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Clinical and Translational Biophotonics, TRANSLATIONAL 2018

作者： Lin, Pao Tai Department of Electrical and Computer Engineering Texas A and M University College StationTX77843 United States Department of Materials Science and Engineering Texas A and M University College StationTX77843 United States Center for Remote Health Technologies and Systems Texas A and M University College StationTX77843 United States

ISBN: (纸本)9781943580415

A chip-scale glucose sensor was developed using nitride optical waveguides. The label free detection was conducted at λ = 2.70 - 2.81 μm and 3.50 - 3.70 μm because these spectral regions overlap with the characteristic O-H and C-H stretch absorptions while being transparent to nitride. For a glucose covered mid-IR waveguide strong intensity attenuation was found at λ > 2.73 μm and a detection limit better than 0.5 ng is experimentally demonstrated. © OSA 2018.

关键词： Nitrides

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Mid-infrared photonic chips for real-time breath biomarkers analysis

Mid-infrared photonic chips for real-time breath biomarkers ...

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Clinical and Translational Biophotonics, TRANSLATIONAL 2018

作者： Jin, Tiening Lin, Pao Tai Department of Electrical and Computer Engineering Texas A and M University College StationTX77843 United States Department of Materials Science and Engineering Texas A and M University College StationTX77843 United States Center for Remote Health Technologies and Systems Texas A and M University College StationTX77843 United States

ISBN: (纸本)9781943580415

Real-time gas analysis on-a-chip was demonstrated using a mid-infrared (mid-IR) microcavity. Optical apertures for the microcavity were made of ultrathin silicate membranes embedded in a silicon chip using the complementary metal-oxide-semiconductor (CMOS) process. CH4, CO2, and N2O were selected as analytes due to their strong absorption bands at λ = 3.25 - 3.50 μm, 4.20 - 4.35 μm. © OSA 2018.

关键词： Microcavities

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New materials and Processes Developed for Cranioplasty

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IOP Conference Series: materials science and engineering 2020年第1期877卷

作者： I M Mates A Semenescu S I Dumitrescu R Vidu University POLITEHNICA of Bucharest Faculty of Materials Science and Engineering Splaiul Independentei nr.313 Bucharest Romania Central University Emergency Military Hospital Bucharest Romania University of California Davis Department of Electrical and Computer Engineering Davis CA 95616 USA

Traumatic brain injury is the leader in the ranking of mortality and invalidity. The surgical repair of a defect of the skull by cranioplasty has been practiced since ancient times, when materials of non-biological origin were used for this purpose. New materials and processes are sought to improve osseintegration of implants. Like any surgical procedure, cranioplasty involves complications that may be related to the surgical technique and/or to the patient's tolerance to the material used. This work described a biocompatible medical device that include two supported meshes for providing mechanical strength and osseointegration properties of the implant, and a multiplayer porous material in between them that is loaded with the required bioactive antibacterial compound to promote a controlled and sustained release of the pharmaceutical agents at the site of surgical intervention. To increase osseointegration, meshes are designed with an open structure and coated with biocompatible materials such as hydroxyapatite. The composition gradient in the multilayer porous material is attained by loading successive layers of porous material with different amounts of bioactive materials and then stacking them to create a gradient of composition across the porous material.

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Spoof-Fluid-Spoof Acoustic Waveguide and its Applications for Sound Manipulation

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Physical Review Applied 2019年第5期12卷 054014-054014页

作者： Norbert Cselyuszka Andrea Alù Nikolina Janković BioSense Institute University of Novi Sad Novi Sad Serbia Silicon Austria Labs Sensor System Microsystem Technologies Villach Austria Department of Electrical and Computer Engineering The University of Texas at Austin Austin Texas 78712 USA Photonics Initiative Advanced Science Research Center City University of New York New York New York 10031 USA Physics Program Graduate Center City University of New York New York New York 10026 USA Department of Electrical Engineering City College of New York New York New York 10031 USA

