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Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-systems EuroSimE

作者： Mohamad El Khatib Sven Reitz Jens Warmuth Division Engineering of Adaptive Systems EAS Zeunerstraße 38 Fraunhofer Institute for Integrated Circuits IIS Dresden

ISBN: (纸本)9781665413732;9781665413749

Autonomous driving is playing a big role in the automotive industry and defines the future of mobility on a big scale. However, autonomous driving faces several challenges, such as the performance of artificial intelligence and hardware reliability. To ensure safe functionality, the reliability of the electronic components plays an essential role and must be taken into consideration. One aspect of studies that analyze the electronics reliability is the observation of the system's thermal impedance and deriving a correlation between the failure mechanisms and thermal impedance behavior. In recent times, several new approaches have been suggested to improve the electronics reliability. Many studies were carried out to determine the effect of solder voiding on the thermal impedance of chip-level packages. In this paper, a defect diagnosis and physical damage detection method for electronic packaging are studied by measuring the thermal impedance through the body diode of the device under test (DUT). The detection method uses MOSFET body diode temperature measurements to investigate different failure mechanisms at different locations in the electronic packaging system.

关键词： Temperature measurement MOSFET Impedance measurement Failure analysis Electronic packaging thermal management Thermal analysis Reliability

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SUPPORTING systems engineering ACTIVITIES BY ARTIFACT-ORIENTED DESCRIPTION AND SELECTION OF METHODS 24

SUPPORTING SYSTEMS ENGINEERING ACTIVITIES BY ARTIFACT-ORIENT...

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24th International Conference on engineering Design, ICED 2023

作者： Ammersdörfer, Theresa Inkermann, David Müller, Johannes Mandel, Constantin Albers, Albert Tekaat, Julian Schierbaum, Anja Anacker, Harald Bitzer, Michael Kleiner, Sven Herrmann, Jan-Phillip Krause, Patrik Robert-Koch-Str. 32 Clausthal-Zellerfeld38678 Germany Kaiserstraβe 10 Karlsruhe76131 Germany Fraunhofer Research Institute for Mechatronic Systems Design Iem Zukunftsmeile 1 Paderborn33102 Germany Fresenius Medical Care Deutschland GmbH Daimlerstr. 15 Bad Homburg61352 Germany Em Engineering Methods Ag Model Based Engineering Rheinstr. 97 Darmstadt64295 Germany Owl University of Applied Sciences and Arts Campusallee 12 Lemgo32657 Germany 3DSE Management Consultants GmbH Seidlstraβe 18a MÜnchen80335 Germany

systems engineering (SE) is becoming increasingly relevant in industrial application since more stakeholders are involved in engineering activities. To implement SE, companies have to adapt existing engineering processes and methods. This adaption requires knowledge about new methods as well as their integration into the engineering activities. In order to ensure goal-oriented identification of methods for different SE activities in this contribution an action field profile and the systems engineering Method Matrix are proposed. The development of both tools is driven by the assumption that most SE activities and methods can be described based on the artefacts the deliver. In order to get feedback about the proposed tools, semi-structured interviews with two industry partners were conducted, focussing on the tool's usability. These interviews underline the basic usability of the tools and their support to identify SE activities to be supported by (new) methods. Moreover, requirements for further development and adaption are derived from the interviews. © The Author(s), 2023. Published by Cambridge University Press.

关键词： Design

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Monte Carlo Dose Simulation for In-Vivo X-Ray Nanoscopy

Monte Carlo Dose Simulation for In-Vivo X-Ray Nanoscopy

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German Workshop on Medical Image Computing, 2022

作者： Wagner, Fabian Thies, Mareike Karolczak, Marek Pechmann, Sabrina Huang, Yixing Gu, Mingxuan Kling, Lasse Weidner, Daniela Aust, Oliver Schett, Georg Christiansen, Silke Maier, Andreas Pattern Recognition Lab FAU Erlangen-Nürnberg Erlangen Germany Institute of Medical Physics and Microtissue Engineering FAU Erlangen-Nürnberg Erlangen Germany Fraunhofer Institute for Ceramic Technologies and Systems IKTS Forchheim Germany Institute for Nanotechnology and Correlative Microscopy e.V. INAM Forchheim Germany Department of Internal Medicine 3 - Rheumatology and Immunology FAU Erlangen-Nürnberg and University Hospital Erlangen Erlangen Germany Leibniz Institute for Analytical Sciences ISAS Dortmund Germany

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Surrogate-Based Modeling Techniques for Mapping Transistor Figures of Merit onto Compact Model Parameters

Surrogate-Based Modeling Techniques for Mapping Transistor F...

