In computer-Communication networks, addressing and routing have been fundamental issues that have challenged researchers - resulting in myriads of addressing and routing protocols. In recent times, self-configuration ...
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With the explosive growth of broadband Internet technologies, novel multicast services can be made available. The IEEE 802.11 Wireless LAN has been widely deployed driven by the unprecedented demand for ubiquitous wir...
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With the explosive growth of broadband Internet technologies, novel multicast services can be made available. The IEEE 802.11 Wireless LAN has been widely deployed driven by the unprecedented demand for ubiquitous wireless data services. The IEEE 802.11e standard has been further developed for offering classified services for various multimedia applications. However, the IEEE 802.11e does not support any MAC layer recovery for multicast frames. Additionally, while multicast receivers are located at different locations with different channel conditions, the source might compromise to transmit multicast frames at the lowest data rate. As the number of wireless multicast receivers grows, the number of retransmissions increases due to link errors or unexpected collisions. In this paper, we make use of multiple modulation types specified by IEEE 802.11 and present a group-based relay approach to multicast services over error-prone wireless networks.
Electromagnetic bandgap (EBG) structures in a pair of parallel planes are quite effective for suppressing simultaneous switching noise, but they are too large to be applied to compact electronic devices. To miniaturiz...
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Many wireless sensor networks applications have been investigated such as in scientific, medical, commercial, and military domains, to perform sensing and monitoring in physical world. Large-scale wireless sensor netw...
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ISBN:
(纸本)9780889866782
Many wireless sensor networks applications have been investigated such as in scientific, medical, commercial, and military domains, to perform sensing and monitoring in physical world. Large-scale wireless sensor networks are composed of hundreds or thousands of autonomous sensor nodes. Effectively managing sensor networks is a major challenge. An SNMP-like sensor network management system, WSNView system, is developed to provide a convenient and effective means of monitoring and managing sensor network operations. The WSNView system can automatically search for any sensor node and demonstrate its connection relations among other sensor nodes. This system can also monitor, collect and analyze networks. network operation can be modified based on the measured and analysis data. The network can automatically display information about and the reasons for abnormal phenomenon. The management of configuration, performance and faults in a network is performed according to the collected information. Experimental results show that the designed WSNView system is effective in wireless sensor networks.
Encouraging the release of network data is central to promoting sound network research practices, though the publication of this data can leak sensitive information about the publishing organization. To address this d...
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The Smurf-based distributed denial of service (DDoS) attack is an amplification attack where the attacker uses unprotected intermediate networks to amplify the attack traffic load and direct it to the victim computer....
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Undesirable short-channel effects associated with the relentless downscaling of conventional CMOS devices have led to the emergence of new classes of MOSFETs. This has led to new and unprecedented challenges in comput...
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Wireless communication systems often require multiband receivers. The multiband operation is controlled by the voltage controlled oscillator (VCO). MOSFET switches are commonly used in the switched capacitor array in ...
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InfiniBand is becoming increasingly popular in the area of cluster computing due to its open standard and high performance. I/O interfaces like PCI-Express and GX+ are being introduced as next generation technologies ...
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Flip chip bonding technology has been widely used for interconnection in high-end logic LSI employing lead-ricb solder bumps. Recently, from an environmental issue, it is desired that the lead-rich solder should be re...
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ISBN:
(纸本)9781424409846
Flip chip bonding technology has been widely used for interconnection in high-end logic LSI employing lead-ricb solder bumps. Recently, from an environmental issue, it is desired that the lead-rich solder should be replaced by lead-free solder. However, the stress at the interconnection after flip chip bonding reflow cannot be relaxed with lead-free solder bumps because of their poor creep properties. Since the stress causes delamination of the low-k layer under bumps and electrical open errors, the improvement of the solder bump material and the flip chip bonding process have been necessary for stress relaxation. In this study, we investigated the creep properties of Sn-0.7Cu and Sn-3.5Ag bumps by the indentation method. As a result, it was found that the creep properties of Sn-0.7Cu bumps was more suitable for stress relaxation than those of Sn-3.5Ag. Moreover, we confirmed that a low-stress interconnection had been achieved by employing Sn-0.7Cu bumps. The stress at the interconnection was less than the delaminating stress of the low-k layer. In addition, when the flip chip bonding was carried out by the reflow with the post-annealing, in which the temperature was held for a period of time at 200 degrees C during reflow cooling part, the maximum stress in the low-k layer has been reduced by more than 36% in comparison with the low-k delarninating stress. Furthermore, it was found that the stresses at the flip chip joints were relaxed because of the increase of the creep rate which was caused by the reflow with the post-annealing.
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