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TechRxiv 2023年

作者： Zhang, Haochen Lin, Xingyu Peng, Sui Tang, Junjie Ponci, Ferdinanda Monti, Antonello Electrical and Computer Engineering Department University of California Los Angeles90095 United States State Key Laboratory of Power Transmission Equipment & System Security and New Technology Chongqing University Chongqing400044 China Grid Planning and Research Center Guangdong Power Grid Corporation CSG Guangzhou510080 China Institute for Automation of Complex Power Systems E.ON Energy Research Center RWTH Aachen University Aachen52074 Germany Digital Energy Fraunhofer FIT Aachen52072 Germany

Recently, a novel power flow model called weather dependent power flow (WDPF) has been proposed to incorporate conductor temperatures in power flow calculation. It is promising to adopt WDPF model in probabilistic analysis since it provides more accurate electrical and thermal states of a power system. However, calculation of the WDPF model is more computationally expensive than that of conventional power flow model, and hence repetitive calculation of the WDPF in probabilistic analysis is quite time-consuming. To overcome this challenge, a surrogate-model-based sequential algorithm is proposed for calculation of the WDPF model with high computational efficiency and good accuracy. Compared to the method that directly learns the whole WDPF model, the proposed method only learns the power flow sub-model whereas applies a linearization method to solve the thermal resistance sub-model. The construction of the proposed method considers the learning difficulty of the sub-model and the whole WDPF model, thus ensuring the high calculation accuracy. This study is the first to conduct a probabilistic power flow analysis based on the WDPF model. Numerical results in the IEEE 30-bus, 57-bus, and 118-bus systems demonstrate the importance of adopting the WDPF model in probabilistic analysis and the efficacy of the proposed method. © 2023, CC BY.

关键词： Linearization

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Interconnect Aware Power Optimization of Low Swing Driver for Multi-Chip Interfaces

Interconnect Aware Power Optimization of Low Swing Driver fo...

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IEEE International Conference on Electronics, Circuits and systems (ICECS)

作者： Muhammad Waqas Chaudhary Andy Heinig Bhaskar Choubey Division Engineering of Adaptive Systems EAS Fraunhofer Institute for Integrated Circuits IIS Dresden Germany Chair of Analogue Circuits Siegen University and Head of Microelectronic Intelligence Fraunhofer IMS Germany

ISBN: (数字)9781728160443

ISBN: (纸本)9781728160450

Communication between dies in a multi-chip system requires low power consumption. Silicon area consumed by drivers should also be minimized. Traditionally, drivers for multichip communication are designed for maximum channel loss estimated in a given system. This design strategy leads to higher power consumption even when the channel is extremely short and low loss. This paper proposes an optimization approach for interconnect aware low swing driver with a case study of source follower based architecture. It is shown that by using this strategy, the driver can reach an energy efficiency of 0.15 pJ/bit at 1 Gb/s data rate on 3.8 mm organic substrate interconnect.

关键词： Integrated circuit interconnections Optimization Silicon Transistors Topology Receivers Jitter

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Towards a Wireless System that Can Monitor the Encapsulation of mm-sized Active Implants in vivo for Bioelectronic Medicine

Towards a Wireless System that Can Monitor the Encapsulation...

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International IEEE/EMBS Conference on Neural engineering, CNE

作者： Gonçalo Rodrigues Mariana Neca João Silva Diogo Brito Taimur Rabuske Jorge Fernandes Rainer Mohrlok Christoph Jeschke Jannis Meents Kambiz Nanbakhsh Vasiliki Giagka INESC-ID Instituto Superior Técnico Universidade de Lisboa Multichannel Systems MCS GmbH Germany Faculty of Electrical Engineering Mathematics and Computer Science Delft University of Technology Delft The Netherlands Fraunhofer Institute for Reliability and Microintegration IZM Berlin Germany