We explore the implementation of a spoof–fluid-spoof (SFS) acoustic waveguide, which is the acoustic analogue of a metal-insulator–metal waveguide in plasmonics. The proposed structure consists of two corrugated rigid surfaces separated by a fluid layer. The properties of the guided acoustic modes between corrugated rigid parallel plates are analytically and numerically studied by deriving their dispersion relation and through a careful analysis of symmetric and antisymmetric modes supported by this structure. Similar to plasmonic waveguides, it is shown that the dispersion relation of the proposed SFS acoustic waveguide, and the supported group and phase velocities, can be largely controlled by changes in the geometrical parameters of the waveguide, opening the possibility for application of this technology for acoustic delay lines, modulators, and sensors. The analytical and numerical results are validated through experiments in a controlled environment.

关键词： Acoustic measurements Acoustic metamaterials Acoustic modeling Acoustic wave phenomena Plasmonics Surface plasmon polariton Waveguides Surface acoustic wave

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The redshirt in engineering consortium: Progress and early insights 125

The redshirt in engineering consortium: Progress and early i...

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125th ASEE Annual Conference and Exposition

作者： Riskin, Eve A. Milford, Jana Callahan, Janet Cosman, Pamela Schneider, John B. Pitts, Kevin Knaphus-Soran, Emily Llewellyn, Donna C. Delaney, Ann E. Myers, Beth A. Tetrick, Katherine Christine Cunningham, Sonya Ennis, Tanya D. O'Connor, Kevin Ferrez, Michelle Pan, Tiffany D. Baldis, Jessica EE Department University of Washington United States Engineering GoldShirt Program University of Colorado Boulder United States Micron School of Materials Science and Engineering Boise State University United States Department of Electrical and Computer Engineering University of California San Diego United States Voiland College of Engineering and Architecture United States Department of Physics University of Illinois Urbana-Champaign United States University of Washington United States Institute for STEM and Diversity Initiatives Boise State University United States Public Policy and Administration Boise State University United States Department of Analytics Assessment and Accreditation University of Colorado Boulder United States Program Washington State University United States University of Washington STARS Program Diversity and Access College of Engineering United States Engineering GoldShirt Program University of Colorado Boulder College of Engineering and Applied Science United States Department of Educational Psychology and Learning Sciences University of Colorado Boulder United States United States

The NSF-funded Redshirt in engineering Consortium was formed in 2016 with the goal of enhancing the ability of academically talented but underprepared students coming from low-income backgrounds to successfully graduate with engineering degrees. The Consortium takes its name from the practice of redshirting in college athletics, with the idea of providing an extra year and support to help promising engineering students complete a bachelor's degree. The Consortium builds on the success of three existing "academic redshirt" programs and expands the model to three new schools. The Existing Redshirt Institutions (ERIs) help mentor and train the new Student Success Partners (SSPs), and SSPs contribute their unique expertise to help ERIs improve existing Redshirt programs. The Redshirt model consists of seven main programmatic components aimed at improving the engagement, retention, and graduation of students underrepresented in engineering. These components include: "intrusive" academic advising and support services, an intensive first-year academic curriculum, community-building (including pre-matriculation summer programs), career awareness and vision, faculty mentorship, NSF S-STEM scholarships, and second-year support. Successful implementation of these activities is intended to produce two main long-term outcomes: a six-year graduation rate of 60%-75% for Redshirt students, and increased rates of enrollment and graduation of Pell-eligible, URM, and women students in engineering at participating universities. In the first year of the grant (AY 16-17), SSPs developed their own Redshirt programs, hired and trained staff, and got their programs off the ground. ERIs implemented faculty mentorship programs and expanded support to Redshirt students into their sophomore year. In the second year (AY 17-18), Redshirt programs were expanded at the ERIs while SSPs welcomed their first cohorts of Redshirt students. This Work in Progress paper describes the Redshirt programs at e

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Graphene Hinges: Assembly of Foldable 3D Microstructures Using Graphene Hinges (Adv. Mater. 28/2020)

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Advanced materials 2020年第28期32卷

