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检索条件"机构=Department of Microelectronics Circuits and Systems State Engineering"
373 条 记 录,以下是21-30 订阅
排序:
Self-calibration method for input/output termination resistance variation elimination
Self-calibration method for input/output termination resista...
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2014 IEEE 34th International Scientific Conference on Electronics and Nanotechnology, ELNANO 2014
作者: Vazgen, Sh. Melikyan Ani, L. Aleksanyan Vache, A. Galstyan Ani, S. Harutyunyan Department of Microelectronics Circuits and Systems State Engineering University of Armenia Yerevan Armenia
A method of on-die resistance self-calibration for receiver and transmitter Input/Output devices, without external reference resistor is presented. Resistance mismatch elimination method, using reference clock and dc ... 详细信息
来源: 评论
A Novel Multiple Modes Resonant Sensor Featuring Blue Sideband Excitation
A Novel Multiple Modes Resonant Sensor Featuring Blue Sideba...
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IEEE International Conference on Micro Electro Mechanical systems
作者: Jiao Xu Zhuoyue Zheng Jingqian Xi Ziqian Zhang Huafeng Liu Pan Zhang Jianlin Chen Chen Wang Michael Kraft Yuan Wang R. P. Martins Pui-In Mak MOE Key Laboratory of Fundamental Physical Quantities Measurement PGMF and School of Physics Huazhong University of Science and Technology Wuhan P. R. China Institute of Microelectronics State Key Laboratory of Analog and Mixed-Signal VLSI University of Macau Macau China National Key Laboratory of Advanced Micro and Nano Manufacture Technology School of Integrated Circuits Peking University China School of Microelectronics Shanghai University China Department of Electrical Engineering-MNS KU Leuven Leuven Belgium
This paper reports a novel MEMS resonant structure functioning as a baseline resonant electrostatic force/temperature sensor, highlighting its substantial potential in sensing applications. The resonator, characterize... 详细信息
来源: 评论
Design of high-efficiency digital-control multi-topology step-down switched capacitor converter  35
Design of high-efficiency digital-control multi-topology ste...
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2015 35th IEEE International Conference on Electronics and Nanotechnology, ELNANO 2015
作者: Melikyan Vazgen, Sh. Galstyan Vache, A. Department of Microelectronics Circuits and Systems State Engineering University of Armenia Synopsys Armenia CJSC Yerevan Armenia
This paper presents a multi-topology step-down switched-capacitor (SC) converter with a novel digital control. The feedback control system performs digital control over operating frequency and topology of the converte... 详细信息
来源: 评论
MemMIMO: A Simulation Framework for Memristor-Based Massive MIMO Acceleration
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IEEE Transactions on Computer-Aided Design of Integrated circuits and systems 2025年
作者: Xu, Jiawei Zheng, Yi Stathis, Dimitrios Wang, Ruijia Shen, Ruisi Zheng, Li-Rong Zou, Zhuo Hemani, Ahmed University of Macau State-Key Laboratory of Analog and Mixed-Signal VLSI Institute of Microelectronics Faculty of Science and Technology ECE Department China Fudan University State Key Laboratory of Integrated Chips and Systems School of Information Science and Technology Shanghai China KTH Royal Institute of Technology School of Electrical Engineering and Computer Science Stockholm Sweden
Memristor-based crossbar architectures have proven highly effective for matrix vector multiplication (MVM) operations, making them a promising solution for accelerating the MVMs widely used in precoding algorithms for... 详细信息
来源: 评论
High PSRR and accuracy receiver active equalizer
High PSRR and accuracy receiver active equalizer
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2014 IEEE 34th International Scientific Conference on Electronics and Nanotechnology, ELNANO 2014
作者: Vazgen, Sh. Melikyan Arthur, S. Sahakyan Dingchyan Hayk, H. Nazeli, V. Melikyan Ani, L. Aleksanyan Armen, S. Sahakyan Vahe, S. Babayan Department of Microelectronics Circuits and Systems State Engineering University of Armenia Yerevan Armenia Department of Control and Informatics in Technical Systems State Engineering University of Armenia Yerevan Armenia
High accuracy equalization and high power supply rejection ratio equalizer in the receiver of a high-speed serial link presented. To validate the proposed architecture, conducted experiments, for examples, with variou... 详细信息
来源: 评论
Time-varying Algorithm for Swarm Robotics
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IEEE/CAA Journal of Automatica Sinica 2018年 第1期5卷 217-222页
