Modern high-performance, large-scale simulations require significant computational power, memory, and storage, making heterogeneous architectures an attractive option. The presence of accelerators in heterogeneous arc...
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In this paper, we propose a framework to support continuous and adaptive multi-factor authentication. Our proposed solution is based on leveraging the users' context to estimate the risk to the remote login and to...
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Service-oriented architecture (SOA) serves as a foundational technology for complex IT systems, such as e-commerce platforms, banking solutions, public-sector applications, and gaming systems. As these systems become ...
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A positive/negative association rule describes the relationship between co-occurrence and anti-co-occurrence of events (item sets) in the data. The number of association rules extracted from the data, especially negat...
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While the quantum Internet leverages quantum mechanics to achieve unprecedented security against security threats such as eavesdropping, challeng.s remain, particularly in trust establishment. Traditional methods usin...
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We propose Greedy Topology-Aware Quantum Circuit Partitioning (GTQCP), a novel quantum gate circuit partitioning method which partitions circuits by applying a greedy heuristic to the qubit dependency graph of the cir...
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As mobile robots navigate through a warehouse collecting items from storage locations and transporting them to designated drop-off points, they consume energy. In this paper, we introduce an intelligent Robot Load Sha...
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This paper uses Monte-Carlo simulations to compare paralleling of 25 mΩ SiC MOSFET chips from two different voltage classes. Temperature dependent LTSpice simulations were performed with 5 TO-247-3 devices in paralle...
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ISBN:
(数字)9798331533601
ISBN:
(纸本)9798331533618
This paper uses Monte-Carlo simulations to compare paralleling of 25 mΩ SiC MOSFET chips from two different voltage classes. Temperature dependent LTSpice simulations were performed with 5 TO-247-3 devices in parallel, rated for 650 V and 1200 V. Simulations were performed both with and without thermal coupling. We estimated the required nominal RDS(on) tolerance to achieve a mean junction temperature of 150°C ±7.5°C, with a maximum chip temperature imbalance of 10°C. We found a non-negligible difference between voltage classes, with the 1200 V devices having a 30%–50% increase (depending on configuration) in successful combinations over the 650 V devices without thermal-coupling, and a 12%–30% increase in successful combinations with thermal-coupling.
The Domain Name System (DNS) is the most important building block of the Internet. Websites, file transfer applications, and e-mail services use the DNS service. Therefore, these services can rarely be blocked by fire...
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Blind and Visually Impaired (BVI) persons depend on the assistive systems. An intelligent assistive system may provide situational awareness and support in the age of machine learning and computer vision with the help...
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