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Neural Network Examination on Seismic design Values in the Building Code of Taiwan

Neural Network Examination on Seismic Design Values in the B...

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ACS/IEEE International Conference on Computer systems and Applications

作者： Tienfuan Kerh J.S. Lai D. Gunaratnam R. Saunders Department of Civil Engineering National Pingtung University of Science and Technology Ping Tung Taiwan Key Centre of Design Computing and Cognition Faculty of Architecture University of Sydney NSW Australia

The purpose of this study is to check the suitability of seismic design values in the current Taiwan building code by using the neural network (NN) method. The neural network model input parameters are magnitude, epicenter distance,, and focal depth for each of the records in the checking stations, and the output is peak ground acceleration (PGA). The neural network model estimations showed that for 5 out of the 24 locations considered in the region, the design value recommended in the building code would be exceeded. Additionally, a curve fitting model, PGA = 8.96 (D f ) is developed for the relationship between horizontal PGA and focal distance (D f ), and reflecting the essential characteristics of strong motion in the region investigated. The present neural network model and the mathematical equation can provide useful information for both the relevant government agencies and practicing engineering designers.

关键词： Neural networks Buildings Electronics packaging Neurons Electronic mail Acceleration Equations Earthquake engineering Code standards Civil engineering

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Experimental investigation of a passive deployable/stowable radiator

Experimental investigation of a passive deployable/stowable ...

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45th AIAA Aerospace sciences Meeting 2007

作者： Nagano, Hosei Ohnishi, Akira Higuchi, Ken Oikawa, Yu Watanabe, Kazuki Nagasaka, Yuji Japan Aerospace Exploration Agency Institute of Space and Astronautical Science Sagamihara Kanagawa 229-8510 Japan WEL Research Ichikawa Chiba 272-0021 Japan Keio University Yokohama Kanagawa 223-8522 Japan Department of Space Structure and Materials Engineering 3-1-1 Yoshinodai Japan AIAA United States Space Expulsion Engineering Department 3-1-1 Yoshinodai Space Technology Development Division 3-8-18-401 Motoyawata 3-8-18-401 Motoyawata Department of System Design Engineering 3-14-1 Hiyoshi Japan

ISBN: (纸本)1563478900

A passive delployable/stowable radiator named reversible thermal panel (RTP) has been developed for thermal control of interplanetary spacecrafts. The RTP can autonomously adapt to a wide variety of thermal environments with no electrical power. An RTF prototype model (PM) was fabricated and extensive test programs including fin deployment/stowing tests, thermal performance tests, and vibration tests have been executed to validate that the RTP-PM can meet all the qualification requirements. Deployment/stowing tests have demonstrated repeatable RTF fins deploy/stow from 0° to 140° over the temperature range from -30°C to +30°C. Thermal performance tests including thermal balance tests and power cycling tests have shown RTF's autonomous thermal control for changes in thermal conditions. The RTF has also been subjected to qualification-level vibration loads and passed with no significant issues.

关键词： Radiators

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A diagnostics design decision model for products under warranty

A diagnostics design decision model for products under warra...

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Annual Symposium on Reliability and Maintainability (RAMS)

作者： Zhi-jie Liu Hong-zhong Huang Wei Chen Bo Yang School of Mechanical Engineering Dalian University of Technology Dalian Liaoning China School of Mechanical and Electronics Engineering University of Electronic Science and Technology Chengdu Sichuan China Department of Mechanical Engineering Faculty Fellow Institute for Design Engineering & Applications (IDEA) Northwestern University Evanston IL USA

Warranty obligations in product service involve additional costs to the manufacturers. Building diagnostic features into a product can reduce the warranty costs because of; 1) fewer visits needed by warranty service representatives (through self-guided user repairs for simple problems) and 2) shorter service times (via reduced diagnostic time) for each failure. However, this approach increases the cost of the product and is worthwhile only if the reduction in the expected warranty cost is more than the additional costs incurred. This paper develops models to evaluate diagnostic design decisions for products under warranty from the manufacturer's point of view. The roles and influence of the key parameters and decision variables based upon the consideration of uncertainty are explored. Numerical examples are given to illustrate the proposed models.

