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检索条件"机构=Department of Microelectronics Circuits and Systems State Engineering"
377 条 记 录,以下是1-10 订阅
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Low Stress TSV Arrays for High-Density Interconnection
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engineering 2024年 第7期38卷 201-208页
作者: Binbin Jiao Jingping Qiao Shiqi Jia Ruiwen Liu Xueyong Wei Shichang Yun Yanmei Kong Yuxin Ye Xiangbin Du Lihang Yu Bo Cong Institute of Microelectronics Chinese Academy of SciencesBeijing 100000China School of Integrated Circuits University of Chinese Academy of SciencesBeijing 100000China State Key Laboratory for Manufacturing Systems Engineering Xi’an Jiaotong UniversityXi’an 710049China
In three-dimensional(3D)stacking,the thermal stress of through-silicon via(TSV)has a significant influence on chip performance and reliability,and this problem is exacerbated in high-density TSV *** this study,a novel... 详细信息
来源: 评论
CMN: a co-designed neural architecture search for efficient computing-in-memory-based mixture-of-experts
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Science China(Information Sciences) 2024年 第10期67卷 100-114页
作者: Shihao HAN Sishuo LIU Shucheng DU Mingzi LI Zijian YE Xiaoxin XU Yi LI Zhongrui WANG Dashan SHANG Department of Electrical and Electronic Engineering The University of Hong Kong ACCESS-AI Chip Center for Emerging Smart Systems InnoHK Centers Key Lab of Fabrication Technologies for Integrated Circuits Chinese Academy of Sciences Laboratory of Microelectronics Devices and Integrated Technology Institute of MicroelectronicsChinese Academy of Sciences University of Chinese Academy of Sciences School of Microelectronics Southern University of Science and Technology
Artificial intelligence(AI) has experienced substantial advancements recently, notably with the advent of large-scale language models(LLMs) employing mixture-of-experts(MoE) techniques, exhibiting human-like cognitive... 详细信息
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Modeling and Measurement of 3D Solenoid Inductor Based on Through-Silicon Vias
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Chinese Journal of Electronics 2023年 第2期32卷 365-374页
作者: YIN Xiangkun WANG Fengjuan ZHU Zhangming Vasilis F.Pavlidis LIU Xiaoxian LU Qijun LIU Yang YANG Yintang Shaanxi Key Lab.of Integrated Circuits and Systems School of Microelectronics Xidian University School of Automation and Information Engineering Xi'an University of Technique Department of Computer Science University of Manchester
Through-silicon via(TSV) provides vertical interconnectivity among the stacked dies in three-dimensional integrated circuits(3D ICs) and is a promising option to minimize 3D solenoid inductors for on-chip radio-freque... 详细信息
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Empirical Model and Experimental Validation of Meshed Ground Impact on RF Performance of Flexible Microstrip Lines for Bending Applications
IEEE Journal on Flexible Electronics
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IEEE Journal on Flexible Electronics 2024年 第8期3卷 374-382页
作者: Abdelatty, Mohamed Y. Alhendi, Mohammed Obeidat, Abdullah S. Umar, Ashraf Enakerakpo, Emuobosan Al-Haidari, Riadh Poliks, Mark D. State University of New York at Binghamton Department of Systems Science and Industrial Engineering The Center for Advanced Microelectronics Manufacturing BinghamtonNY13902 United States State University of New York at Binghamton The Center for Advanced Microelectronics Manufacturing BinghamtonNY13902 United States
Meshing of conventional printed circuit board (PCB) grounds refers to a process in which certain ground planes appear as copper lattices;regular openings are placed at regular intervals. The need for ground meshing fo... 详细信息
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Large circuit models: opportunities and challenges
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Science China(Information Sciences) 2024年 第10期67卷 25-66页
作者: Lei CHEN Yiqi CHEN Zhufei CHU Wenji FANG Tsung-Yi HO Ru HUANG Yu HUANG Sadaf KHAN Min LI Xingquan LI Yu LI Yun LIANG Jinwei LIU Yi LIU Yibo LIN Guojie LUO Hongyang PAN Zhengyuan SHI Guangyu SUN Dimitrios TSARAS Runsheng WANG Ziyi WANG Xinming WEI Zhiyao XIE Qiang XU Chenhao XUE Junchi YAN Jun YANG Bei YU Mingxuan YUAN Evangeline F.Y.YOUNG Xuan ZENG Haoyi ZHANG Zuodong ZHANG Yuxiang ZHAO Hui-Ling ZHEN Ziyang ZHENG Binwu ZHU Keren ZHU Sunan ZOU Huawei Noah’s Ark Lab School of Integrated Circuits Peking University Faculty of Electrical Engineering and Computer Science Ningbo University Department of Electronic and Computer Engineering Hong Kong University of Science and Technology Department of Computer Science and Engineering The Chinese University of Hong Kong School of Integrated Circuits Southeast University Huawei HiSilicon Peng Cheng Laboratory School of Computer Science Peking University School of Microelectronics State Key Laboratory of Integrated Chips and System Fudan University School of Artificial Intelligence Shanghai Jiao Tong University
Within the electronic design automation(EDA) domain, artificial intelligence(AI)-driven solutions have emerged as formidable tools, yet they typically augment rather than redefine existing methodologies. These solutio... 详细信息
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Physically Aware Synthesis Revisited: Guiding Technology Mapping with Primitive Logic Gate Placement  24
Physically Aware Synthesis Revisited: Guiding Technology Map...