Active neural interfaces for bioelectronic medicine are envisioned to be mm-sized. Such miniaturization is at the moment hampered by the available wireless power techniques as well as the large volume the conventional hermetic packaging adds to the implant. Alternatively, conformal coatings are being explored for the protection of the implant electronics. Such approach has the potential to allow for the use of RF (radio-frequency) energy for powering, and miniaturization to the extreme of having a single IC (integrated circuit) as the whole implant (single chip implants). The longevity of conformal encapsulation can be assessed using accelerated soak tests in a dedicated apparatus in vitro, but these are usually not sufficient, as they fail to reveal additional failure modes that manifest themselves in vivo. Therefore, to investigate the performance of conformal coatings in vivo a compact, mm-sized wireless monitoring system is required. The development of such a system exhibits several challenges, mostly concerned with how to receive enough energy in such a small implant to power the monitoring sensor and transmit information regarding the integrity of the coating. In this paper we propose a system architecture for such a mm-sized wireless system, suitable for medium-to-Iong term monitoring of implants, by designing the whole system as a single monolithic IC. It is shown, by experiments, simulation or analytically that the identified challenges are possible to overcome, allowing to proceed towards the practical prototype.

关键词： Wireless communication Encapsulation Radio frequency In vivo Wireless sensor networks systems architecture Implants

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Discussions on sensor-based assistance systems for forklifts

Discussions on sensor-based assistance systems for forklifts

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European Conference on Smart Objects, systems and Technologies 2019, Smart SysTech 2019

作者： Cao, Liu Depner, Thomas Borstell, Hagen Richter, Klaus Institute of Logistics and Material Handling Systems Otto von Guericke University Magdeburg Magdeburg Germany Material Handling Engineering and Systems Fraunhofer Institute for Factory Operation and Automation IFF Magdeburg Germany

ISBN: (纸本)9783800749782

A forklift is a piece of common equipment used to move, lift and transload goods and materials in warehouses, distribution centers and manufacturing facilities. Handling errors by the forklift driver, insufficient safety awareness, improper workplace design or a combination of these factors can cause injuries or fatal accidents. Sensor-based assistance systems are able to minimize safety risks and increase work efficiency. However, there is no comprehensive overview and no structuring scheme of sensor-based assistance systems for forklifts. For this reason, we provide a classification scheme of assistance systems for forklifts. We also offer a proposal for choosing forklift assistance system according to the logistics processes that may have a huge potential for error. © VDE VERLAG GMBH ∙ Berlin ∙ Offenbach.

关键词： Materials handling equipment

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Additive manufacturing technologies for next-generation powertrains

Additive manufacturing technologies for next-generation powe...

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International Electric Drives Production Conference (EDPC)

作者： Philipp Fiedler Sebastian Stelzer Nikolaus Milaev Robert Richter Frank Kaulfuß Thomas Windisch Jan Bräunig Fraunhofer Institute for Machine Tools and Forming Technology IWU Dresden Germany 3D-Printpetrol Großenhain Germany Fraunhofer Institute for Material and Beam Technology IWS Dresden Germany Division Engineering of Adaptive Systems Fraunhofer IIS/EAS Fraunhofer Institute for Integrated Circuits Dresden Germany

ISBN: (数字)9781728184586

ISBN: (纸本)9781728196145

The paper addresses the prototypical development and implementation of an innovative and functionally integrated gear stage for next-generation electric vehicles, produced by using Laser Beam Melting (LBM) and Fused Deposition Modeling (FDM). Two new design targets are addressed by our approach: Oil-free operation is achieved by innovative coating of gear teeth which enables almost maintenance-free operation. Furthermore, a higher damping of sound transmission from tooth mesh to bearings is implemented by an optimal wheel body geometry that is realized by a combination of printable carbon-containing polymers (flange) and steel (gear rim). The innovative approach is to extend components by areas that cannot be produced by milling and casting, e.g. complex structures, contour-following fluid-carrying cooling elements by means of LBM, thus creating a significant benefit compared to state-of-the-art gearboxes. Function integration made possible by additive manufacturing results in a very high component complexity. It is combined with gear grinding and final ta-C coatings ensuring maximum efficiency in dry operation, to achieve economically viable production processes. The increase in tooth mesh efficiency is achieved by optimization approaches in the design to minimize heat losses while at the same time maintaining highest possible strength and lowest noise emission.

