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作者： Maros, B.M. Kaulics, N. Lenkey, B.Gy. Aratá, P. University of Miskolc Dept. of Mechanical Engineering H-3515 Miskolc-Egyetemváros Hungary HAS UM Mechanical Engineering Research Team H-3515 Miskolc-Egyetemváros Hungary BAY Zoltán Foundation for Applied Research Institute for Logistics and Production Systems Iglái u. 2 H-3519 Miskolctapolca Hungary Research Institute for Technical Physics and Materials Science Hungarian Academy of Sciences RITPMS-HAS Pf. 49 H-1525 Budapest Hungary

The current paper give a brief overview over the principle and information content of the instrumented impact test completed by electro-emission measurement. Introducing over experiences taken by applying these test on a high-tech SiAlON ceramic a novel method for the determination of the dynamic fracture toughness of silicon nitride ceramics is suggested.

关键词： Ceramic materials

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The Future of the Refractory Industry,with a Chinese Perspective

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China's Refractories 2005年第4期14卷 3-7页

作者： Michel Rigaud ZHOU Ningsheng YE Fangbao FIRE Ecole Polytechnique Mechanical Engineering Dept. University of Montreal Montreal Canada High Temperature Materials Institute Henan University of Science and Technology China High Temperature Ceramics Institute Zhengzhou University China

Globalization is a reality resulting in many changes in the refractory industry. In this paper some of the threats and opportunities, which are influencing the future prosperity of the refractory industry on a worldwide basis, are being evoked. Some key technical and management issues are underlined, in terms of adjusting the productivity-quality-cost to the customers requirements ; producing unshapes versus shapes; innovations supported by research; international profile for the import-export game; training and education. Consequences for China, who does play a dominant role due to the size of its internal market （ customers demand） and the magnitude of its production capability （including raw materials availability）, are being drawn.

关键词： Review Refractories industry Technology Management Market

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Processing and Fabrication of Advanced materials XIV With Frontiers in materials science 2005: Innovative materials: Preface

Processing and Fabrication of Advanced Materials XIV With Fr...

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Processing and Fabrication of Advanced materials XIV With Frontiers in materials science 2005: Innovative materials and Manufacturing Techiques - Proceedings of a Symposium 2005年 xi-xiii页

作者： Srivatsan, T.S. Varin, Robert A. Abbaschian, Reza Viswanathan, Srinath Division of Materials Science and Engineering Department of Mechanical Engineering University of Akron Akron OH 44325-3903 United States Department of Mechanical Engineering University of Waterloo Waterloo Ont. N2L 3G1 Canada College of Engineering University of California Riverside CA 92521 United States University of Alabama Dept. of Metallurgical and Materials Engineering Tuscaloosa AL 35487-0202 United States

No abstract available

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Nanocomposites for carbon fiber-reinforced polymer matrix composites

Nanocomposites for carbon fiber-reinforced polymer matrix co...

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46th AIAA/ASME/ASCE/AHS/ASC Structures, Structural Dynamics and materials Conference

作者： Koo, Joseph H. Pilato, Louis A. Wissler, Gerry Lee, Andre Weispfenning, Jon T. Abusafieh, Abdel Luo, Zhiping University of Texas at Austin Austin TX 78712-0292 KAI Inc. Austin TX 78739 Michigan State University East Lansing MI 48824-1226 Cytec Engineered Materials Winona MN 55987 Texas A and M University College Station TX 77843-2257 Solid Freeform Fabrication Consortium Mechanical Engineering Dept. University Station C2200 Austin TX 78712-0292 KAI Inc. 6402 Needham Lane Austin TX 78739 Dept. of Chemical Engineering and Materials Science East Lansing MI 48824-1226 Ablative and C/C 501 West Third St. Winona MN 55987 1440 N. Kraemer Blvd. Anaheim CA 92806 Microscopy and Imaging Center BSBW 119 College Station TX 77843-2257