作者： Seungyun Lim Haiwen Luan Shiwei Zhao Yongjun Lee Yihui Zhang Yonggang Huang John A. Rogers Jong‐Hyun Ahn School of Electrical and Electronic Engineering Yonsei University Seoul 03722 Republic of Korea Departments of Mechanical Engineering Civil and Environmental Engineering Materials Science and Engineering Northwestern University Evanston IL 60208 USA Querrey Simpson Institute for Bioelectronics Northwestern University Evanston IL 60208 USA School of Aeronautic Science and Engineering Beihang University Beijing 100191 P. R. China Applied Mechanics Laboratory Department of Engineering Mechanics Center for Flexible Electronics Technology Tsinghua University Beijing 100084 P. R. China Departments of Materials Science and Engineering Biomedical Engineering Neurological Surgery Electrical and Computer Engineering Mechanical Engineering Chemistry Northwestern University Evanston IL 60208 USA

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Enhancing interconnect reliability and performance by converting tantalum to 2D layered tantalum sulfide at low temperature

arXiv

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arXiv 2019年

作者： Lo, Chun-Li Catalano, Massimo Khosravi, Ava Ge, Wanying Ji, Yujin Zemlyanov, Dmitry Y. Wang, Luhua Addou, Rafik Liu, Yuanyue Wallace, Robert M. Kim, Moon J. Chen, Zhihong School of Electrical and Computer Engineering Purdue University West LafayetteIN47907 United States Birck Nanotechnology Center Purdue University West LafayetteIN47907 United States Materials Science and Engineering Department University of Texas at Dallas 800 West Campbell Road RichardsonTX75080 United States Via Monteroni ed. A3 Lecce73100 Italy Texas Materials Institute Department of Mechanical Engineering University of Texas at Austin AustinTX78712 United States

The interconnect half-pitch size will reach ~20 nm in the coming sub-5 nm technology node. Meanwhile, the TaN/Ta (barrier/liner) bilayer stack has to be > 4 nm to ensure acceptable liner and diffusion barrier properties. Since TaN/Ta occupy a significant portion of the interconnect cross-section and they are much more resistive than Cu, the effective conductance of an ultra-scaled interconnect will be compromised by the thick bilayer. Therefore, two dimensional (2D) layered materials have been explored as diffusion barrier alternatives. However, many of the proposed 2D barriers are prepared at too high temperatures to be compatible with the back-end-of-line (BEOL) technology. In addition, as important as the diffusion barrier properties, the liner properties of 2D materials must be evaluated, which has not yet been pursued. Here, a 2D layered tantalum sulfide (TaSx) with ~1.5 nm thickness is developed to replace the conventional TaN/Ta bilayer. The TaSx ultra-thin film is industry-friendly, BEOL-compatible, and can be directly prepared on dielectrics. Our results show superior barrier/liner properties of TaSx compared to the TaN/Ta bilayer. This single-stack material, serving as both a liner and a barrier, will enable continued scaling of interconnects beyond 5 nm node. Copyright © 2019, The Authors. All rights reserved.

关键词： Temperature

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Carbon Nanotubes: Colors of Single-Wall Carbon Nanotubes (Adv. Mater. 8/2021)

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Advanced materials 2021年第8期33卷

作者： Nan Wei Ying Tian Yongping Liao Natsumi Komatsu Weilu Gao Alina Lyuleeva-Husemann Qiang Zhang Aqeel Hussain Er-Xiong Ding Fengrui Yao Janne Halme Kaihui Liu Junichiro Kono Hua Jiang Esko I. Kauppinen Department of Applied Physics Aalto University School of Science Aalto 00076 Finland Department of Physics Dalian Maritime University Dalian 116026 China Department of Electrical and Computer Engineering Rice University Houston TX 77005 USA School of Physics Academy for Advanced Interdisciplinary Studies Collaborative Innovation Center of Quantum Matter Peking University Beijing 100871 China Department of Physics and Astronomy Rice University Houston TX 77005 USA Department of Materials Science and NanoEngineering Rice University Houston TX 77005 USA

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Reducing Student Resistance to Active Learning: Strategies for Instructors

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Journal of College science Teaching 2018年第5期47卷 80-91页

