The responsible artificial intelligence (AI) paradigm requires machine learning (ML) and AI engineers to ensure transparent and interpretable intelligent models across domains. This requirement becomes even more compl...
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The development of Urban Air Mobility (UAM) infrastructure has garnered significant attention in recent years. Specifically, researchers have explored using Machine Learning (ML) technology to improve the efficiency a...
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Irrigation canal networks play a pivotal role in satisfying the water demands of farmlands around the world. In a time of global warming, automatic irrigation systems are crucial in order to minimize water losses caus...
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Renewable energy forecasting is crucially important because of its fluctuation and stochastic characteristics. In this paper, a hybrid model for wind speed and power forecasting using neuro wavelet and long short-term...
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A radome whose interfaces with the surrounding medium are confocal parabolic cylinders with the same symmetry plane is considered. The medium on both convex and concave sides of the radome is linear, homogeneous, loss...
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We initiate an investigation into the optimization properties of next-token prediction (NTP), the dominant training paradigm for modern language models. Specifically, we study the structural properties of the solution...
Voltage-source inverters (VSIs) are used extensively in AC machine drive applications. Detailed switching models of VSIs offer accurate but computationally expensive simulations. Average-value models (AVMs) of VSIs ar...
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In recent years, healthcare in smart cities is considered as significant to create a more resilient and well-informed healthcare ecosystem. The integration of cloud computing in healthcare industry has facilitated the...
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Non-intrusive load monitoring (NILM) is a key solution for the application of load identification to electrical measurements performed at the level of an aggregated input point. In recent years, a higher sampling rate...
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The ever-growing need for computational power has led to advanced packaging technologies for integrated circuits. One such technology is 2.5D integration, which reduces the distance between chiplets in a single packag...
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