关键词： Warranties Costs Product design Uncertainty Virtual manufacturing Buildings Pulp manufacturing Manufacturing industries Reliability engineering design engineering

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Basic Structure and Prototype of Novel Linear Actuator with Electro-Rheological Gel

Basic Structure and Prototype of Novel Linear Actuator with ...

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IEEE International Conference on Mechatronics and Automation

作者： Ken'ichi Koyanagi Yasuhiro Kakinuma Hidenobu Anzai Koji Sakurai Tomoya Yamaguchi Toru Oshima Noboru Momose Takayuki Matsuno Department of Intelligent Systems Design Engineering Toyama Prefectural University Imizu Toyama Japan Faculty of Science and Technology Keio University Yokohama Japan Fujikura Kasei Company Limited Tochigi Japan

Nowadays, robots manipulated by human are aggressively researched and developed. Such robots need large generative force, high speed response, good controllability, high safety, low friction, backdriveability and so on. We have put emphasis on the backdriveability and created a novel prototype linear actuator with new structure applying an ER (electro-rheological) gel, a recent functional material. It is an all-purpose actuator satisfying characteristics for human-coexistence welfare robot.

关键词： Prototypes Hydraulic actuators Orbital robotics Erbium Rehabilitation robotics Humans Safety Robots Virtual reality Surgery

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Particle swarm intelligence robot vision for multiple human tracking of a partner robot

Particle swarm intelligence robot vision for multiple human ...

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SICE Annual Conference

作者： Indra Adji Sulistijono Naoyuki Kubota Department of Mechatronics Electronics Engineering Polytechnic Institute of Surabaya Kampus ITS Sukolilo Surabaya Indonesia Department of Mechanical Engineering Graduate School of Engineering Tokyo Metropolitan University Hino Tokyo Japan SORST Japan Science and Technology Corporation Japan Department of System Design Tokyo Metropolitan University Hino Tokyo Japan

ISBN: (纸本)4907764278

This paper discusses the advantage and disadvantage of particle swarm intelligence robot vision for multiple human heads tracking. The particle swarm intelligence robot vision combines the technologies of the swarm intelligence computation and robot vision. Particle swarm optimization can perform the multiple human heads tracking well for feasible solution in a dynamic movement. This paper shows the performance. Finally, the proposed method is applied to a partner robot, and we discuss the effectiveness of the multiple human heads tracking in the natural communication with humans.

关键词： Intelligent robots Particle swarm optimization Robot vision systems Humans Particle tracking Head Face detection Computational efficiency Robotics and automation Visual perception

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A comparison study of SAC405 and SAC387 lead-free solder ball alloy characteristic and solder joint system on Ni/Au finish

A comparison study of SAC405 and SAC387 lead-free solder bal...

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40th International Symposium on Microelectronics, IMAPS 2007

作者： Leng, Eu Poh Ding, Min Ahmad, Ibrahim Jalar, Azman Freescale Semiconductor Malaysia Sdn. Bhd. No. 2 Jalan SS 8/2 Free Indust. Zone Sungei Way Petaling Jaya 47300 Malaysia Freescale Semiconductor Inc. Corporate Headquarters 6501 William Cannon Drive West Atx TX 78735 United States Faculty of Engineering Department of Electrical Electronics and System Malaysia Faculty of Science and Technology National University of Malaysia 43600 Bangi Selangor Malaysia

