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DM EMI noise prediction in constant on-time PFC

DM EMI noise prediction in constant on-time PFC

引用

IEEE Energy Conversion Congress and Exposition, ECCE

作者： Zijian Wang Shuo Wang Chuanyun Wang Fred C. Lee Pengju Kong Center of Power Electronics Systems The Bradley Department of Electrical & Computer Engineering Virginia Polytechnic Institute and State University Blacksburg VA USA

ISBN: (纸本)9781424428922

The EMI characteristics of the constant on-time PFC have not been carefully identified because its EMI performance is unclear. In this paper, a mathematical model based on the principle of the quasi-peak detection is proposed to predict the EMI noise of the constant on-time PFC. The developed prediction method is verified by experimental results. The predicted DM EMI noise can match the measured quasi-peak DM EMI noise very well. The proposed mathematical model would be very helpful to the investigation of the EMI characteristics of the constant on-time PFC and the design of the EMI filter.

关键词： Delta modulation Electromagnetic interference Virtual colonoscopy Noise cancellation Inductors Switches Mathematical model Noise measurement Filters Noise reduction

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Height Optimization for a Medium-Voltage Planar Package

Height Optimization for a Medium-Voltage Planar Package

引用

Annual IEEE Conference on Applied Power Electronics Conference and Exposition (APEC)

作者： Xiao Cao Tao Wang Khai D. T. Ngo Guo-Quan Lu Center of Power Electronics Systems The Bradley Department of Electrical and Computer Engineering Virginia Polytechnic Institute and State University Blacksburg VA USA

Due to the thin structure employed in planar packaging, the high electric field intensity may occur inside the power module, leading to degradation of the dielectric performance. To resolve this issue, the Metal-Posts-Interconnected Parallel Plate Structure (MPIPPS) is used to reduce the high field concentration in the power module. However, the high bonding joint in MPIPPS will cause high thermo-mechanical stress in the solder layers. In this paper, a methodology to optimize the joint height based on the trade-off between thermo-mechanical performance and dielectric performance of the power module is proposed. The impact of the joint height on thermo-mechanical stress and dielectric performance of the module is investigated quantitatively using ANSYS and Maxwell simulations. The results show that with 0.4 mm joint height and Nusil R-2188 encapsulation, the power module can achieve 3 kV breakdown voltage. The experimental results agree with the simulation results.

关键词： Medium voltage Packaging Multichip modules Dielectrics Thermomechanical processes Thermal stresses Lead Degradation Bonding Optimization methods

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High Inductance Density Low-Profile Inductor Structure for Integrated Point-of-Load Converter

High Inductance Density Low-Profile Inductor Structure for I...

引用

Annual IEEE Conference on Applied Power Electronics Conference and Exposition (APEC)

作者： Qiang Li Fred C. Lee Center of Power Electronics Systems The Bradley Department of Electrical and Computer Engineering Virginia Polytechnic Institute and State University Blacksburg VA USA

This paper presents a 3D integrated solution that uses a low-profile planar inductor as the substrate as one of the possible methods to integrate the magnetic component with the active component. In order to reduce the inductor size to achieve a more compact integrated converter, several low-profile inductor structures with different flux path patterns (vertical or lateral) based on low temperature co-fired ceramics (LTCC) technology are studied and compared. Some lateral flux structures are proposed to increase the inductance density for a low-profile inductor design. A 1.5 MHz, 5 V to 1.2 V, 3D integrated buck converter with LTCC inductor substrate is designed and fabricated and Compared with a vertical flux structure, the proposed lateral flux structure can help to save around 30% of the footprint. The full load (Io= 15 A) efficiency of this 3D integrated buck converter is around 87%. The power density of this integrated converter is as high as 300 W/in 3 .

关键词： Inductance Magnetic flux Coils Magnetic cores Buck converters Active inductors Temperature Ceramics Toroidal magnetic fields Spirals

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Comparison of current sharing among paralleled devices in wire-bonded and planar power modules

Comparison of current sharing among paralleled devices in wi...

