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检索条件"机构=Electrical and Computer Engineering and Material Science"
1158 条 记 录,以下是291-300 订阅
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Corrigendum: “Significant reduction in sidewall damage related external quantum efficiency (EQE) drop in red InGaN microLEDs (∼625 nm at 1 A cm−2) with device sizes down to 3 μm” [Jpn. J. Appl. Phys. 63 030904 (2024)]
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Japanese Journal of Applied Physics 2024年 第10期63卷 109301页
作者: Sanyal, Surjava Lin, Qinchen Shih, Timothy Zhang, Shijie Wang, Guangying Mukhopadhyay, Swarnav Zhang, Wentao Pasayat, Shubhra S Gupta, Chirag Vigen, Jonathan Department of Electrical and Computer Engineering University of Wisconsin-Madison Madison WI 53706 United States of America Department of Material Science and Engineering University of Wisconsin-Madison Madison WI 53706 United States of America
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engineering of anomalous Josephson effect in coherently coupled Josephson junctions
arXiv
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arXiv 2023年
作者: Matsuo, Sadashige Imoto, Takaya Yokoyama, Tomohiro Sato, Yosuke Lindemann, Tyler Gronin, Sergei Gardner, Geoffrey C. Manfra, Michael J. Tarucha, Seigo Center for Emergent Matter Science RIKEN Saitama351-0198 Japan Department of Physics Tokyo University of Science Tokyo162-8601 Japan Department of Material Engineering Science Graduate School of Engineering Science Osaka University Osaka560-8531 Japan Birck Nanotechnology Center Purdue University West LafayetteIN47907 United States Department of Physics and Astronomy Purdue University West LafayetteIN47907 United States School of Materials Engineering Purdue University West LafayetteIN47907 United States Elmore Family School of Electrical and Computer Engineering Purdue University West LafayetteIN47907 United States RIKEN Center for Quantum Computing RIKEN Saitama351-0198 Japan
A Josephson junction (JJ) is a key device in the development of superconducting circuits, wherein a supercurrent in the JJ is controlled by the phase difference between the two superconducting electrodes. Recently, it... 详细信息
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A study of low-annealing-temperature ohmic contact on n-Type GaN layers
A study of low-annealing-temperature ohmic contact on n-Type...
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2020 International Conference on Compound Semiconductor Manufacturing Technology, CS MANTECH 2020
作者: Cho, Minkyu Bakhtiary-Noodeh, Marzieh Schaffer, William Xu, Zhiyu Detchprohm, Theeradetch Dupuis, Russell D. Wu, Barry D'Avanzo, Don Shen, Shyh-Chiang School of Electrical and Computer Engineering Georgia Institute of Technology AtlantaGA United States Department of Material Science and Engineering Georgia Institute of Technology AtlantaGA United States Keysight Technologies Inc. Santa RosaCA United States
Typical n-type ohmic contact formation for GaN material systems requires high-temperature thermal processes. The high-temperature process often leads to a rough surface after the annealing step. Low-annealingohmic con... 详细信息
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Free-Electron Ramsey-Type Interferometry for Enhanced Amplitude and Phase Imaging of Nearfields
arXiv
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arXiv 2023年
作者: Bucher, Tomer Ruimy, Ron Tsesses, Shai Dahan, Raphael Bartal, Guy Vanacore, Giovanni Maria Kaminer, Ido Andrew and Erna Viterbi department of Electrical & Computer Engineering Technion-Israel Institute of Technology Haifa3200003 Israel Solid State Institute Technion-Israel Institute of Technology Haifa3200003 Israel Department of Physics Research Laboratory of Electronics Massachusetts Institute of Technology CambridgeMA02139 United States Department of Material Science University of Milano-Bicocca Via Cozzi 55 Milano20121 Italy
The complex range of interactions between electrons and electromagnetic fields gave rise to countless scientific and technological advances. A prime example is photon-induced nearfield electron microscopy (PINEM), ena... 详细信息
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Demonstration of Glass-based 3D Package Architectures with Embedded Dies for High Performance Computing
Demonstration of Glass-based 3D Package Architectures with E...
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Electronic Components and Technology Conference (ECTC)
作者: Siddharth Ravichandran Vanessa Smet Madhavan Swaminathan Rao Tummala 3D Systems Packaging Research Center School of Electrical and Computer Engineering Georgia Institute of Technology Atlanta USA 3D Systems Packaging Research Center School of Mechanical Engineering Georgia Institute of Technology Atlanta USA 3D Systems Packaging Research Center School of Material Science and Engineering Georgia Institute of Technology Atlanta USA
This paper presents a technology demonstration of two novel 3D glass-based architectures for high performance computing applications. Current 3D technologies are limited by Through Silicon Vias (TSVs), and the propose...
