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作者： Wei, G. Gong, J. Zangari, G. Weaver, M.L. Barnard, J.A. Dept. of Metallurgical Engineering Ctr. for Mat. for Info. Technol. University of Alabama Tuscaloosa AL 35487 United States Tri-Campus Materials Science Program Ctr. for Mat. for Info. Technol. University of Alabama Tuscaloosa AL 35487 United States Department of Materials Science 848 Benedum Hall University of Pittsburgh Pittsburgh PA 15261 United States

The effects of various sputtering gases (Ar, Kr and Xe) on the roughness, coverage, stress, density, and nanomechanical properties of CNx thin films were studied. The CNx was deposited on Si(100) substrates using dc magnetron sputtering and by using atomic force microscopy a three-parameter roughness analysis was done. It was found that a 3-nm-thick dc-sputtered CNx overcoat displaying good coverage was obtained using Kr and Xe.

关键词： Carbon nitride

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Growing the national innovation system: Leading change at universities for innovative graduate education

Growing the national innovation system: Leading change at un...

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2003 ASEE Annual Conference and Exposition: Staying in Tune with engineering Education

作者： Depew, Dennis R. Tricamo, Stephen J. Sebastian, Dolald H. Fenster, Saul K. Bennett, Ronald J. Dunlap, Duane D. Jakubowski, Gerald S. Mendelson, Mel I. Stanford, Thomas G. Keating, Donald A. Snellenberger, Jay M. Purdue University New Jersey Institute of Technology St Thomas University Western Carolina University Loyola Marymount University University of South Carolina Rolls-Royce Corporation Dept. of Eng. and Technol. Mgmt. University of St. Thomas School of Technology Purdue University Department of Engineering Technology Western Carolina University Department of Mechanical Engineering University of South Carolina Department of Chemical Engineering University of South Carolina Department of Industrial Engineering Research and Development New Jersey Institute of Technology College of Science and Engineering Loyola Marymount University Department of Mechanical Engineering Eng. and Prod. Mgmt. Grad. Program Loyola Marymount University Rolls-Royce Corporation Indianapolis IN

This is the fourth paper in the panel session of the National Collaborative Task Force on reshaping professional graduate education in engineering and technology that is more relevant to the needs of industry to ensure a strong U.S. engineering workforce. As the final and integrating paper of the panel session, this paper ties together the three previous papers and focuses on leading change for purposeful action at comprehensive research universities to implement this needed innovation into the mainstream of university operations across the country. The National Collaborative Task Force believes that innovation in engineering education can be accomplished best at the graduate level through a national demonstration project effected by a critical mass of innovative leaders from a strong coalition of universities and industry who are committed to taking purposeful action for reform. The paper presents strategies to overcome systemic and institutional obstacles in implementing this significant transformation at comprehensive research universities across the country. Additionally, the paper builds upon recommendations of the National Academy of engineering, ASEE, the Kellogg Commission, the Council on Competitiveness, the Council of Graduate Schools, and other calls for reform in engineering education. The National Task Force is playing a key role as change agent for this transformation with industry.

关键词： engineering education

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Evolution of surface micro-features on titanium nitride films deposited using plasma vacuum arc methods

Evolution of surface micro-features on titanium nitride film...

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IEEE International Conference on Plasma science (ICOPS)

作者： L.H. Li P.K. Chu S.C.H. Kwok Y.Q. Wu Y.H. Zhang School of Mechanical Engineering and Automation Beijing University of Aeronautics and Astronautics Beijing China Dept. of Physics & Materials Science City University of Hong Kong Kowloon Hong Kong

Summary form only given, as follows. Titanium nitride (TiN) thin films possess excellent wear resistance, a golden color, and other desirable properties. They are therefore quite common in industrial parts and components TiN films can be fabricated by many methods among which vacuum arc plasma deposition is gaining popularity because of the ease to adjust the processing parameters and the high deposition rate. In order to retain the high efficiency in industrial applications, magnetic filters are not frequently used and macro-particles emitted from the source can contaminate the samples.

