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IACR Transactions on Cryptographic Hardware and Embedded Systems 2023年第4期2023卷 238-261页

作者： Mosavirik, Tahoura Monfared, Saleh Khalaj Safa, Maryam Saadat Tajik, Shahin Department of Electrical and Computer Engineering Worcester Polytechnic Institute WorcesterMA United States

The threat of chip-level tampering and its detection has been widely researched. Hardware Trojan insertions are prominent examples of such tamper events. Altering the placement and routing of a design or removing a part of a circuit for side-channel leakage/fault sensitivity amplification are other instances of such attacks. While semi-and fully-invasive physical verification methods can confidently detect such stealthy tamper events, they are costly, time-consuming, and destructive. On the other hand, virtually all proposed non-invasive side-channel methods suffer from noise and, therefore, have low confidence. Moreover, they require activating the tampered part of the circuit (e.g., the Trojan trigger) to compare and detect the modifications. In this work, we introduce a non-invasive post-silicon tamper detection technique applicable to different classes of tamper events at the chip level without requiring the activation of the malicious circuit. Our method relies on the fact that physical modifications (regardless of their physical, activation, or action characteristics) alter the impedance of the chip. Hence, characterizing the impedance can lead to the detection of the tamper events. To sense the changes in the impedance, we deploy known RF tools, namely, scattering parameters, in which we inject sine wave signals with high frequencies to the power distribution network (PDN) of the system and measure the "echo" of the signal. The reflected signals in various frequency bands reveal different tamper events based on their impact size on the die. To validate our claims, we performed measurements on several proof-ofconcept tampered hardware implementations realized on FPGAs manufactured with a 28 nm technology. We further show that deploying the Dynamic Time Warping (DTW) distance can distinguish between tamper events and noise resulting from manufacturing process variation of different chips/boards. Based on the acquired results, we demonstrate that stealthy hardwa

关键词： Scattering parameters

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Framework for Implementing Quantum Neural Networks in Wireless Communications

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IEEE Access 2025年 13卷 91655-91670页

作者： Siddiqui, Salik Holzer, Justin Malcarne, Joshua Wernsing, Galahad M.B Wyglinski, Alexander M. Worcester Polytechnic Institute Electrical and Computer Engineering Department WorcesterMA01609 United States

While quantum computing is already being employed in different domains to solve large scale and highly complex optimization problems, the wireless communications community has only recently begun exploring the potential of Quantum Machine Learning (QML). This paper provides a reference design approach that allows the wireless community to effectively leverage QML in optimizing their own wireless communications networks. Such an approach will become increasingly valuable as quantum computing matures and conventional computing methods reach their practical limits due to the high dimensionality of optimization problems. We present a detailed methodology enabling wireless communications practitioners to construct their own Quantum Neural Networks (QNN) implementations and benchmark their performance against conventional techniques. Optimization strategies for wireless communication channels using QNNs are explored. The resulting framework provides a generalizable, easy-to-adopt methodology for integrating QML into wireless networks, requiring minimal prior knowledge of quantum computing. © 2013 IEEE.

关键词： Qubits

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ImpedanceVerif: On-Chip Impedance Sensing for System-Level Tampering Detection

IACR Transactions on Cryptographic Hardware and Embedded Sys...

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IACR Transactions on Cryptographic Hardware and Embedded Systems 2022年第1期2023卷 301-325页

作者： Mosavirik, Tahoura Schaumont, Patrick Tajik, Shahin Department of Electrical and Computer Engineering Worcester polytechnic Institute WorcesterMA United States