关键词： Gears Wheels Production Three-dimensional printing Laser beams Coatings Next generation networking

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Model-based planning of complex 3D laser scanning campaigns for bridge digitisation

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Automation in Construction 2025年 177卷

作者： Kwasi Nyarko Poku-Agyemang Alexander Reiterer Department of Sustainable Systems Engineering INATECH University of Freiburg Emmy-Noether-Straße 2 Freiburg 79110 Germany Department Object and Shape Detection Fraunhofer Institute for Physical Measurement Techniques IPM Georges-Köhler-Allee 301 Freiburg 79110 Germany

Large, complex structures like bridges are essential infrastructure, expensive to design, construct, monitor, and maintain. The digitisation of bridges has advanced in areas such as structural health monitoring, maintenance, load simulation, and bridge information modelling. 3D laser scanning captures these structures in digital space, and recent advancements have improved the creation of realistic digital twins. These technological improvements necessitate an optimised planning process for scanning campaigns, aiming to maximise coverage efficiently and reduce reliance on subjective human expertise. This paper introduces a model-based approach for planning-for-scanning (P4S), which devises efficient bridge scanning strategies using single or multiple laser scanners. Utilising existing bridge information, such as architectural plans and scanner properties, the algorithm estimates positions and trajectories to capture high-quality point clouds. Tested on the Gaskugel Bridge over the Dreisam River in Freiburg, Germany, the approach demonstrated enhanced data quality and efficiency compared to traditional methods relying on human expertise.

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Production in the loop-the interoperability of digital twins of the product and the production system 14

Production in the loop-the interoperability of digital twins...

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14th CIRP Conference on Intelligent Computation in Manufacturing engineering, CIRP ICME 2020

作者： Vogt, Anna Schmidt, Philipp Heiner Mayer, Sebastian Stark, Rainer Audi AG Auto-Union-Str. 1 Ingolstadt85045 Germany Technical University of Berlin Department of Industrial Information Technology Pascalstraße 8-9 Berlin10587 Germany Volkswagen AG Berliner Ring 2 Wolfsburg38436 Germany Technical University of Kaiserslautern Institute for Virtual Product Engineering Gottlieb-Daimler-Straße 44 Kaiserslautern67663 Germany Technische Hochschule Ingolstadt Institute for Innovative Mobility Esplanade 10 Ingolstadt85049 Germany Fraunhofer Institute for Production Systems and Design Technology IPK Pascalstraße 8-9 Berlin10587 Germany

The Internet of Things (IoT) era facilitates new possibilities at the interface between the lifecycle of the product and the manufacturing disciplines allowing to add value and meet growing legal requirements. This work presents use cases from the automobile industry which are analyzed in order to derive requirements for data exchange. The analysis of the use cases shows clearly that we need to focus on the instance level for this purpose. This means that both, a specific unit of the product and the production system, must be considered. As a solution approach, a communication loop is proposed bringing the Digital Twin concept in a new field of usage. The key aspect of the proposed solution is the direct intercommunication between the Digital Twins of the product being produced as a Cyber-Physical System (CPS) and the production resources as Cyber-Physical Production systems (CPPS). This solution enables the aggregation of production-related data within the products Digital Twin and therefore promotes maximal transparency throughout engineering disciplines, phases of the product lifecycle and the whole supply chain. © 2021 The Authors. Published by Elsevier B.V.

关键词： Cyber Physical System

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Monolithic integration of 940 nm AlGaAs distributed Bragg reflectors on bulk Ge substrates

arXiv

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arXiv 2021年

作者： Zhao, Yunlong Guo, Jia Feifel, Markus Cheng, Hao-Tien Yang, Yun-Cheng Wang, Liming Chrostowski, Lukas Lackner, David Wu, Chao-Hsin Xia, Guangrui Department of Materials Engineering The University of British Columbia VancouverBCV6T 1Z4 Canada Fraunhofer Institute for Solar Energy Systems ISE Heidenhofstraße 2 Freiburg79110 Germany Graduate Institute of Electronics Engineering National Taiwan University Taiwan Graduate Institute of Photonics and Optoelectronics National Taiwan University Taiwan Department of Electrical and Computer Engineering University of British Columbia VancouverBCV6T 1Z4 Canada

High quality 940 nm AlxGa1-xAs n-type distributed Bragg reflectors (DBRs) were successfully monolithically grown on off-cut Ge (100) substrates. The Ge-DBRs have reflectivity spectra comparable to those grown on conventional bulk GaAs substrates and have smooth morphology, reasonable periodicity and uniformity. These results strongly support VCSEL growth and fabrication on more scalable bulk Ge substrates for large scale production of AlGaAs-based VCSELs. © 2021, CC0.