引用

IEEE Electric Ship Technologies Symposium, ESTS

作者： Tong Liu Khai D. T. Ngo G. Q. Lu Rolando Burgos Fred Wang Dushan Boroyevich Center of Power Electronics Systems The Bradley Department of Electrical and Computer Engineering Virginia Polytechnic Institute and State University Blacksburg VA USA

The full circuit models of two power modules carrying insulated-gate bipolar transistors (IGBT) are obtained using electro-magnetic simulation. Simulation of the full circuit models shows that the planar IGBT module excels the wire-bonded IGBT module in the current sharing capability. The gate inductances and resistances are found to be 60% less in the planar interconnect module than in the wire-bonded module. As a result, the power module with planar interconnects yields faster response, which decreases the switching energy imbalance caused by the time lags. The variation of the threshold voltages has a significant effect on the switching energy distribution among the devices. The IGBT with lower threshold voltage tends to be turned on earlier and turned off later than the IGBT with higher threshold voltage. Therefore, a substantial amount of current will travel through the IGBT with lower threshold voltage during switching transient. The continuous operation of the power modules leads to junction temperature imbalance on the IGBTs. The thermal imbalance can further cause imbalance of energy dissipation. Simulation shows that the planar module layout can decrease the impact of layout impedances, thermal imbalance, and process variations.

关键词： Multichip modules Insulated gate bipolar transistors Impedance Copper Integrated circuit interconnections Diodes Circuit simulation Threshold voltage Bonding Wires

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On Balancing Exploration Vs. Exploitation in a Cognitive Engine for Multi-Antenna Systems

On Balancing Exploration Vs. Exploitation in a Cognitive Eng...

引用

GLOBECOM 2009 - 2009 IEEE Global Telecommunications Conference

作者： Haris I. Volos R. Michael Buehrer Mobile and Portable Radio Research Group (MPRG) Bradley Department of Electrical and Computer Engineering Virginia Polytechnic Institute and State University USA

In this paper, we define the problem of balancing exploration vs. exploitation in a cognitive engine controlled multi-antenna communication system in terms of the classical multi-armed bandit framework. We then employ the e-greedy strategy and Gittins' indices methods for addressing the problem in a system with no prior information. Results show that the Gittins' indices assuming a normal reward process had the best overall performance compared to the Gittins' indices with a Bernoulli reward process and the e-greedy strategy. The latter was found to be more consistent albeit inefficient for most of the cases except in the case of both a low number of trials and a low SNR in which it was found to have better performance than the other methods. Nevertheless, the Gittins' indices method should be generally preferred as it is more consistent than the e-greedy strategy across different scenarios.

关键词： Engines Design optimization Cognitive radio Chromium Learning Artificial intelligence Physical layer Optimization methods Mobile computing Communication system control

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SV-BCMCS: Scalable Video Multicast in Hybrid 3G/Ad-Hoc Networks

SV-BCMCS: Scalable Video Multicast in Hybrid 3G/Ad-Hoc Netwo...

引用

GLOBECOM 2009 - 2009 IEEE Global Telecommunications Conference

作者： Sha Hua Yang Guo Yong Liu Hang Liu Shivendra S. Panwar Department of Electrical and Computer Engineering Polytechnic Institute of New York University Brooklyn NY USA Corporate Research Center NJ USA

Mobile video broadcasting service, or mobile TV, is a promising application for 3G wireless network operators. Most existing solutions for video broadcast/multicast services in 3G networks employ a single transmission rate to cover all viewers. The system-wide video quality of the cell is therefore throttled by a few viewers close to the boundary, and is far from reaching the social-optimum allowed by the radio resources available at the base station. In this paper, we propose a novel scalable video broadcast/multicast solution, SV-BCMCS, that efficiently integrates scalable video coding, 3G broadcast and adhoc forwarding to balance the system-wide and worst-case video quality of all viewers in a 3G cell. We study the optimal resource allocation problem in SV-BCMCS and develop practical helper discovery and relay routing algorithms. Through analysis and extensive OPNET simulations, we demonstrate that SV-BCMCS can significantly improve the system-wide video quality at the price of slight quality degradation of a few viewers close to the boundary.

关键词： Ad hoc networks Multimedia communication Radio broadcasting TV broadcasting Mobile TV Wireless networks Base stations Video coding Resource management Relays

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SiC Wirebond Multi-Chip Phase-Leg Module Packaging Design and Testing for Harsh Environment

SiC Wirebond Multi-Chip Phase-Leg Module Packaging Design an...