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IEEE International Workshop Integrated Reliability

作者： Fabio A. Velarde Gonzalez Jose L. Chavez-Hurtado André Lange Thomas Mikolajick Fraunhofer Institute for Integrated Circuits IIS Division Engineering of Adaptive Systems EAS Dresden Germany Dep. of Electronics Systems and Informatics ITESO University Tlaquepaque México IHM Technische Universität Dresden Dresden Germany

ISBN: (纸本)9781665453691

The electrical characteristics of a transistor can deviate from its nominal behavior due to process variations, aging mechanisms, etc. In order to ensure the reliability of a design, circuit level simulations capturing this altered transistor behaviors have become increasingly important. In this paper we study the use of surrogate models to map changes in key transistor’s figures of merit into compact model parameters in order to shorten the path from reliability measurements to simulations.

关键词： Degradation Voltage measurement Reliability engineering Behavioral sciences Transistors Integrated circuit modeling Integrated circuit reliability

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Advancing digital twin implementation: a toolbox for modelling and simulation

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Procedia CIRP 2021年 99卷 567-572页

作者： Soumya Singh Max Weeber Kai-Peter Birke Fraunhofer Institute for Manufacturing Engineering and Automation IPA Nobelstrasse 12 70569 Stuttgart Germany Electrical Energy Storage Systems Institute for Photovoltaics Pfaffenwaldring 47 70569 Stuttgart Germany

The concept of Digital Twin is becoming increasingly relevant for the realization of Industry 4.0. Digital Twin has the capability to optimize the product lifecycle stages and support the industries for intelligent decision-making and cost-effective business solutions. As a trending topic, a wide range of literature and a number of implementation approaches have been designed and developed. However, most of the existing implementations do not fully meet the scope and requirements defined for a digital twin, mainly due to lack of consensus about the properties of a digital twin and its corresponding components. To fill this gap, this paper presents a toolbox for realizing a Digital Twin in domain-specific applications by enhancing the associated modelling and simulation practices. The approach is illustrated by implementing the digital twin of a battery system in a robotic minicar.

关键词： Digital twin Modelling Simulation

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Unlocking Sneak Path Analysis in Memristor Based Logic Design Styles

Unlocking Sneak Path Analysis in Memristor Based Logic Desig...

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Euromicro Symposium on Digital System Design

作者： Kamalika Datta Saeideh Shirinzadeh Phrangboklang Lyngton Thangkhiew Indranil Sengupta Rolf Drechsler German Research Centre for Artificial Intelligence (DFKI) Bremen Germany Fraunhofer Institute for Systems and Innovation Research(ISI) Karlsruhe Germany Department of Computer Science and Engineering Indian Institute of Information Technology Guwahati India Department of Computer Science and Engineering JIS University India Department of Computer Science and Engineering Indian Institute of Technology Kharagpur India Institute of Computer Science University of Bremen Germany

ISBN: (数字)9781665474047

ISBN: (纸本)9781665474054

Memristors or Resistive Random Access Memory (RRAM) are emerging non-volatile memory devices that can be used for both storage and computing. In this type of memory the information is stored in memory cells in the form of resistance. One of the very important challenges in memristive crossbars is the existence of Sneak Paths, which result in erroneous reading of memory cells. Most of the logic in-memory techniques have emphasized on improving the logic design perspective, but have given minor importance to the sneak path issue. In this paper we show the effect of sneak paths on crossbars of various sizes, and then try to analyze the logic design approaches like MAGIC and MAJORITY with respect to their immunity to sneak paths. Experimental result shows that with some extra overhead we can eliminate the sneak path effect in various logic design methods.

关键词： Resistance Nonvolatile memory Digital systems Resistive RAM Memristors Logic design Logic arrays

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High-Performance Multi-Junction C-Band Photonic Power Converters: Calibrated Optoelectronic Model for Next Generation Designs

High-Performance Multi-Junction C-Band Photonic Power Conver...

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IEEE Conference Photovoltaic Specialists (PVSC)

作者： Gavin P Forcade Meghan N Beattie Christopher E Valdivia Henning Helmers Oliver Hӧhn Paige Wilson Louis-Philippe St-Arnaud Robert Hunter David Lackner Jacob J Krich Alexandre W Walker Karin Hinzer Department of Physics University of Ottawa Ottawa ON Canada SUNLAB School of Electrical Engineering and Computer Sciences Ottawa ON Canada Fraunhofer Institute for Solar Energy Systems ISE Freiburg Germany Advanced Electronics and Photonics Research Centre National Research Council of Canada Ottawa ON Canada

Predicting behavior of optoelectronic devices is critical for device design and optimization. Such predictions can be made with a calibrated drift-diffusion model. Recently, photovoltaics using InGaAs as the absorber material, lattice matched to InP, have shown excellent performance in many applications. Further enhancements may be possible by optimizing the designs with an optoelectronic model, calibrated to results from experimental devices. We characterize fabricated InGaAs photonic power converters (PPCs) that have 60 nm, 180 nm, and 540 nm absorber layer thicknesses, using experimental results to calibrate our drift-diffusion model. The calibrated model predicts external quantum efficiencies to better than 1% accuracy and overestimates the open-circuit voltage under 1540 nm illumination by less than 2%. Using this calibrated model, we predict a realistic 1-junction PPC efficiency of up to 46% for a 1540 nm laser, with efficiency limited by carrier collection and series resistance. Improved junction architecture and cell segmentation could help to mitigate both issues. We also fabricated and characterized a 10-junction PPC made of series-connected InGaAs subcells and measured a maximum efficiency of 44% under 1540 nm illumination at 33 W/cm2 power with an open-circuit voltage above 5 V, providing both high efficiency and the voltage required to power electronic circuitry.