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43rd International Conference on Computer-Aided Design, ICCAD 2024
作者: Pan, Hongyang Lan, Cunqing Liu, Yiting Wang, Zhiang Shang, Li Zeng, Xuan Yang, Fan Zhu, Keren State Key Lab of Integrated Circuits and Systems School of Microelectronics Fudan University China School of Computer Science Fudan University China Department of Electrical and Computer Engineering University of California San Diego United States
A typical VLSI design flow is divided into separated front-end logic synthesis and back-end physical design (PD) stages, which often require costly iterations between these stages to achieve design closure. Existing a... 详细信息
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Simulating the obstacle avoidance behavior day and night based on the visible-infrared MoS_(2)/Ge heterojunction field-effect phototransistor
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Nano Research 2023年 第8期16卷 11296-11302页
作者: Zhao Han Bo Wang Jie You Qiancui Zhang Yichi Zhang Tian Miao Ningning Zhang Dongdong Lin Zuimin Jiang Renxu Jia Jincheng Zhang Hui Guo Huiyong Hu Liming Wang Key Laboratory of Analog Integrated Circuits and Systems Ministry of EducationSchool of MicroelectronicsXidian UniversityXi’an 710071China Qian Xuesen Collaborative Research Center of Astrochemistry and Space Life Sciences Department of Microelectronic Science and EngineeringNingbo UniversityNingbo 315211China Department of Physics Fudan UniversityShanghai 200433China
The contradiction between the high number of visually handicapped people and the scarcity of guide dogs has stimulated the demand for electronic guide dogs(EGDs).Here,we demonstrate an EGD by leveraging piezoresistors... 详细信息
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InGaZnO-based photoelectric synaptic devices for neuromorphic computing
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Journal of Semiconductors 2024年 第9期45卷 42-47页
作者: Jieru Song Jialin Meng Tianyu Wang Changjin Wan Hao Zhu Qingqing Sun David Wei Zhang Lin Chen School of Microelectronics State Key Laboratory of Integrated Chips and SystemsFudan UniversityShanghai 200433China School of Integrated Circuits Shandong UniversityJinan 250100China National Integrated Circuit Innovation Center Shanghai 201203China School of Electronic Science and Engineering Nanjing UniversityNanjing 210023China Jiashan Fudan Institute Jiashan 314102China
Photoelectric synaptic devices could emulate synaptic behaviors utilizing photoelectric effects and offer promising prospects with their high-speed operation and low crosstalk. In this study, we introduced a novel InG... 详细信息
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APPLE-DSE: Asynchronous Parallel Pareto Set Learning for Microarchitecture Design Space Exploration
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IEEE Transactions on Computer-Aided Design of Integrated circuits and systems 2024年 第7期44卷 2765-2778页
作者: Zhao, Xuyang Gao, Tianning Wu, Zheng Bi, Zhaori Yan, Changhao Yang, Fan Wang, Sheng-Guo Zhou, Dian Zeng, Xuan University of Texas at Dallas Department of Electrical Engineering DallasTX75080 United States Fudan University School of Microelectronics State Key Laboratory of Integrated Chips and Systems Shanghai200433 China University of North Carolina at Charlotte College of Engineering CharlotteNC28223-0001 United States
The synthesizable and parameterizable RISC-V microarchitecture, combined with multi-objective optimization-based Design Space Exploration (DSE), facilitates agile adaptation to various microprocessor designs for custo... 详细信息
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A 74.8-88.8 GHz Wideband CMOS LNA Achieving +4.73 dBm OP1dB and 6.39 dB Minimum NF
A 74.8-88.8 GHz Wideband CMOS LNA Achieving +4.73 dBm OP1dB ...
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2023 IEEE/MTT-S International Microwave Symposium, IMS 2023
作者: Zou, Linfeng Zhao, Kangjie Fang, Zonghua Huang, Leilei Liu, Boxiao Shi, Chunqi Chen, Guangsheng Chen, Jinghong Zhang, Runxi East China Normal University Institute of Microelectronic Circuits and Systems China Shanghai Eastsoft Microelectronics Co. Ltd. China University of Houston Department of Electrical and Computer Engineering United States
This paper presents a 74.8-88.8 GHz low-noise amplifier (LNA) in a 55-nm CMOS technology. The LNA employs one common-gate (CG) stage, one common-source (CS) stage, and two cascode stages. A hybrid broadband interstage... 详细信息
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