作者: Ligang Hou Fangwen Fan Jingyan Fu Jinhui Wang Laboratory of VLSI and Systems College of Microelectronics Beijing University of Technology Department of Electrical and Computer Engineering North Dakota State University
Ever since the concept of swarm intelligence was brought out, a variety of control algorithms for swarm robotics has been put forward, and many of these algorithms are stable enough and efficient. Most of the research... 详细信息
来源: 评论
Silicon-on-Insulator 2×2 Symmetric Optical Switch Based on Total Internal Reflection
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Chinese Physics Letters 1997年 第2期14卷 106-108页
作者: ZHAO Ce-zhou LIU En-ke LI Guo-zheng LIU Yu-liang GUO Lin Microelectronics Institute Xidian UniversityXi'an 710071 Department of Electronic Engineering Xi'an Jiaotong UniversityXi'an 710049 Sichuan Institute of Solid-state Circuits Chongqing 630060
Based on the large cross-section single-mode rib waveguide condition,the total internal reflection and the free-carrier plasma dispersion effect,a silicon-on-insulator(SOI)2×2 symmetric optical waveguide switch w... 详细信息
来源: 评论
Integrated plasmonic ruler using terahertz multi-BIC metasurface for digital biosensing
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Moore and More 2025年 第1期2卷 1-13页
作者: Ren, Qun Jia, Sheng Li, Jingtong He, Liu Xu, Yan Huang, Hao Wang, Xiaoman Ooi, ZherYian Liang, Yongshan Zhang, Yaoyin Xu, Hang Zhang, Zhang You, Jianwei Sha, Wei E. I. Yao, Jianquan School of Electrical and Information Engineering Tianjin University Tianjin China Department of Ultrasound Diagnosis and Treatment Tianjin Medical University Cancer Institute and Hospital Tianjin China Key Laboratory of Opto-Electronics Information Technology Ministry of Education School of Precision Instruments and Opto-Electronics Engineering Tianjin University Tianjin China Tianjin Key Laboratory of Imaging and Sensing Microelectronic Technology School of Microelectronics Tianjin University Tianjin China School of Electronic and Information Engineering Changshu Institute of Technology Jiangsu China State Key Laboratory of Millimeter Waves School of Information Science and Engineering Southeast University Nanjing China Key Laboratory of Micro-Nano Electronic Devices and Smart Systems of Zhejiang Province College of Information Science and Electronic Engineering Zhejiang University Hangzhou China
In recent years, continuous bound states in the continuum (BIC) have gained significant attention for their practical applications in optics, chip technology, and modern communication. Traditional approaches to realiz...
来源: 评论
Millimeter-Wave Co-Polarized Self-Decoupled Substrate-Integrated Dielectric Resonator Antennas for In-Band Full-Duplex and MIMO systems
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IEEE Transactions on Antennas and Propagation 2025年
作者: Liu, Zheng Hu, Peng Fei Pan, Yong Mei Leung, Kwok Wa Zheng, Shao Yong Sun Yat-sen University School of Electronics and Information Technology School of Microelectronics Guangdong Provincial Key Laboratory of Optoelectronic Information Processing Chips and Systems Guangzhou510006 China South China University of Technology School of Electronic and Information Engineering Guangzhou510630 China Sun Yat-sen University School of Electronics and Information Technology Guangzhou510006 China City University of Hong Kong State Key Laboratory of Terahertz and Millimeter Waves Department of Electrical Engineering Kowloon Hong Kong CityU Shenzhen Research Institute Information and Communication Technology Centre Shenzhen518057 China
Millimeter-wave (mm-wave) co-polarized self-decoupled substrate-integrated dielectric resonator antennas (SIDRA) are investigated. A dual-port design is first studied which employs the loading effect of the feeding pr... 详细信息
来源: 评论
Low Stress TSV Arrays for High-Density Interconnection
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engineering 2024年 第7期38卷 201-208页
作者: Binbin Jiao Jingping Qiao Shiqi Jia Ruiwen Liu Xueyong Wei Shichang Yun Yanmei Kong Yuxin Ye Xiangbin Du Lihang Yu Bo Cong Institute of Microelectronics Chinese Academy of SciencesBeijing 100000China School of Integrated Circuits University of Chinese Academy of SciencesBeijing 100000China State Key Laboratory for Manufacturing Systems Engineering Xi’an Jiaotong UniversityXi’an 710049China
In three-dimensional(3D)stacking,the thermal stress of through-silicon via(TSV)has a significant influence on chip performance and reliability,and this problem is exacerbated in high-density TSV *** this study,a novel... 详细信息
来源: 评论