引用

Annual IEEE Conference on Applied Power Electronics Conference and Exposition (APEC)

作者： Puqi Ning Rixin Lai Daniel Huff Fred Wang Khai D. T. Ngo Center of Power Electronics Systems The Bradley Department of Electrical and Computer Engineering Virginia Polytechnic Institute and State University Blacksburg VA USA

In order to take full advantage of SiC, a high temperature wirebond package for multi-chip phase-leg power module using SiC devices was designed, developed, fabricated and tested. The details of the material selection and thermo-mechanical reliability evaluation are described. High temperature power test shows that the package presented in this paper can perform well at the high junction temperature.

关键词： Silicon carbide Temperature Multichip modules Thermomechanical processes Semiconductor device packaging Electronic equipment testing Materials reliability Assembly Electronics packaging System testing

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A Novel High-Temperature Planar Package for SiC Multi-Chip Phase-Leg Power Module

A Novel High-Temperature Planar Package for SiC Multi-Chip P...

引用

Annual IEEE Conference on Applied Power Electronics Conference and Exposition (APEC)

作者： Puqi Ning Thomas G. Lei Fred Wang Guo-Quan Lu Khai D. T. Ngo Center of Power Electronics Systems The Bradley Department of Electrical and Computer Engineering Virginia Polytechnic Institute and State University Blacksburg VA USA

This work presents the design, development and testing of a phase-leg power module packaged by a novel planar packaging technique for high temperature (250degC) operation. Nano-silver paste is chosen as the die-attach material as well as playing the key functions of electrically connecting the devices' pads. The electrical characteristics of the SiC-based power semiconductors, SiC JFETs and SiC diodes, have been measured and compared before and after packaging. No significant changes are found in the characteristics of all the devices. Prototype module is fabricated and operated up to 400 V, 1.4 kW at junction temperature of 250degC in the continuous power test. Thermo-mechanical reliability has also been investigated by passive cycling the module from -55degC to 250degC. electrical and mechanical performances of the packaged module are characterized and considered to be reliable for at least 200 cycles.

关键词： Silicon carbide Multichip modules Semiconductor device packaging Testing Temperature Nanoscale devices Phase change materials Semiconductor materials Joining processes Electric variables

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New Modeling Approach for Current-Mode Control

New Modeling Approach for Current-Mode Control

引用

Annual IEEE Conference on Applied Power Electronics Conference and Exposition (APEC)

作者： Jian Li Fred C. Lee Center of Power Electronics Systems The Bradley Department of Electrical and Computer Engineering Virginia Polytechnic Institute and State University Blacksburg VA USA

Constant on-time current-mode control has been widely used to improve light-load efficiency, because it can reduce the switching frequency to save switching-related loss. Therefore, an accurate model for constant on-time control is indispensable to system design. However, available models for constant on-time control are unable to provide accurate physical insight and predict the system response, especially the possible sub-harmonic oscillation in the V 2 type implementation. This paper introduces a new modeling approach for constant on-time control. The inductor, the switches and the PWM modulator are treated as a single entity and modeled based on the describing function method. The fundamental difference between constant on-time control and peak current-mode control is analyzed using the proposed model. The new modeling approach can be extended to other current-mode controls as well. A simple equivalent circuit representation is proposed for easy understanding of current-mode control. Simulation and experimental results are used to verify the proposed model.

关键词： Voltage control Capacitors Pulse width modulation Lighting control Inductors Delay Predictive models Switches Power system modeling Power electronics

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Internal quantum efficiency and non-radiative recombination coefficient of GaInN/GaN multiple quantum wells with different dislocation densities

Internal quantum efficiency and non-radiative recombination ...

引用

Conference on Lasers and Electro-Optics (CLEO)

作者： Q. Dai M. F. Schubert M. H. Kim J. K. Kim E. F. Schubert D. D. Koleske M. H. Crawford S. R. Lee A. J. Fischer G. Thaler M. A. Banas Electrical Computer and Systems Engineering Department Rensselaer Polytechnic Institute Troy NY USA Future Chips Constellation Rensselaer Polytechnic Institute NY USA Department of Physics Applied Physics and Astronomy Electrical Computer and Systems Engineering Department Rensselaer Polytechnic Institute 110 Eighth St. Troy NY 12180 USA Sandia National Laboratories Albuquerque NM USA

Room-temperature photoluminescence measurements are performed on GaInN/GaN multiple quantum wells grown on GaN-on-sapphire templates with different threading-dislocation densities. The internal quantum efficiencies as... 详细信息

关键词： Radiative recombination Gallium nitride Quantum well devices Density measurement Light emitting diodes Quantum computing Photoluminescence Extraterrestrial measurements Gain measurement Physics

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