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Imaging 3D Chemistry at 1 nm Resolution with Fused Multi-Modal Electron Tomography
arXiv
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arXiv 2023年
作者: Schwartz, Jonathan Di, Zichao Wendy Jiang, Yi Manassa, Jason Pietryga, Jacob Qian, Yiwen Cho, Min Gee Rowell, Jonathan L. Zheng, Huihuo Robinson, Richard D. Gu, Junsi Kirilin, Alexey Rozeveld, Steve Ercius, Peter Fessler, Jeffrey A. Xu, Ting Scott, Mary Hovden, Robert Department of Materials Science and Engineering University of Michigan Ann ArborMI United States Mathematics and Computer Science Division Argonne National Laboratory LemontIL United States Advanced Photon Source Facility Argonne National Laboratory LemontIL United States Department of Material Science and Engineering Northwestern University EvanstonIL United States Department of Materials Science and Engineering University of California at Berkeley BerkeleyCA United States Department of Chemistry and Chemical Biology Cornell University IthacaNY United States Argonne Leadership Computing Facility Argonne National Laboratory LemontIL United States Department of Material Science and Engineering Cornell University IthacaNY United States Kavli Institute at Cornell for Nanoscale Science Cornell University IthacaNY United States Dow Chemical Co. MidlandMI United States National Center for Electron Microscopy Molecular Foundry Lawrence Berkeley National Laboratory BerkeleyCA United States Department of Electrical Engineering and Computer Science University of Michigan Ann ArborMI United States Materials Science Division Lawrence Berkeley National Laboratory BerkeleyCA United States Applied Physics Program University of Michigan Ann ArborMI United States
Measuring the three-dimensional (3D) distribution of chemistry in nanoscale matter is a longstanding challenge for metrological science. The inelastic scattering events required for 3D chemical imaging are too rare, r... 详细信息
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A Tight-Binding Model for Gallium Oxide: The Newest Ultra Wide-Bandgap Semiconductor
A Tight-Binding Model for Gallium Oxide: The Newest Ultra Wi...
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IEEE MIT Undergraduate Research Technology Conference (URTC)
作者: Yifan Frank Zhang Mengren Bill Liu Guru Khalsa Debdeep Jena Huili Grace Xing Electrical and Computer Engineering Cornell University Ithaca USA Material Science and Engineering Cornell University Ithaca USA
Ga 2 O 3 , a novel ultra wide-bandgap semiconductor, shows promise for future-generation energy-efficient electronic devices. Ga 2 O 3 presents new challenges when compared with conventional semiconductors due to the... 详细信息
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Growth, catalysis and faceting of α-Ga2O3 and α-(InxGa1−x)2O3 on m-plane α-Al2O3 by molecular beam epitaxy
arXiv
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arXiv 2023年
作者: Williams, Martin S. Alonso-Orts, Manuel Schowalter, Marco Karg, Alexander Raghuvansy, Sushma McCandless, Jon P. Jena, Debdeep Rosenauer, Andreas Eickhoff, Martin Vogt, Patrick Institute of Solid State Physics University of Bremen Otto-Hahn-Allee 1 Bremen28359 Germany MAPEX Center for Materials and Processes University of Bremen Bibliothekstraße 1 Bremen28359 Germany School of Electrical and Computer Engineering Cornell University 229 Phillip’s Hall NY14853 United States Department of Material Science and Engineering Cornell University Bard Hall NY14853 United States Kavli Institute Cornell for Nanoscale Science Cornell University IthacaNYNY-14853 United States
The growth of α-Ga2O3 and α-(InxGa1−x)2O3 on m-plane α-Al2O3(101¯0) by molecular beam epitaxy (MBE) and metal-oxide-catalyzed epitaxy (MOCATAXY) is investigated. By systematically exploring the parameter space... 详细信息
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Offloading safety- And mission-critical tasks via unreliable connections  32
Offloading safety- And mission-critical tasks via unreliable...
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32nd Euromicro Conference on Real-Time Systems, ECRTS 2020
作者: Schönberger, Lea Chen, Kuan-Hsun Youssef, Hazem Wietfeld, Christian Chen, Jian-Jia von der Brüggen, Georg Sliwa, Benjamin Venkatapathy, Aswin Karthik Ramachandran ten Hompel, Michael Design Automation for Embedded Systems Group Faculty of Computer Science TU Dortmund University Germany Material Handling and Warehousing Faculty of Mechanical Engineering TU Dortmund University Germany Communication Networks Institute Faculty of Electrical Engineering TU Dortmund University Germany
For many cyber-physical systems, e.g., IoT systems and autonomous vehicles, offloading workload to auxiliary processing units has become crucial. However, since this approach highly depends on network connectivity and... 详细信息
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Ultrastrong Spin-Photon Coupling in Gadolinium Gallium Garnet
Ultrastrong Spin-Photon Coupling in Gadolinium Gallium Garne...
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2023 Conference on Lasers and Electro-Optics, CLEO 2023
作者: Kritzell, T. Elijah Bao, Junzhe Doumani, Jacques Lee, Jae Joon Xu, Hongjing Tay, Fuyang Nojiri, Hiroyuki Bamba, Motoaki Baydin, Andrey Kono, Junichiro Department of Electrical and Computer Engineering Rice University HoustonTX77005 United States Applied Physics Graduate Program Smalley-Curl Institute Rice University HoustonTX77005 United States Department of Physics and Astronomy Rice University HoustonTX77005 United States Institute for Materials Research Tohoku University Sendai980-8577 Japan The Hakubi Center for Advanced Research Kyoto University Kyoto606-8502 Japan Department of Physics I Kyoto University Kyoto606-8502 Japan Smalley-Curl Institute Rice University HoustonTX77005 United States Department of Material Science and NanoEngineering Rice University HoustonTX77005 United States
We examine ultrastrong coupling of an ensemble of paramagnetic spins in Gd3Ga5O12 with terahertz photons in the presence of a high external magnetic field both in the bulk and thin-film limits. © 2023 The Author(s)
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