A high temperature damage tolerant epoxy resin system was modified with three types of nanoparticles: chemically modified montmorillonite (MMT) organodays, surface treated nanosilica, and surface modified carbon nanofibers (CNF) to create mew types of epoxy nanocomposites. Wide angle X-ray diffraction (WAXD) and transmission electron microscopy (TEM) were used to determine the degree of dispersion. Dynamic mechanical thermal analysis (DMTA) was used to determine the Tg and complex modulus of the polymer nanocomposites. The TEM analyses indicated that the MMT clay, nanosilica, and CNF dispersed very well in the epoxy resin system. Evidence is presented that a nanophase is formed when nanoparticles such as surface treated clay, surface treated nanosilica, or carbon nanofibers are introduced into the epoxy resin. Higher Tg and complex modulus values from DMTA for the nanomodified materials are presented as evidence for nanophase presence in the epoxy resin system as compared to lower Tg and complex modulus for the epoxy resin control The DMTA data of the neat epoxy nanosilka nanocomposite (2% Aerosil® R202) show the highest Tg (258°C) and the highest complex modulus (964 MPa). Five epoxy nanocomposites and a control were selected to produce prepregs using AS4-6K fabric, followed by fabrication into composite panels. The short beam shear values of all epoxy nanocomposites were slightly lower than the baseline with 3% Aerosil® R202 and 2% PR-19-PS-Ox CNF higher than the baseline. The flexural strength of all the epoxy nanocomposites were slightly lower than the baseline with the 2% Cloisite® 10A and 3% Aerosil® R202 materials higher than the baseline. Flatwise tension strength values of all the eposy nanocomposites were slightly lower than the baseline with 2% PR-19-PS-Ox and 2% Aerosil® R202 samples higher than the baseline material. The G1c and G2c values of all the epoxy nanocomposites were below the baseline with the least knockdown for 2% Aerosil®

关键词： Fiber reinforced plastics

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Effect of Electromigration on mechanical Behavior of Solder Joints

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MRS Online Proceedings Library 2005年第1期863卷 B10.2-1-B10.2-5页

作者： Fei Ren Jae-Woong Nah Hua Gan Jong-Ook Suh King-Ning Tu Bingshou Xiong Luhua Xu John Pang UCLA Dept. of Materials Science and Engineering Los Angeles USA Dept. of Mechanical and Production Engineering Nanyang Technological University Singapore

Electromigration in solder joints causes a void formation between intermetallic compounds (IMC) and solder at the cathode. The effect of electromigration in mechanical test of Cu wires joined by solder was performed. The current density of electromigration was 1∼5×103 A/cm2. The working temperature was 100∼150°C. Tensile stress and shear stress were applied either before or after electromigration. The tensile strain rate was 3 μm/min. We observed that, without electromigration, tensile stress caused a ductile break at the middle of solders because the solder was softer. On the other hand, if combined with electromigration, a brittle failure always occurred at the cathodes interface during tensile test. The ultimate tensile strength decreased with longer electromigration time or higher current density. In shear test, the daisy chain of solders failed alternatively at the cathodes after electromigration.

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High and low frequency actuation comparison for a weapons bay cavity

High and low frequency actuation comparison for a weapons ba...

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43rd AIAA Aerospace sciences Meeting and Exhibit

作者： Schmit, Ryan F. Schwartz, David R. Kibens, Valdis Raman, Ganesh Ross, John A. Air Force Research Laboratory Wright-Patterson AFB 45433 United States Boeing Company Phantom Works Saint Louis MO 63166 United States Illinois Institute of Technology Chicago IL 60616 United States QinetiQ Bedford MK44 2FQ United Kingdom AFRL/VAAI 2130 Eighth St United States Flight Science Technology P.O. Box 516 United Kingdom Dept. of Mechanical Materials and Aerospace Engineering 10 West 32nd St

This paper presents the results of experiments conducted in February 2004 to compare the effectiveness of high- and low- frequency flow control methods applied to a generic weapons bay cavity. This is the first test meant to directly compare the merits of low-frequency forcing with those of high-frequency. The test was conducted using the HIFEX generic weapons bay model at Mach 0.85 and 1.19. Three basic high-frequency actuators were used;powered resonance tubes (PRT), a rod in crossflow, and a similar rod wrapped in wire to alter its shedding characteristics. These actuators were compared with the low-frequency device used in testing: a rotary pulse-blowing actuator along with a conventional spoiler and a baseline cavity with no flow control device. Current results show the PRT is the best at reducing the peak tones and overall sound pressure levels when comparing to all other actuators tested.

关键词： Flow control

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Characterization of copper-to-silicon diffusion for the application of 3D packaging with through silicon vias

Characterization of copper-to-silicon diffusion for the appl...