关键词： Titanium Vacuum arcs Plasma applications Plasma properties Tin Surface resistance Transistors Textile industry Magnetic films Plasma materials processing

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Surface Modification of Blood Contacting Biomedical Implants by Plasma Processes

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AIP Conference Proceedings 2003年第1期669卷 330-334页

作者： N. Huang P. Yang Y. X. Leng J. Y. Chen J. Wang H. Sun G. J. Wan P. K. Chu Y. Leng 1Institute of Biomaterials Surface Engineering Dept. of Materials Engineering Southwest Jiaotong University Chengdu 610031 China 2Dept. of Physics and Materials Science City University Of Hong Kong 83 Tat Chee Avenue Kowloon Hong Kong China 3Department of Mechanical Engineering Hong Kong University of Science and Technology Clear Water Bay Kowloon Hong Kong China

Surface modification is becoming an increasingly popular method to Improve the surface properties of biomedical materials and implants. Among the techniques plasma processes have been attracting attention because of their high effect and low cost. In this paper some application of plasma processes such as plasma modification, plasma polymerization, films synthesis, and plasma based ion implantation etc to modify blood contacting biomaterials and implants are presented. The authors work on the surface modification of artificial heart valves, stents and catheter etc. are provided. The further development of this discipline is discussed.

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On the Role of Kinematics in Constructing Predictive Models of Austenite Decomposition

On the Role of Kinematics in Constructing Predictive Models ...

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materials science and Technology 2003 Meeting

作者： Lusk, Mark T. Wang, Wei Sun, Xiaoguarig Lee, Young-Kook Materials Science Program Division of Engineering Colorado School of Mines Golden CO 80404 United States Technology Center Research and Development Department Baoshan Iron and Steel Co. Ltd. 1 Kedorig Rd Baoshan District Shanghai 201900 China Department of Computing Technology Fudan University Shanghai 200433 China Dept. of Metallurgical Engineering Yonsei University Seoul 120-749 Korea Republic of

ISBN: (纸本)087339559X

Computational models of austenite decomposition should provide predictions of external shape and internal microstructure as functions of time and temperature. This information may be used directly, or it can be sent to other simulators in order to make predictions about material working properties. It is often the case that such decomposition models are constructed using kinematic information-i.e. data that relate external shape change to the internal microstructural state. These models are based on the supposition that a differential shape change can be related to a differential microstructural change given that the base state is known. This is a purely kinematic link that does not depend on the rate of decomposition. A starting point is often to estimate shape change using a weighted average of the lattice parameters of each phase present, and this is adopted in the present work. Based on a review of the literature values for lattice parameters associated with low carbon steels, an optimal set of lattice values is obtained. These thermophysical functions are then used in a new forward fitting algorithm to obtain kinetic parameters for an internal state variable model of austenite decomposition. The key idea here is that the kinetic parameters are optimized so as to match dilatometry data without the need to back out any phase fraction data prior to fitting. The model is applied to a class of industrial steels to demonstrate the accuracy of the lattice parameters and the viability of the new forward fitting methodology.

关键词： Austenite

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Manufacturing of micro electrodes using ultra sonic aided electrochemical machining

Manufacturing of micro electrodes using ultra sonic aided el...

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Design, Test, Integration and Packaging of MEMS/MOEMS

作者： Feng-Tsai Wang Chen-Siang Hsu R.F. Shyu C.T. Ho Dept. of Mech. Manuf Eng. Nat. Huwei Inst. of Technol. Yunlin Taiwan Department of Materials Science and Engineering National Huwei Institute of Technology Yunlin Taiwan Department of Mechanical Manufacturing Engineering National Huwei Institute of Technology Yunlin Taiwan Department of Mechanical Design Engineering National Huwei Institute of Technology Yunlin Taiwan

In this study, a two-steps composite processing technology combining WEDG process, ultra sonic, and electrolysis machining is adapted to cut micro electrodes. Rod electrode of diameter 3.0 mm is cut to be 0.15 mm on wire-EDM machine in first step. A faster metal removal rate can be achieved on anode by ultra sonic aided electrolysis machining. The diameter of the microelectrode could be machined to 10 /spl mu/m in second step. Results have been revealed fine electrodes could be processed to a desired smaller size using proposed two-steps composite machining technology. With higher L/D ratio, the processed fine electrodes can be used for processing micro holes, deep micro holes, micro slots and manufacturing of micro nozzles.