Physical attacks can compromise the security of cryptographic devices. Depending on the attack’s requirements, adversaries might need to (i) place probes in the proximity of the integrated circuits (ICs) package, (ii) create physical connections between their probes/wires and the system’s PCB, or (iii) physically tamper with the PCB’s components, chip’s package, or substitute the entire PCB to prepare the device for the attack. While tamper-proof enclosures prevent and detect physical access to the system, their high manufacturing cost and incompatibility with legacy systems make them unattractive for many low-cost scenarios. In this paper, inspired by methods known from the field of power integrity analysis, we demonstrate how the impedance characterization of the system’s power distribution network (PDN) using on-chip circuit-based network analyzers can detect various classes of tamper events. We explain how these embedded network analyzers, without any modifications to the system, can be deployed on FPGAs to extract the frequency response of the PDN. The analysis of these frequency responses reveals different classes of tamper events from board to chip level. To validate our claims, we run an embedded network analyzer on FPGAs of a family of commercial development kits and perform extensive measurements for various classes of PCB and IC package tampering required for conducting different side-channel or fault attacks. Using the Wasserstein Distance as a statistical metric, we further show that we can confidently detect tamper events. Our results, interestingly, show that even environment-level tampering activities, such as the proximity of contactless EM probes to the IC package or slightly polished IC package, can be detected using on-chip impedance sensing. © 2022, Ruhr-University of Bochum. All rights reserved.

关键词： Probes

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DeepSC-Edge: Scientific Corrosion Segmentation with Edge-Guided and Class-Balanced Losses 22

DeepSC-Edge: Scientific Corrosion Segmentation with Edge-Gui...

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22nd IEEE International Conference on Machine Learning and Applications, ICMLA 2023

作者： Yin, Biao Josselyn, Nicholas Considine, Thomas Kelley, John Rinderspacher, Berend Jensen, Robert Snyder, James Zhang, Ziming Rundensteiner, Elke Worcester Polytechnic Institute Department of Computer Science WorcesterMA United States Worcester Polytechnic Institute Department of Data Science WorcesterMA United States Worcester Polytechnic Institute Department of Electrical and Computer Engineering WorcesterMA United States

ISBN: (纸本)9798350345346

Corrosion is a prevalent issue in numerous industrial fields, causing expenses nearing 3 trillion or 4% of the GDP annually with safety threats and environmental pollution. To timely qualify and validate new corrosion-inhibiting materials on a large scale, accurate and efficient corrosion assessment is crucial. Yet it is hindered by a lack of automatic tools for expert-level corrosion segmentation of material science experimental images. Developing such tools is challenging due to limited domain-valid data, image artifacts visually similar to corrosion, various corrosion morphology, strong class imbalance, and millimeter-precision corrosion boundaries. To help the community address these challenges, we curate the first expert-level segmentation annotations for a real-world image dataset [1] for scientific corrosion segmentation. In addition, we design a deep learning based model, called DeepSC-Edge that achieves guidance of ground-truth edge learning by adopting a novel loss that avoids over-fitting to edges. It also is enriched by integrating a class-balanced loss that improves segmentation with small area but crucial edges of interest for scientific corrosion assessment. Our dataset and methods pave the way to advanced deep-learning models for corrosion assessment and generation - promoting new research to connect computer vision and material science discovery. Once the appropriate approvals have been cleared, we expect to release the code and data at: https://***/ © 2023 IEEE.

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Outlier Detection and Removal Signal Processing for Wearable Transcutaneous Oxygen Sensor

Outlier Detection and Removal Signal Processing for Wearable...

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2023 IEEE MIT Undergraduate Research Technology Conference, URTC 2023

作者： Leonardi, Abigail Murphy, Ciara Hobson, Sydney Rohera, Vanshika Guler, Ulkuhan Worcester Polytechnic Institute Electrical and Computer Engineering Department WorcesterMA01609 United States

ISBN: (纸本)9798350308600

Respiratory diseases impact millions of people worldwide. In the smart and connected health era, there is a pressing need for reliable medical devices for remote monitoring of patients with respiratory disorders and patients with chronic diseases in general. For respiratory monitoring, there exist widely-used miniaturized photoplethysmography devices to measure peripheral blood oxygen saturation. More recently, transcutaneous oxygen monitors have been designed in a small form factor to be used as wearable devices to enable remote and continuous measurement of transcutaneous oxygen. In this study, we focus on processing the raw data collected from a noninvasive transcutaneous blood gas monitor that is in the development phase. Post-processing should be applied to remove the outliers in the measurements and smooth out the measurement noise. Various filters to remove outliers were tested in MATLAB, including the Hampel, rmoutliers, filloutliers, and moving average filters. The Hampel filter yielded the best results while maintaining the integrity of the data. The fillmissing function in MATLAB using the previous or linear interpolation methods is used to replace outlier data. The comparison of the raw data and the result of the data processing is presented. © 2023 IEEE.