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International Conference on (ICEPT) Electronic Packaging Technology

作者： S.X. Zhang S.W.R. Lee L.T. Weng S. So Department of Mechanical Engineering Hong Kong University of Science and Technology Kowloon Hong Kong China Hong Kong University of Science and Technology Kowloon HK Dept. of Mech. Eng. Hong Kong Univ. of Sci. & Technol. China Materials Characterization and Preparation Facility Hong Kong University of Science and Technology Kowloon Hong Kong China Microelectronics Fabrication Facility Hong Kong University of Science and Technology Kowloon Hong Kong China

Through silicon vias (TSVs) are one of the major enabling technologies for three-dimensional packaging (3DP). TSVs are usually plugged with plated copper for interconnection. However, the introduction of massive copper in the chip may cause device failure due to the fast diffusion of copper into silicon. In order to reduce this risk, a diffusion barrier layer should be deposited on the sidewall of TSVs between the plated copper and the bulk silicon. In addition, an insulation layer should be deposited as well to prevent short circuit. In this paper, the phenomenon of copper-to-silicon diffusion is characterized. The selected interfacial multilayer structure is Cu/Ti/SiO/sub 2/. Although the ideal specimens should be TSVs with interfacial multilayer deposited on the side wall, it is rather difficult to perform surface analysis on a very small area. Therefore, planar analysis with interfacial multilayer deposited on the top surface of a silicon wafer is performed instead. For comparison purpose, additional cases without insulation layer and/or barrier layer are also investigated. A set of experiments is designed to study the effects of surface roughness and layer thickness. In addition, some samples are subject to high temperature storage for the study of thermal annealing effect.

关键词： Packaging Silicon Copper Nonhomogeneous media Insulation Performance analysis Rough surfaces Surface roughness Integrated circuit interconnections Temperature

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Integrated Ferroelectrics: Guest Editorial

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Integrated Ferroelectrics 2005年 71卷 vii-xi页

作者： Cole, M.W. Alpay, S.P. Cobas, L. Fuentes Mossi, K. U.S. Army Research Laboratory WMRD Rodman Materials Research Laboratory Aberdeen Proving Ground MD 21005 United States Dept. of Matls. Science and Eng. Inst. of Matls. Science University of Connecticut Storrs CT 06269 United States Complejo Industrial Chihuahua M. Cervantes 120 Chihuahua 31109 Mexico Virginia Commonwealth University Mechanical Engineering Richmond VA 23284 United States

No abstract available

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Modelling of two-phase diversion cross-flow between subchannels based on a two-fluid model

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Multiphase science and Technology 2004年第4期16卷 309-334页

作者： Sadatomi, M. Kawahara, A. Kano, K. MacHidori, S. Dept. of Mechanical Engineering and Materials Science Kumamoto University Kumamoto 860-8555 Japan

Following the previous studies, single-and gas-liquid twophase diversion cross-flows between subchannels have been studied. In the previous experiment, a vertical channel consisting of two circular subchannels of 16 mm i.d. was used as the test channel, while water and air at atmospheric pressure and room temperature as the test fluids. Experimental data on the axial variations of pressure difference between the subchannels, the ratio of flow rate in one subchannel to the whole channel, the void fraction in each subchannel were obtained for bubble, slug-churn, and annular flows in two-phase case. In addition, correlations of cross-flow resistance coefficient for the liquid phase and interfacial friction coefficient were obtained from an analysis of the cross-flow rate data in our latest experiments. In this study, by incorporating these correlations into a cross-flow momentum equation in our subchannel analysis code, which was based on a two-fluid model, flow redistribution processes due to diversion cross-flow have been calculated for various single-and two-phase hydraulically non-equilibrium flows with pressure difference between the subchannels. From a comparison with the experimental data on the flow redistribution processes, the validity of the analysis has been confirmed in the region where the effects of void drift can be neglected.

关键词： Two phase flow

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Hydrogels for vocal fold tissue engineering and repair

Hydrogels for vocal fold tissue engineering and repair

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2004 AIChE Annual Meeting

作者： Hahn, Mariah Teply, Benjamin Sieminski, Alisha Stevens, Molly Kamm, Roger Zeitels, Steven Langer, Robert Dept. of Electrical Engineering and Computer Science MIT Dept. of Chemical Engineering MIT Dept. of Biological Engineering MIT Dept. of Materials Imperial College of London Dept. of Mechanical Engineering MIT Dept. of Thoracic Surgery MGH

The potential of self-assembling peptides RAD-16-II and collagen-alginate composites to maintain vocal fibroblasts and stimulate the synthesis and accumulation of ECM in 3D cell culture with minimal matrix contraction was demonstrated. The peptide RAD-16-II represents one of a class of self-assembling peptides developed through molecular engineering. These peptides were found to assemble into well-ordered nano-fibers with inter-fiber spacing of ∼50-20 nm, creating a nanoscale hydrogel network around encapsulated cells. Alginate was studied extensively as a tissue engineering matrix for cartilage and for soft tissue augmentation.

关键词： Tissue culture

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