignment algorithm is adopted to align inter-user interference (IUI). The simulation results show that the B-DRIA scheme obtains larger DoF than the RIR scheme locally. Specifically, when TAR approaches 1, two schemes obtain the same DoF. While TAR approaches 2, the DoF of the B-DRIA scheme is superior than the RIR scheme. © 2021, CC BY.

关键词： Beamforming

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