作者： Finelli, Cynthia J. Nguyen, Kevin DeMonbrun, Matthew Borrego, Maura Prince, Michael Husman, Jenefer Henderson, Charles Shekhar, Prateek Waters, Cynthia K. Engineering Education Research Program Department of Electrical Engineering and Computer Science School of Education University of Michigan Ann Arbor United States STEM education University of Texas at Austin United States School of Education University of Michigan Ann Arbor United States Center for Engineering Education Department of Mechanical Engineering STEM education University of Texas at Austin United States Chemical Engineering Department Bucknell University in Lewisburg PA United States University of Oregon in Eugene United States Mallinson Institute for Science Education Western Michigan University in Kalamazoo United States Department of Biomedical Engineering University of Michigan in Ann Arbor United States Department of Mechanical Engineering North Carolina A and T State University in Greensboro United States

In spite of considerable evidence of the effectiveness of active learning and other contemporary teaching methods, barriers to adoption of those methods, such as possible student resistance, continue to exist. This study addresses student resistance by analyzing data from 1,051 students who completed our Student Response to Instructional Practices (StRIP) instrument in 18 introductory engineering courses where active learning was implemented. Through descriptive statistics, correlation analyses, and hierarchical linear regression modeling, we demonstrate that students ‘perceptions of their instructors’ use of explanation and facilitation strategies can have a significant impact on student resistance. This study provides a more complete picture of the relative efficacy of these strategies to reduce resistance and confirms that students ‘perceptions of their instructors’ use of these strategies can influence both how students engage with active learning and how students evaluate the course and instructor. We provide evidencebased advice for both new and experienced instructors to reduce student resistance to active learning and other contemporary teaching methods. © 2018 National science Teaching Association.

关键词： Active learning Teaching methods Student attitudes Perceptions

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Tuning Insulator-Semimetal Transitions in 3D Topological Insulator thin Films by Intersurface Hybridization and In-Plane Magnetic Fields

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Physical Review Letters 2019年第20期123卷 207701-207701页

作者： Yang Xu Guodong Jiang Ireneusz Miotkowski Rudro R. Biswas Yong P. Chen Department of Physics and Astronomy Purdue University West Lafayette Indiana 47907 USA Birck Nanotechnology Center Purdue University West Lafayette Indiana 47907 USA Purdue Quantum Science and Engineering Institute Purdue University West Lafayette Indiana 47907 USA School of Electrical and Computer Engineering Purdue University West Lafayette Indiana 47907 USA WPI-AIMR International Research Center for Materials Sciences Tohoku University Sendai 980-8577 Japan

A pair of Dirac points (analogous to a vortex-antivortex pair) associated with opposite topological numbers (with ±π Berry phases) can be merged together through parameter tuning and annihilated to gap the Dirac spectrum, offering a canonical example of a topological phase transition. Here, we report transport studies on thin films of BiSbTeSe2, which is a 3D topological insulator that hosts spin-helical gapless (semimetallic) Dirac fermion surface states for sufficiently thick samples, with an observed resistivity close to h/4e2 at the charge neutral point. When the sample thickness is reduced to below ∼10 nm thick, we observe a transition from metallic to insulating behavior, consistent with the expectation that the Dirac cones from the top and bottom surfaces hybridize (analogous to a “merging” in the real space) to give a trivial gapped insulator. Furthermore, we observe that an in-plane magnetic field can drive the system again towards a metallic behavior, with a prominent negative magnetoresistance (up to ∼−95%) and a temperature-insensitive resistivity close to h/2e2 at the charge neutral point. The observation is consistent with a predicted effect of an in-plane magnetic field to reduce the hybridization gap (which, if small enough, may be smeared by disorder and give rise to a metallic behavior). A sufficiently strong magnetic field is predicted to restore and split again the Dirac points in the momentum space, inducing a distinct 2D topological semimetal phase with two single-fold Dirac cones of opposite spin-momentum windings.

关键词： electrical conductivity Electronic structure Magnetoresistance Magnetotransport Metal-insulator transition Surface states Topological insulators Topological phases of matter

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