PURPOSE:We developed an optical image guidance system to manage patient's inter-fractional set-up errors by tracking external markers at the specific positions (e.g., nose tip) behind a full facemask. However, a p...
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PURPOSE:We developed an optical image guidance system to manage patient's inter-fractional set-up errors by tracking external markers at the specific positions (e.g., nose tip) behind a full facemask. However, a problem associated with the reproducibility of the marker positions during the entire course of treatments still remains. In order to remove this disadvantage, we applied the arbitrary-point-to-plane registration method to our existing system.
METHODS:Infra-red (IR) reflecting markers were attached on arbitrary positions of the head phantom's face and then the phantom was immobilized by a full face thermoplastic mask. 3D coordinates of the IR markers behind the full facemask were reconstructed by the calibrated stereo camera system using the direct linear transform (DLT) algorithm. In order to match arbitrarily attached markers with a planning CT image, rough positions of three markers were manually defined (rough registration) and then the coordinates of all markers were determined through the point-to-plane registration using the contractive projection point (CPP) algorithm (fine registration). In addition, the marker registration error in 6 DOF was calculated. In order to validate accuracy of the system, the phantom was intentionally moved according to 10 sets of known translation parameters.
RESULTS:A mean target registration error (TRE) determined by the experiments for arbitrarily attached markers was 1.24 ± 0.32 mm. The fine registration following the rough registration allowed fast and robust registrations.
CONCLUSIONS:The proposed solution for arbitrarily attached markers behind a full facemask enables us to avoid any daily errors in attaching the external markers at the specific positions. This work was supported in part by the SNU interdisciplinary project (2009-2010) and the SNU Brain Fusion project (2010-2011).
We present a systematic first-principles calculation on the atomistic structural variation for armchair-edge graphene nanoribbons (AGNRs) under a small planar uniaxial strain along armchair and zigzag directions, resp...
We present a systematic first-principles calculation on the atomistic structural variation for armchair-edge graphene nanoribbons (AGNRs) under a small planar uniaxial strain along armchair and zigzag directions, respectively. Interestingly, it is found that asymmetric AGNRs are more sensitive to the external strain with more types of carbon-carbon bonds and angles, while symmetric ones show less types of bonds and angles under the same strain. This difference is attributed to the symmetric property of AGNRs combining with the bond theory. Our findings may be useful in further understanding of GNRs under strain and in designing nanoelectromechanical devices based on GNRs.
This paper gives an overview of grid impact indicators that could be used to assess the impact of the energy exchange with a single intelligent building on the electricity grid. Seven indicators are given, the capacit...
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In this paper we present a comprehensive analysis of line tension-driven compositional interface fluctuations in planar lipid bilayer membranes. Our starting point is the advective Cahn-Hilliard equation for the local...
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In this paper we present a comprehensive analysis of line tension-driven compositional interface fluctuations in planar lipid bilayer membranes. Our starting point is the advective Cahn-Hilliard equation for the local lipid composition in symmetric membranes, which explicitly incorporates both advective and diffusive lipid transport processes, and which is coupled to the continuum hydrodynamic equations governing the flow behavior of the membrane and surrounding solvent with finite subphase thickness. In order to extract the interface dynamics from the continuum phase-field formalism, we first derive the appropriate sharp-interface limit equations. We then carry out a linear perturbation analysis for the relaxational dynamics of small-amplitude sinusoidal interface fluctuations to yield the general dispersion relation ωk as a function of perturbation wave number k. The resulting expression incorporates the effects of diffusive and advective lipid transport processes within the membrane, viscous or viscoelastic membrane properties, coupling between membrane and solvent, and inertial effects within the membrane and solvent. It is shown that previously considered scenarios naturally emerge as limiting cases of the general result. Furthermore, we discuss two additional scenarios amenable to analysis, one in which the inertia of the solvent is relevant, and another one in which the membrane displays significant viscoelastic properties. Finally, we numerically evaluate the general dispersion relation for three representative model membrane systems.
The microstructure evolution of Aluminum was investigated in different temperature range. Then the effect of different microstructure on high temperature deformation behavior was further studied. With the aid of scann...
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The microstructure evolution of Aluminum was investigated in different temperature range. Then the effect of different microstructure on high temperature deformation behavior was further studied. With the aid of scanning electronic microscopy (SEM) the fractography of Aluminum after super plastic deformation was analyzed. The results reveal that intergranular cavities with fine size & homogeneous distribution are beneficial to super plastic deformation. For characterization of material we take material like aluminum. We prepared test specimen having length 32cm, diameter *** test specimen was installed in the UTM(40T) & loaded in tension. Load-displacement diagram has been plotted for the entire specimen. Then another three specimen each of aluminum have been prepared & they have been kept in the muffle furnace for 30 minutes for a temperature of 200 ,250,300,400 deg. Centigrade. Then the above specimen was installed in UTM & loaded in tension. Then load- displacement diagram have been plotted for above specimen with different temperature .Results were compared with variation of temperature. Then above characterization will be utilized in the various engg. application.
