In modern advanced packaging, redistribution layers (RDLs) are often used for signal transmission among chips, and vias are used for communication among different layers. Most existing RDL routers perform via planning...
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This paper proposes a power rail routing flow for advanced multi-layered printed circuit boards (PCBs) to optimize segment area and via usage while satisfying IR drop requirements. With increasing current/voltage dema...
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This paper proposes a mixed-size 3D analytical placement framework for face-to-face stacked integrated circuits fabricated with heterogeneous technology nodes and connected by hybrid bonding technology. The proposed f...
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Existing printed circuit board (PCB) placement often fails to address complex constraints (e.g., diverse wire widths and intricate spacing rules) arising from heterogeneous components in modern designs. Manual placeme...
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For wireless power transfer using linear-polarized transmitter (TX) and receiver antennas, the rotation and movement of receiving antenna cause received power variation. The received power pattern is proposed to descr...
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Parkinson’s disease (PD) is a neurodegenerative disorder that is caused by decrease in dopamine levels in the brain. There is currently no cure for PD;however, the progression of the disease can be brought under cont...
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This paper introduces a microfluidics platform embedded within a silicon chip implemented in CMOS technology. The platform utilizes a one-step wet etching method to create fluidic channels by selectively removing CMOS...
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Artificial neural networks (ANNs) are intricate mathematical models, drawing inspiration from the biological nervous system, and offering intelligence alongside nonparametric capabilities. The efficacy of ANNs heavily...
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Vibration analysis is crucial for predictive maintenance of bearing systems, aiming to reduce costs and prevent failures. This paper investigates signal processing techniques such as FFTs and Hilbert Transforms for fa...
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The heterogeneous vertically stacked 4T/2T SRAM is optimized using buried power rails and buried signal rails. The bitcell area of 3D SRAM can be reduced by 28% compared to 6T SRAM without transistor stacking. SRAM pe...
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