ISBN: (纸本)0930815823

In this study, two Sn-Ag-Cu alloys, namely SAC405 & SAC387 were compared in terms of the following characteristics: solder ball surface morphology, solder ball surface cleanliness through Auger elemental depth profile analysis, ball shear strength (at time zero, after test, after multiple reflow and after high temperature storage), IMC morphology and thickness, solderability test and missing ball after functional testing. In terms of surface morphology, SAC405 was found to have coarser dendrites on the ball surface that form notches and channels which may trap contamination and prevent the dispense of flux. The finer dendrites on the SAC387 ball surface prevents contamination and flux entrapment, thus prevents voids in the IMC and provides better mechanical strength. Auger elemental depth profile analysis showed higher carbon and oxide level on SAC405 as well as the presence of phosphorus. This may affect IMC formation and affect solder joint performance. With SAC387, lower carbon and oxide level and no phosphorus are found on the surface of the ball. The sharp cliff in the profile of SAC387 suggests that the surface of the solder ball was smoother. In term of ball shear tests, SAC387 had shown significantly higher ball shear strength and Cpk in all the read points. In terms of IMC morphology and thickness, SAC387 has lower IMC growth than SAC405 in most of the read points. In terms of missing ball after functional testing, characterization result with ∼130units test sample size showed that SAC405 has 0.78% missing ball yield loss at final test whereas SAC387 has zero yield loss. In conclusion, SAC387 solder alloy provides more reliable lead-free solder joint than SAC405.

关键词： Morphology

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SPECTS O-CDMA field trials using subpicosecond pulses and integrated encoders/decoders across 80.8-km and 150-km links

SPECTS O-CDMA field trials using subpicosecond pulses and in...

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International Conference on Photonics in Switching (PS)

作者： N.K. Fontaine C. Yang R.P. Scott V.J. Hernandez F. Soares R. Broeke K. Perry G. Nowak W. Cong K. Okamoto B.H. Kolner Z. Ding J.P. Heritage S.J.B. Yoo Department of Electrical and Computer Engineering University of California Davis CA USA Department of Applied Science University of California Davis CA USA Key Laboratory for Micro/Nano Technology and System of Liao-ning ProvinceAerospace Systems Design Laboratory Massachusetts Institute of Technology Lexington MA USA

We compare two field demonstrations of SPECTS-OCDMA on an 80.8-km link and 150-km link using integrated, polarization independent arrayed-waveguide grating (AWG)-based encoders/decoders, an ultra-stable optical freque... 详细信息

关键词： Decoding Fiber nonlinear optics Nonlinear optics Optical receivers Frequency Optical pulses Optical pulse shaping Optical modulation Laboratories Polarization mode dispersion

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The Bluetooth Body Centre Network Channel Character For Wearable Computer

The Bluetooth Body Centre Network Channel Character For Wear...

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International Symposium on Microwave, Antenna, Propagation and EMC Technologies for Wireless Communications (MAPE)

作者： Chen Jin-rong Song Jun-de Han Yu-nan Zhang Yong The School of Electronic Engineering Beijing University of Posts and Telecommunications Beijing China The First System Design Department of the First Research Academy Aerospace Science and Technology Group Beijing China The School of Telecommunication and Network Technology Beijing University of Posts and Telecommunications Beijing China

The narrow band body centre network based on Bluetooth technology has been constructed by integrated planar inverted-F antenna and the communication channel character has been studied by measurement for wearable computer application. For Bluetooth system, the path loss of different antenna positions on body for measurement can range from -35 dB to -70 dB. If the two antenna located on the arms and moved the two arms, the path loss can change from -40.2 dB to -64.8 dB. The deep breath can affect the path loss within 5 dB and metal ornament such as metal ring can affect about 11.8 dB. The specific absorption rate distribution can also be studied by finite-difference time-domain (FDTD) method.

关键词： Bluetooth Wearable computers Antenna measurements Arm Finite difference methods Time domain analysis Narrowband Communication channels Application software Loss measurement

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Effect of sintering process on fabrication of porous Si3N 4/SiC composites

Effect of sintering process on fabrication of porous Si3N 4/...