Free-standing rectangular Al thin films have been fabricated using sputter deposition and standard micromachining techniques. mechanical properties and residual stresses of both asdeposited and annealed Al films were ...
Free-standing rectangular Al thin films have been fabricated using sputter deposition and standard micromachining techniques. mechanical properties and residual stresses of both asdeposited and annealed Al films were measured by bulge testing. The films were loaded into the plastic deformation regime, and then unloaded and reloaded several times. The pressure and deflection of the thin films were recorded and used to generate stress-strain curves. The planestrain elastic modulus, flow stress and plastic behavior of the Al thin films were used to characterize the mechanical response of these films. The Al films were measured to have a plane-strain modulus that is slightly lower than the literature values for a {111} textured film. The Von-Mises equivalent yield stress was measured to be higher in the annealed films but much more significant strain hardening was observed in the as-deposited films. A plastic hysteresis was observed on unloading and reloading stress-strain curves of the as-deposited Al films but not the annealed films.
Wire bonding is the most popular interconnection technique that has been used in microelectronics packaging due to its maturity and cost effectiveness. The technology advances in the era of miniaturization and multifu...
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ISBN:
(纸本)9781467301473
Wire bonding is the most popular interconnection technique that has been used in microelectronics packaging due to its maturity and cost effectiveness. The technology advances in the era of miniaturization and multifunction have urges the need for the smaller wire bond size to cope with the decrease of bond pad pitches. Ultimately, this will introduces al lot of technology challenges in the characterization and performance of wire bonding micromechanical properties. The conventional tests such as wire pull and ball shear tests provide inadequate information in respect of bonding and metallurgical response of the interconnection. This is because the evaluations of wire bond performance based on conventional tests are more into qualitative results or failure modes rather than detailed quantitative results. Furthermore, the results obtained through wire pull and ball shear tests will change and introduce a lot of variations as the ball bond diameter become smaller. In the present analysis, nanoindentation test was introduced in order to provide more adequate information about the quality of wire bond. Nanoindentation test provides the micromechanical properties in terms of hardness and reduced modulus value in the small length scale. This will facilitate the micromechanical properties measurement of the wire bond. In addition, the continuous measurement of stiffness provided from nanoindentation test realizes the qualitative results of materials such as deformation, strain hardening effect and creep behaviour. Wire bonding process was prepared using thermosonic wire bonding technology using 25 μm diameter of gold wire on the Aluminium bond pad. The nanoindentation test was conducted at various locations on the ball bond that has been cross-sectioned diagonally prior to the indentation process. To further investigate the micromechanical properties, the location of indentations was divided into two zones namely Zone 1 and Zone 2. Zone 1 is located at the area near to the
This paper reports on new experimental findings and conclusions regarding the pulsed-laser-induced melting-and-solidification behavior of PECVD a-Si films. The experimental findings reveal that, within the partial-mel...
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This paper reports on new experimental findings and conclusions regarding the pulsed-laser-induced melting-and-solidification behavior of PECVD a-Si films. The experimental findings reveal that, within the partial-melting regime, these a-Si films can melt and solidify in ways that are distinct from, and more complex than, those encountered in microcrystalline-cluster-rich LPCVD a-Si films. Specifically (1) spatially dispersed and temporally stochastic nucleation of crystalline solids occurring relatively effectively at the moving liquid-amorphous interface, (2) very defective crystal growth that leads to the formation of fine-grained Si proceeding, at least initially after the nucleation, at a sufficiently rapidly moving crystal solidification front, and (3) the propensity for local preferential remelting of the defective regions and grain boundaries (while the beam is still on) are identified as being some of the fundamental factors that can participate and affect how these PECVD films melt and solidify.
It has been a challenge to achieve high efficiency organic photovoltaics (OPV) that absorb long wavelength solar radiation without incurring unacceptable reductions in open circuit voltage (Voc) or charge separation e...
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Circular domains in phase-separated lipid vesicles with symmetric leaflet composition commonly exhibit three stable morphologies: flat, dimpled, and budded. However, stable dimples (i.e., partially budded domains) pre...
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Circular domains in phase-separated lipid vesicles with symmetric leaflet composition commonly exhibit three stable morphologies: flat, dimpled, and budded. However, stable dimples (i.e., partially budded domains) present a puzzle since simple elastic theories of domain shape predict that only flat and spherical budded domains are mechanically stable in the absence of spontaneous curvature. We argue that this inconsistency arises from the failure of the constant surface tension ensemble to properly account for the effect of entropic bending fluctuations. Formulating membrane elasticity within an entropic tension ensemble, wherein tension represents the free energy cost of extracting membrane area from thermal bending of the membrane, we calculate a morphological phase diagram that contains regions of mechanical stability for each of the flat, dimpled, and budded domain morphologies.
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