关键词： Manufacturing Electrodes Electrochemical machining Electrochemical processes Copper Wire Anodes Design engineering materials science and technology Micromechanical devices

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Modeling of steel scrap dissolution in high carbon ferrous melts

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Computers in Education Journal 2003年第3期13卷 2-13页

作者： Suárez, Oscar Marcelo Ruiz, David Álvarez Sánchez, Reggy Agosto Loper Jr., Carl R. Dept. of General Engineering Univ. of Puerto Rico - Mayagüez P. O. Box 9044 Mayagüez PR 000681-9044 Dept. of Mechanical Engineering Univ. of Puerto Rico - Mayagüez P. O. Box 9044 Mayagüez PR 000681 Dept. of Electrical Engineering Univ. of Puerto Rico - Mayagüez P. O. Box 9044 Mayagüez PR 000681 Dept. of Materials Science University of Wisconsin-Madison 1509 University Ave. Madison WI 53706

As part of an undergraduate research course, the participating students developed two different programs in order to study the dissolution of steel scrap in high carbon cast iron melts. The changes in molten metal temperature and carbon concentration were computed. Recurrent calculations of more addition schemes were readily implemented into the code. When steel scrap is added, the sequential incorporation of steel reduces the overall carbon content of the melt by diluting it. This means that the chemical composition is displaced to lower carbon percentages and eventually, for the given melt temperature, the molten iron could begin to solidify if the austenite liquidus temperature-composition point is reached. An error-trapping module evaluated this possibility and handled the corresponding warning. The project was used as an economical alternative to full-scale experimentation whereas the students were exposed to real-life applications of code developments.

关键词： Computer aided instruction

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Building academic, research, and commercialization programs in micro and nano science and engineering at the University of Utah

Building academic, research, and commercialization programs ...

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University/Government/Industry Microelectronics Symposium

作者： I.R. Harvey M.S. Miller S. Blair T. Ameel B.K. Gale T. Ring U of U Eng'g Dep's Materials Science Utah MicroSystems Science and Engineering Center University of Utah USA University of Utah Salt Lake City UT US Dept. of Mater. Sci. Utah Univ. Salt Lake City UT USA Electrical & Computer Utah MicroSystems Science and Engineering Center University of Utah USA Mechanical Utah MicroSystems Science and Engineering Center University of Utah USA Chemical & Fuels Utah MicroSystems Science and Engineering Center University of Utah USA

This paper presents a case-study of some University/Government/Industry interactions at the University of Utah that build research and academic programs and create opportunities for economic growth in the areas of mic... 详细信息

关键词： Commercialization Laboratories Educational institutions Government Collaboration Fabrication Biomedical engineering Fuels Computer industry Industrial economics

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Surface treatment of GaN and InN using (NH4)2Sx

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physica status solidi c 2003年第7期

作者： T. Maruyama K. Yorozu T. Noguchi Y. Seki Y. Saito T. Araki Y. Nanishi Dept. of Materials Science and Engineering Meijo University 1-501 Shiogamaguchi Tempaku-ku Nagoya 468-8502 Japan Meijo University 21st CENTURY COE PROGRAM “NANO FACTURY” Dept. of Photonics Ritsumeikan University 1-1-1 Noji-Higashi Kusatsu Shiga 525-8577 Japan

The effects of (NH 4 ) 2 S x treatment on GaN and InN surfaces were investigated by X-ray photoelectron spectroscopy. It was found that native oxide layers were removed from nitride surfaces by HCl and (NH 4 ) 2 S x treatments and that S-terminated surface layers were formed. In addition, the S-terminated layer on the GaN surface was removed by H* irradiation. The usefulness of the combination of (NH 4 ) 2 S x treatment and post H* irradiation was shown.

关键词： 81.05.Ea 81.65.Cf 81.65.Rv

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Analytical approach to evaluate shear stress in flip chip interconnection using NCA/ACF 4

Analytical approach to evaluate shear stress in flip chip in...

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4th International Symposium on Electronic materials and Packaging, EMAP 2002

作者： Yang, Se Young Lee, Soon-Bok Kwon, Woon-Seong Paik, Kyung-Wook Dept. of Mechanical Engineering Korea Advanced Institute of Science and Technology 373-1 Guseong-Dong Yuseong-Gu Daejeon305-701 Korea Republic of Dept. of Materials Science and Engineering KAIST Korea Republic of

ISBN: (纸本)078037682X

The flip chip technique using non-conductive adhesive (NCA) or anisotropic conductive film (ACF) has become a key technology for fine-pitch interconnection such as display packaging for compact electronic products. This film type electronic package, flip chip assembly on organic substrate such as FR-4 printed circuit board (PCB), has advantages such as low cost, reliable electronic performance, easier assembly process, and low temperature process. To account for the deterioration in electrical performance during high temperature operation, both analytical and experimental investigations were performed in this study. Interfacial shear stress along the adhesive layer was examined by applying existing analytical solutions for film structures. Analytical approaches were, then, compared with a numerical FEA solution and verified by experimental data obtained by a Moire interferometry experiment. © 2002 IEEE.

关键词： Temperature

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