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Asian Pacific Conference for Fracture and Strength (APCFS'06)

作者： Cong, Hoa Vu Quoc, Thai Phan Dowon, Seo Jae, Kyoo Lim Department of Engineering Mechanics Faculty of Applied Science Hochiminh City University of Technology 268 Ly Thuong Kiet Street Hochiminh City Viet Nam Fracture and Reliability Research Institute Tohoku University Sendai 980-8579 Japan Dept. of Mechanical Design Chonbuk Nat'l Univ. Duckjin 1-664-14 Jeonju JB561-756 Korea Republic of

Porous SiC/Si3N4 composites were fabricated by reaction between Si3N4 and C powder in 0.5 MPa nitrogen atmosphere at 1700°C, 1800°C and 1900°C for 0.5h, 1h and 2h, respectively. The characteristics of in situ porous Si3N 4/SiC composites were further investigated by X-ray diffraction (XRD) and scanning electronic microscopy (SEM). Results show that the SiC particles are very fine. And the transformation from α-Si3N4 to β-Si3N4 is obvious at 1800°C for 2h and at 1900°C. Otherwise, at 1700°C, the formation of rod-like β-Si 3N4 is inhibited. The compressive test was conducted at a cross-head speed of 0.5 mm/min to get the basic mechanical performance of the porous ceramics. The highest value of strength of these composites was obtained when sintered at 1800°C for 1h.

关键词： Composite materials

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A study of Ni thickness effect on mechanical strength of Pb-free BGA spheres on selectively plated Ni/Au finish

A study of Ni thickness effect on mechanical strength of Pb-...

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40th International Symposium on Microelectronics, IMAPS 2007

作者： Leng, Eu Poh Ding, Min Rayos, Joah Ahmad, Ibrahim Jalar, Azman Qiang, Cui Cheng Freescale Semiconductor Malaysia Sdn. Bhd. No. 2 Jalan SS 8/2 Free Indust. Zone Sungei Way Petaling Jaya 47300 Malaysia Freescale Semiconductor Inc. Corporate Headquarters 6501 William Cannon Drive West Atx TX 78735 United States Faculty of Engineering Department of Electrical Electronics and System United States Faculty of Science and Technology National University of Malaysia 43600 Bangi Selangor Malaysia Compass Technology Co. Ltd. Hong Kong #24E City One Shatin New Territories Hong Kong

ISBN: (纸本)0930815823

As the world is changing to Pb-free solder per EU ROHS Directive, the higher reflow temperature requirement for Pb-free solder has demanded better substrate metal trace to solder mask adhesion to prevent delamination problem. Hence, selective Ni/Au plating process becomes more appealing in the fabrication of substrates to support Pb-free Semiconductor BGA product packaging. However, the set back of selective plating substrate is weaker Pb-free solder joint that leads to higher brittle fracture rate induced by shocking/knocking activities during assembly, test and shipping. In this work, Tape BGA (TBGA) substrates with 3 different Ni thicknesses (range from 2 to 10um) were built and attached with Sn3.8Ag0.7Cu Pb-free spheres. Mechanical tests were performed on 2 different levels to examine the strength of the solder joint. On solder joint level, cold ball pull (CBP) and ball shear were used to evaluate the adhesion strength of individual solder joint at Time Zero, after 6 times multiple reflow, and after 168 hours of high temperature storage. The brittle fracture failure rate from this test is believed to have correlation to the missing ball rate in the field. On package level, the tray drop test and packing drop test were conducted to provide a close resemblance to real handling and shipping conditions. Cross-sectioning and SEM investigation were carried out to obtain information on the morphology of intermetallic layer as well as solder mask opening profile. Based on this study, it is determined that the thickness of the Ni needs to be over a certain value (∼5.5um for Tape BGA) to achieve optimum mechanical strength. By increasing the Ni thickness, the mechanical strength of the thicker Ni solder joint is expected to increase by at least 15% as shown in CBP result, with 3 to 4 times higher resistance against brittle fracture during handling and shipping as demonstrated by tray and packing drop-till-fail test result using center pedestal support trays.

关键词： Substrates

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