关键词： Blood

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Additively Manufactured Receiver Design for Wirelessly-Powered Biomedical Applications

Additively Manufactured Receiver Design for Wirelessly-Power...

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2023 IEEE Biomedical Circuits and Systems Conference, BioCAS 2023

作者： Marangalou, Amin Hazrati Arturo Gonzalez, Miguel Guler, Ulkuhan Worcester Polytechnic Institute Department of Electrical and Computer Engineering WorcesterMA01609 United States

ISBN: (纸本)9798350300260

This paper presents a miniaturized receiver prototype fabricated using an additive manufacturing electronics process. We aim to demonstrate the feasibility and advantages of using additive manufacturing for embedding the essential components of an inductive link in a compact form factor for miniaturized biomedical devices. We demonstrated various geometries of planar and helical coils, with average diameters of 20 mm. The wireless power transfer system comprises a class-E power amplifier operating at 6.78 MHz, a 10 μH transmitter coil, and a full-wave active rectifier fabricated in TSMC 180 nm CMOS process technology. The power delivered to a 500 Ω load at the output of the active rectifier varies from 2.7 mW to 42 mW for planar coils and 3 mW to 45 mW for helical coils, over a range of 1 cm to 4 cm. The transmitter's power consumption is kept constant at 1.25 W throughout the experiments. Furthermore, in the case of helical coils, a lateral center-to-center misalignment of 1 cm at a distance of 2 cm between the receiver and transmitter results in a 10 mW drop in the output power. © 2023 IEEE.

关键词： Additive manufacturing electronics Coils Implantables Inductive link Power transfer efficiency Wearables Wireless power transfer system

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An Attention-based Self-Supervised Approach to Monocular Depth Estimation from UAV captured Video Sequences 6

An Attention-based Self-Supervised Approach to Monocular Dep...

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6th IEEE International Conference on Pattern Recognition and Artificial Intelligence, PRAI 2023

作者： Benkhoui, Yasmina El-Korchi, Tahar Ludwig, Reinhold Worcester Polytechnic Institute Electrical and Computer Engineering Department United States Worcester Polytechnic Institute Civil and Environmental Engineering Department United States

ISBN: (纸本)9798350325485

UAV-based inspections represent a promising solution to contactless civil infrastructure condition assessment, especially bridges. In this context, depth estimation is crucial as it helps predict the distance to objects, plan flight trajectories, and avoid obstacles. Recently, learning-based methods made significant progress in monocular depth estimation. However, supervised approaches require a large amount of annotated depth data which remains challenging to collect. As an alternative, researchers have been investigating self-supervised learning, where the depth estimation network is trained by projecting a view to nearby views and minimizing the re-projection photometric loss. However, current methods lack accuracy and robustness since they do not exploit structural information, leading to inaccurate spatial representations and surface discontinuities. In addition, monocular depth estimation suffers from scale ambiguity, and external or prior information is needed for scale recovery. This work sought to overcome these issues by adapting the standard joint network of estimating depth and pose based on a self-learned depth prediction network from monocular videos. The proposed method introduces a soft attention mechanism and a recurrent block. The attention mechanism guides the neural network's attention to the global structures and local attributes and recovers the spatial relationship of visual features, whereas the recurrent block leverages sequence frames to capture temporal information in addition to spatial information. Our experiments and ablation study on AeroBridge dataset demonstrate that these modifications efficiently capture spatio-Temporal information and generate competitive qualitative and quantitative results compared to state-of-The-Art methods confirming the practical applicability of our design in inspection tasks. © 2023 IEEE.

关键词： Unmanned aerial vehicles (UAV)

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A Behavioral Model for Transcutaneous Carbon Dioxide Measurement Using Time-Correlated Single Photon Counting Technique 46

A Behavioral Model for Transcutaneous Carbon Dioxide Measure...

