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检索条件"机构=Fraunhofer Institute for Integrated Circuits Engineering of Adaptive Systems"
117 条 记 录,以下是1-10 订阅
排序:
FMUGym: An Interface for Reinforcement Learning-based Control of Functional Mock-up Units under Uncertainties  31
FMUGym: An Interface for Reinforcement Learning-based Contro...
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31st International Workshop on Intelligent Computing in engineering, EG-ICE 2024
作者: Wrede, Konstantin Huang, Chenzi Wohlfahrt, Tommy Hartmann, Nick Fraunhofer Institute for Integrated Circuits IIS Division Engineering of Adaptive Systems EAS Germany
Uncertainties complicate the task of designing optimal controllers for complex systems. This work introduces FMUGym, a novel open source interface that connects reinforcement learning libraries following the Gymnasium... 详细信息
来源: 评论
Exploratory Data Analysis of Time Series Using Pre-segmented Clustering  26th
Exploratory Data Analysis of Time Series Using Pre-segmente...
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26th International Conference on Information Integration and Web Intelligence, iiWAS 2024
作者: Jain, Vineeta Huang, Zihao Richter, Anna Wetzker, Ulf Frotzscher, Andreas Fraunhofer Institute for Integrated Circuits Division Engineering of Adaptive Systems EAS Dresden Germany Technische Universität Dresden Dresden Germany
Time series clustering is an unsupervised method of organizing homogeneous time series in groups based on certain similarity criteria. As a result, it can be an essential step in Exploratory Data Analysis (E... 详细信息
来源: 评论
An Industry-Based Survey on Development and Integration of Safety Element out of Context  7
An Industry-Based Survey on Development and Integration of S...
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7th International Conference on System Reliability and Safety, ICSRS 2023
作者: Nouri, Abdellatif Warmuth, Jens Fraunhofer Institute for Integrated Circuits Iis Division Engineering of Adaptive Systems Eas Dresden Germany
ISO 26262 introduced the concept of Safety Element out of Context (SEooC), a generic element which is developed to be used across many applications, hence, saving a lot of time, effort, and cost. The objective of this... 详细信息
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Automated early damage detection for power MOSFETs using on-board thermal spectroscopy  22
Automated early damage detection for power MOSFETs using on-...
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22nd InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic systems, ITherm 2023
作者: Reitz, Sven Warmuth, Jens Fraunhofer Institute for Integrated Circuits Iis Division Engineering of Adaptive Systems Eas Dresden Germany
Functional safety and reliability of electronic components have been becoming increasingly important over the last years and will continue to do so for the foreseeable future. Not least because of autonomous driving, ... 详细信息
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A recommendation system for energy saving and user engagement in existing buildings
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Proceedings of the Institution of Civil Engineers: Smart Infrastructure and Construction 2022年 第1期176卷 1-11页
作者: Pruvost, Hervé Calleja-Rodríguez, Gloria Enge-Rosenblatt, Olaf Jiménez-Redondo, Noemi Peralta-Escalante, Juan Jacobo Division Engineering of Adaptive Systems Fraunhofer Institute for Integrated Circuits Dresden Germany RandD Division Cemosa Málaga Spain
Ranked as the major energy-consuming sector, the building industry continuously introduces enhanced energy-management systems towards more energy efficiency. Despite technological progress, high amounts of resources a... 详细信息
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Ultra-Low Power Fully-Digital Audio-DAC for Hearing Aid Application in 22 nm FDSOI Technology
Ultra-Low Power Fully-Digital Audio-DAC for Hearing Aid Appl...
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2023 Smart systems Integration Conference and Exhibition, SSI 2023
作者: Jotschke, Marcel Kumaraveeran, Prasath Buhl, Rene Zeugmann, Bjorn Fraunhofer IIS/EAS Fraunhofer Institute for Integrated Circuits Division Engineering of Adaptive Systems Dresden Germany Solutions Group Synopsys GmbH Aachen Germany
This paper presents a fully-digital delta-sigma digital-to-analog converter (DAC) for application in audio and hearing aid system-on-chips (SoCs). The slim design is initially synthesized and verified on field program... 详细信息
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Advanced Packaging Using Chiplets and Standardized Physical Interfaces  24
Advanced Packaging Using Chiplets and Standardized Physical ...
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24th Electronics Packaging Technology Conference, EPTC 2022
作者: Hopsch, Fabian Ahmed, Maudood Heinig, Andy Fraunhofer Institute for Integrated Circuits Iis Division Engineering of Adaptive Systems Eas Dresden01187 Germany
Electronic control units (ECU) for automotive and robotics are seen as one emerging technology driver for the chiplet technology. Such a system consists of several building blocks with dedicated functionality. Based o... 详细信息
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Integrating Multiple Knowledge-based Automation Methodologies into the A/MS IC Design Flow  20
Integrating Multiple Knowledge-based Automation Methodologie...
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20th International Conference on Synthesis, Modeling, Analysis and Simulation Methods and Applications to Circuit Design, SMACD 2024
作者: Prautsch, Benjamin Sommer, Ralf Scheible, Jürgen Eichler, Uwe Renner, Lorenz Moldenhauer, Till Schweikardt, Matthias Uhlmann, Yannick Institute for Integrated Circuits Fraunhofer IIS/EAS Division Engineering of Adaptive Systems Dresden Germany Ilmenau University of Technology IMMS GmbH Ilmenau Germany Reutlingen University Electronics & Drives Reutlingen Germany
Analog and mixed-signal (A/MS) IC design is still a largely manual process. It lags far behind its digital counterpart were synthesis methods automate many key design steps. This advantage in digital roots from the po... 详细信息
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BoW Die to Die interface implementation: An open standardized interface for future Electronics
BoW Die to Die interface implementation: An open standardize...
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Electronics Packaging Technology Conference (EPTC)
作者: Maudood Ahmed Andy Heinig Sneha Kadam Lavakumar Navilipuri Division Engineering of Adaptive Systems EAS Fraunhofer Institute for Integrated Circuits IIS Dresden
Chiplets with a Die to die interface has gained popularity over SoC recently since it has much scope for optimisation in terms of power consumption and high design cost. The downscaling of technology nodes has made it...
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Self-Organization and Collaboration in Robotic Manufacturing systems  19
Self-Organization and Collaboration in Robotic Manufacturing...
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19th IEEE International Conference on Automation Science and engineering, CASE 2023
作者: Frotzscher, Andreas Chen, Xiao Tran, Duy Lam Goll, Thore Sadeghian, Hamid Wu, Fan Dehmel, Martin Wohlfahrt, Tommy Riedl, Matthias Haddadin, Sami Fraunhofer Institute for Integrated Circuits Iis Engineering of Adaptive Systems Eas Dresden Germany Technical University of Munich Munich Germany Ifak E.V. Magdeburg Germany Franka Emika GmbH Munich Germany
The flexibility and adaptability of smart production systems are achieved through the use of autonomous and collaborating production assets. However, these systems still heavily rely on a central control unit to super... 详细信息
来源: 评论