We demonstrate enhanced Peltier cooling at the nanoscale using geometrical constriction. This nozzle structure leads to electron expansion under an applied bias, which in turn results in additional cooling. This extra...
详细信息
The phenomenon of resonant tunneling transport through polar double-barrier heterostructures is systematically investigated using a combined experimental and theoretical approach. On the experimental side, GaN/AlN res...
详细信息
The phenomenon of resonant tunneling transport through polar double-barrier heterostructures is systematically investigated using a combined experimental and theoretical approach. On the experimental side, GaN/AlN resonant tunneling diodes (RTDs) are grown by molecular beam epitaxy. In-situ electron diffraction is used to monitor the number of monolayers incorporated into each tunneling barrier of the RTD active region. Using this precise epitaxial control at the monolayer level, we demonstrate exponential modulation of the resonant tunneling current density as a function of barrier thickness. At the same time, both the peak voltage and characteristic threshold bias exhibit a dependence on barrier thickness as a result of the intense electric fields present within the polar heterostructures. To get further insight into the asymmetric tunneling injection originating from the polar active region, we present an analytical theory for tunneling transport across polar heterostructures. A general expression for the resonant tunneling current which includes contributions from coherent and sequential tunneling processes is introduced. After the application of this theory to the case of GaN/AlN RTDs, their experimental current-voltage characteristics are reproduced over both bias polarities, with tunneling currents spanning several orders of magnitude. This agreement allows us to elucidate the effect of the internal polarization fields on the magnitude of the tunneling current and broadening of the resonant tunneling line shape. Under reverse bias, we identify new tunneling features originating from highly attenuated resonant tunneling phenomena, which are completely captured by our model. The analytical form of our model, provides a simple expression that reveals the connection between the design parameters of a general polar RTD and its current-voltage characteristics. This new theory paves the way for the design of polar resonant tunneling devices exhibiting efficient reso
A novel drive system using Magnetic Multiple Spur Gear (MMSG) and multiple high-speed motors is characterized by small size, lightweight, and high efficiency even at high-speed region, it is expected to apply to in-wh...
A novel drive system using Magnetic Multiple Spur Gear (MMSG) and multiple high-speed motors is characterized by small size, lightweight, and high efficiency even at high-speed region, it is expected to apply to in-wheel motor systems. However, there is a risk of contact between the rotors when applied to in-wheel motor system. In this study, a novel axial-gap MMSG is proposed to solve this problem, stabilize the air gap between the high-speed and low-speed rotors, and effectively utilize the magnets, and its performance is evaluated by finite element analysis.
Magnetic gears have the characteristics of maintenance-free, low noise, and low vibration due to non-contact power transmission. By taking advantage of the non-contact power transmission, the motor system can be made ...
Magnetic gears have the characteristics of maintenance-free, low noise, and low vibration due to non-contact power transmission. By taking advantage of the non-contact power transmission, the motor system can be made smaller and lighter by further increasing the motor speed. Magnetic Multiple Spur Gear (MMSG) has been proposed, the drive system of MMSG and multiple high-speed motors can reduce the size and weight of the drive system by converting the total power of multiple high-speed motors. Applying this drive system to in-wheel motors will increase the available interior space in electric vehicles. However, there is a risk that the high-speed rotor and low-speed rotor contact with each other due to the radial structure in the in-wheel motor system. In this research, an axial-gap MMSG is proposed to solve the problem and to obtain higher torque density, the performances such as torque density and efficiency are evaluated by finite element analysis.
Metasurfaces, with their ability to control electromagnetic waves, hold immense potential in optical device design, especially for applications requiring precise control over dispersion. This work introduces an approa...
详细信息
We introduce non-Hermitian plasmonic waveguide-cavity structures based on the Aubry-Andre-Harper model to realize switching between right and left topological edge states using the phase-change material germanium-anti...
详细信息
The scalable synthesis of strong spin orbit coupling (SOC) materials such as 1T’ phase MoTe2 is crucial for spintronics development. Here, we demonstrate wafer-scale growth of 1T’ MoTe2 using metal-organic chemical ...
详细信息
In this proceeding, we present polarization data of sidebands emitted from strongly driven quasiparticles, demonstrate the dependence of these data on various parameters of the external driving field, and describe the...
详细信息
Diamond nanostructures can have exciting applications in electronics and thermal management, but their controlled fabrication can be challenging. Here, we present a top-down approach for the fabrication of diamond nan...
详细信息
Following successful packaging of a 650 V/150 A e-GaN HEMT between a printed-circuit board and a direct-bond-copper substrate, this study evaluates the thermo-mechanical reliability of the sandwich-style package. Ther...
Following successful packaging of a 650 V/150 A e-GaN HEMT between a printed-circuit board and a direct-bond-copper substrate, this study evaluates the thermo-mechanical reliability of the sandwich-style package. Thermo-mechanical fatigue of both soldered and silver-sintered bonds in the package under temperature cycling was studied using ANSYS Mechanical. Deformation properties of eutectic lead-tin solder and sintered silver were modeled after Anand viscoplastic behavior. The inelastic volume-averaged strain energy density accumulated per thermal cycle at each bond was used as a metric of bond fatigue. Simulation results showed that the silver-sintered bond at the gate pad and the solder bond closest to the package center have the highest per-cycle strain energy density. Simulations also evaluated the effect of encapsulation materials on bond fatigue. It was found that using rigid encapsulants, such as one with a coefficient of thermal expansion of 14.9 ppm/°C and an elastic modulus of 17.5 GPa, instead of a commonly used silicone gel reduced the per-cycle bond fatigue by 97%. Findings of this study would help guide the development of high performing and high reliability packaging technology for the 650V/150A GaN HEMT.
暂无评论