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46th Annual International Conference of the IEEE engineering in Medicine and Biology Society, EMBC 2024

作者： Isiksalan, Isil Karli, Hakan B. Tufan, Tuna B. Matthews, John Unluturk, Bige D. Guler, Ulkuhan Worcester Polytechnic Institute Department of Electrical and Computer Engineering WorcesterMA01609 United States Michigan State University Michigan Department of Electrical and Computer Engineering MI48824 United States

ISBN: (纸本)9798350371499

Millimeter-size carbon dioxide (CO2)-sensitive luminescence films emerge as practical sensors in miniaturized biomedical devices for measuring transcutaneous CO2. The intensity and lifetime of the excited luminophores in the film carry critical information about the CO2 values in the surrounding environment. It has been proven that lifetime-based measurement is superior to intensity-based measurement because of its robustness to confounding factors. Addressing the challenge of accurately determining the rapid nanosecond-scale lifetime of CO2-sensitive luminophores, we introduce a behavioral model using a time-correlated single photon counting system equipped with silicon photomultipliers. We included nonidealities such as dark count rate, afterpulsing, and crosstalk to this model. To recover the lifetime from photon counts, we applied denoising and fitting techniques. With hyperparameter optimization to determine various post-processing parameters, we improved accuracy in recovery for lifetime values ranging from 3 ns to 7 ns. Our results demonstrate the applicability of the proposed model and techniques in real-world scenarios. © 2024 IEEE.

关键词： Photomultipliers

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Robot-Assisted Wide-Area Photoacoustic System

Robot-Assisted Wide-Area Photoacoustic System

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2023 IEEE International Ultrasonics Symposium, IUS 2023

作者： Gao, Shang Ma, Xihan Zhang, Haichong K. Worcester Polytechnic Institute Department of Robotics Engineering Worcester United States Worcester Polytechnic Institute Department of Biomedical Engineering Worcester United States Worcester Polytechnic Institute Department of Computer Science Worcester United States

ISBN: (纸本)9798350346459

Liver ischemia and reperfusion injury (IRI) is a vascular complication that can lead to hepatic functional impairment. IRI is relevant in liver transplantation and during liver surgery performed with intermittent vascular inflow occlusion. Detecting intraoperative liver oxygenation impairment and ischemia could help prevent IRI, which is challenging partially due to the multiple hepatic vascular inflows. We propose a robot-assisted wide-area photoacoustic (PA) imaging system to monitor the liver oxygenation level intraoperatively. PA imaging has been widely used for oxygenation detection in preclinical research. We used a robotic arm to actuate the 2D PA probe and scan across the liver surface. An accurate volumetric tomography can be reconstructed via registering 2D images to the recorded robot trajectory. An ex vivo porcine liver sample was scanned using the proposed system. The result suggested that the robot-assisted wide-area PA tomography has the potential to be incorporated into clinical practice to evaluate liver SO2 intraoperatively. © 2023 IEEE.

关键词： Photoacoustic effect

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Evaluating Vulnerability of Chiplet-Based Systems to Contactless Probing Techniques

Evaluating Vulnerability of Chiplet-Based Systems to Contact...

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2024 IEEE International Test Conference, ITC 2024

作者： Deric, Aleksa Mitard, Kyle Tajik, Shahin Holcomb, Daniel University of Massachusetts Amherst Department of Electrical and Computer Engineering AmherstMA01003 United States Worcester Polytechnic Institute Department of Electrical and Computer Engineering WorcesterMA01609 United States

ISBN: (纸本)9798331520137

Driven by a need for ever-increasing chip performance, a growing number of semiconductor companies are opting for all-inclusive System-on-Chip (SoC) architectures. Increasingly, the solution adopted to minimize the impact of silicon defects on manufacturing yield of larger dies has been to split a design into multiple smaller dies called chiplets, which are then brought together on a silicon interposer. Advanced 2.5D and 3D packaging techniques that enable this kind of integration also promise increased power efficiency and opportunities for heterogeneous ***, despite their advantages, chiplets are not without issues. Disaggregating a design into multiple separate dies introduces new security threats, including the possibility of tampering with and probing exposed data lines. In this paper we evaluate the exposure of chiplets to probing by applying laser contactless probing techniques to a chiplet-based AMD/Xilinx VU9P FPGA. First, we identify and map interposer wire drivers, and show that probing them is easier compared to probing internal nodes. Lastly, we demonstrate that delay-based sensors, which can be used to protect against physical probes, are insufficient to protect against laser probing. © 2024 IEEE.

关键词： System-on-chip

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