关键词： Substrates

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3D-Reconstruction and Semantic Segmentation of Cystoscopic Images 1

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International Conference on Medical Imaging and Computer-Aided Diagnosis, MICAD 2020

作者： Negassi, M. Parupalli, U. Suarez-Ibarrola, R. Schmitt, A. Hein, S. Miernik, A. Reiterer, A. Department of Sustainable Systems Engineering INATECH University of Freiburg Freiburg Germany Fraunhofer Institute for Physical Measurement Techniques IPM Emmy-Noether-Strasse 2 Freiburg79108 Germany Department of Urology Faculty of Medicine University of Freiburg – Medical Centre Hugstetter Str 55 Freiburg79106 Germany

ISBN: (数字)9789811551994

ISBN: (纸本)9789811551987

Bladder cancer (BCa) is the fourth most common cancer and the eighth most common cause of cancer-related mortality in men. Although roughly 75% of patients are diagnosed with non-muscle invasive bladder cancer (NMIBC), recurrence rates are high even at a low stage and grade. Transurethral resection (TURB) is required for establishing the pathological diagnosis and clinical staging of patients. In daily clinical practice, however, conventional tumor documentation after TURB lacks accuracy, posing a major limitation for patient follow-up and surveillance. Novel technologies to facilitate data documentation and interpretation processes are imperative to maximize patients’ outcomes. As part of the RaVeNNA-4pi initiative, our contribution is twofold: first, we propose a bladder 3D-reconstruction method using Structure-from-Motion (SfM). Second, we propose deep convolutional neural networks (DCNN) for cystoscopic image segmentation to improve the interpretation of cystoscopic findings and localization of tumors. 3D reconstruction of endoscopic images assists physicians in navigating the bladder and monitoring successive resections. Nevertheless, this process is challenging due to an endoscope’s narrow field of view (FoV), illumination conditions and the bladder’s highly dynamic structure. So far in our project, the SfM approach has been tested on a bladder phantom, demonstrating that the processing sequence permits a 3D reconstruction. Subsequently, we will test our approach on bladder images from patients generated in real-time with a rigid cystoscope. In recent years, deep learning (DL) has enabled significant progress in medical image analysis. Accurate localization of structures such as tumors is of particular interest in processing medical images. In this work, we apply a DCNN for multi-class semantic segmentation of cystoscopic images. Moreover, we introduce a new training dataset for evaluating state-of-the-art DL models on cystoscopic images. Our results show that

关键词： Semantic Segmentation

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Electron paramagnetic resonance characterization of aluminum ion implantation-induced defects in 4H-SiC

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Nanotechnology and Precision engineering 2019年第4期2卷 157-162页

作者： Xiuhong Wang Zongwei Xua Mathias Rommel Bing Dong Le Song Clarence Augustine TH Tee Fengzhou Fang State Key Laboratory of Precision Measuring Technology&Instruments Tianjin UniversityTianjin 300072China Fraunhofer Institute for Integrated Systems and Device Technology(IISB) Schottkystrasse 10Erlangen 91058Germany Department of Electrical Engineering Faculty of EngineeringUniversity of MalayaKuala Lumpur 50603Malaysia Centre of Advanced Research Enabler Facility Faculty of EngineeringUniversity of MalayaKuala Lumpur 50603Malaysia

Deep-level defects in silicon carbide(SiC)are critical to the control of the performance of SiC electron *** this paper,deep-level defects in aluminumion-implanted 4H-SiC after high-temperature annealingwere studied using electron paramagnetic resonance(EPR)spectroscopy at temperatures of 77 K and 123 K under different illumination *** showed that the main defect in aluminum ion-implanted 4H-SiC was the positively charged carbon vacancy(VC+),and the higher the doping concentration was,the higher was the concentration of VC+.Itwas found that the type of material defectwas independent of the doping concentration,although more VC+defects were detected during photoexcitation and at lower *** results should be helpful in the fundamental research of p-type 4H-SiC fabrication in accordance with functional device development.

关键词： Electron paramagnetic resonance Silicon carbide Defects Carbon vacancy

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