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Knowledge transfer and engineering methods for smart-circular product service systems 31st

Knowledge transfer and engineering methods for smart-circula...

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31st CIRP Design Conference 2021, CIRP Design 2021

作者： Halstenberg, Friedrich Dönmez, Jasmin Mennenga, Mark Herrmann, Christoph Stark, Rainer Fraunhofer Institute for Production Systems and Design Technolog Pascalstr. 8-9 Berlin10587 Germany Institute of Machine Tools and Production Technology Chair of Sustainable Manufacturing and Life Cycle Engineering Technische Universität Braunschweig Langer Kamp 19 b Braunschweig38106 Germany

Smart Product Service systems (Smart PSS) have the potential to contribute to a Circular Economy (CE), but in the design of these systems engineering teams often lack information and knowledge on CE strategies and processes. Against this background, the authors propose a knowledge transfer system for the design of Smart-circular PSS. The system can be used in the concept phase of the Smart PSS development process and delivers information on CE strategies via a Smart-circular PSS Lifecycle Flowchart (SCPLF) and service archetypes. These strategies can be selected, supplemented and extended according to individual user requirements. The approach was validated using an intelligent street lighting system. This paper summarizes findings from the application and provides insights into potentials and limitations for the design of Smart-circular Smart PSS. © 2021 The Author(s).

关键词： systems engineering

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Inverted-circuit zero-noise extrapolation for quantum gate error mitigation

arXiv

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arXiv 2024年

作者： Koenig, Kathrin F. Reinecke, Finn Hahn, Walter Wellens, Thomas Fraunhofer Institute for Applied Solid State Physics Tullastr. 72 Freiburg79108 Germany Department of Sustainable Systems Engineering University of Freiburg Emmy-Noether-Str. 2 Freiburg79110 Germany Department of Computer Science University of Freiburg Georges-Köhler-Allee 51 Freiburg79110 Germany

A common approach to deal with gate errors in modern quantum-computing hardware is zero-noise extrapolation. By artificially amplifying errors and extrapolating the expectation values obtained with different error strengths towards the zero-error (zero-noise) limit, the technique aims at rectifying errors in noisy quantum computing systems. For accurate extrapolation, it is essential to know the exact factors of the noise amplification. In this article, we propose a simple method for estimating the strength of errors occurring in a quantum circuit and demonstrate improved extrapolation results. The method determines the error strength for a circuit by appending to it the inverted circuit and measuring the probability of the initial state. The estimation of error strengths is easy to implement for arbitrary circuits and does not require previous characterization of noise properties. We compare this method with the conventional zero-noise extrapolation method and show that our method leads to a more accurate calculation of expectation values on current quantum hardware, showcasing its suitability for near-term quantum computing applications. © 2024, CC BY.

关键词： Quantum computers

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Enhancements to the 5G-NR 2-Step RACH: an Unsourced Multiple Access Perspective

Enhancements to the 5G-NR 2-Step RACH: an Unsourced Multiple...

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IEEE Conference on Standards for Communications and Networking (CSCN)

作者： Patrick Agostini Jean-Francois Chamberland Federico Clazzer Johannes Dommel Gianluigi Liva Andrea Munari Krishna Narayanan Yury Polyanskiy Slawomir Stanczak Zoran Utkovski Fraunhofer Heinrich-Hertz-Institut Berlin Germany Dep. of Electrical and Computer Engineering College Station Texas A&M University TX USA German Aerospace Center (DLR) Inst. of Communications and Navigation Wessling Germany Laboratory for Information and Decision Systems Massachusetts Institute of Technology Cambridge MA USA

ISBN: (数字)9798331507428

ISBN: (纸本)9798331507435

The ever increasing demand for massive connectivity, combined with the specific characteristics of machinegenerated wireless traffic, is pushing the existing solutions for device registration and data transfer beyond their operational limits. In this paper, we target specifically the 3GPP 5G New Radio random access channel, proposing some enhancements inspired by recent research results in the field of unsourced multiple access (UMAC). Aiming to enable massive grant-free connectivity for large machine-type and Internet of things terminals, we focus on modifications of the two-step random access procedures originally introduced in 3GPP Release 16. By means of simulations, we show that remarkable gains in both energy and spectral efficiency can be attained while retaining a strong resemblance to the legacy protocol.

关键词： Wireless communication Fading channels Protocols Spectral efficiency Simulation New Radio 3GPP Internet of Things Standards Signal to noise ratio

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